• 반도체디스플레이기술학회지
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• 제2권3호
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• pp.31-36
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• 2003

On this study, an E.E(End-Effector) for the 300 mm wafer transfer robot system is newly suggested. It is a mechanical type with $180^{\circ}$ rotating ranges and is composed of 3-point arms, two plate springs and single-axis DC motor controlled by microchip. To design, relationship between the gripping force and the wafer deformation is analyzed by FEM. By analytic results, the gripping force for 300 mm wafer is confirmed as 255~274 gf. From experimental results on gripping force, repeatable position accuracy and gripping cycle times in a wafer cleaning system, we confirmed that the suggested E.E was well designed to satisfiy on the required performance for 300 mm wafer transfer robot system.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.161-161
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• 2000

The clean mobile robot for wafer transfer is AGV that carry each wafer to each equipment. It has wafer handling technology, wafer ID recognition technology, position calibration technology using vision system, and anti-vibration technology. Wafer loading/unloading working accuracy is within ${\pm}$1mm, ${\pm}$3$^{\circ}$. By application of this AGV, we can reduce the manufacturing tack time and bring cost down of equipment.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.557-558
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• 2008

• 한국정밀공학회지
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• 제25권9호
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• pp.45-52
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• 2008

As multiple functions arc required in a robot controller, RTOS(Real Time Operating System) should be adopted to manage complex situations, such as choosing most urgent task among competing ones. In this paper, we implemented RTAI(Real Time Application Interface) based robot controller for wafer handling robots including graphic simulator. We showed how multiple tasks are organized and also explained in detail about task priorities and execution periods. Finally, we presented simulation results.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.67-68
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• 2010

• 한국생산제조학회지
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• 제21권4호
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• pp.563-569
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• 2012

In the semiconductor and display device production processes, the handling of sensitive objects needs new carrying technology. Floating carrying motion is a practical alternative solution for non-contact handling of parts and substrates. This paper presents a study of through paths inside the air pressure pick-up head to generate the floating motion. The air motion by conceptual designed paths inside the head gradually develops positive pressure and vacuum between narrow objects. Positive pressure occurs through the head tip before discharging outside of the head. Negative pressure is developed by evacuating the inside head bottom as result of the radial flow connecting the vertical through-holes. The numerical analysis was done to figure out the stable levitation caused by the two acting forces between surfaces. In comparing with the standard case that the levitation gap gets 0.7-0.9 mm, it confirms the suggested head characteristics to show floating capacity in accordance with the head size, number of through-hole, and locations of through-hole in succession of conceptual design for a prototype.

• 로봇학회논문지
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• 제4권3호
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• pp.250-256
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• 2009

Suppressing residual vibrations of flexible materials cheaply is an important issue to increase productivity of automated factory using wafer or glass handling robots. In this paper, we present Linux/RTAI-based implementation of input shaping control for reducing residual vibrations of a mechanical system. Experimental results show that residual vibrations of the mechanical system are reduced up to 82% at a point-to-point linear motion.