• Journal of the Semiconductor & Display Technology
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• v.2 no.3
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• pp.31-36
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• 2003

On this study, an E.E(End-Effector) for the 300 mm wafer transfer robot system is newly suggested. It is a mechanical type with $180^{\circ}$ rotating ranges and is composed of 3-point arms, two plate springs and single-axis DC motor controlled by microchip. To design, relationship between the gripping force and the wafer deformation is analyzed by FEM. By analytic results, the gripping force for 300 mm wafer is confirmed as 255~274 gf. From experimental results on gripping force, repeatable position accuracy and gripping cycle times in a wafer cleaning system, we confirmed that the suggested E.E was well designed to satisfiy on the required performance for 300 mm wafer transfer robot system.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.161-161
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• 2000

The clean mobile robot for wafer transfer is AGV that carry each wafer to each equipment. It has wafer handling technology, wafer ID recognition technology, position calibration technology using vision system, and anti-vibration technology. Wafer loading/unloading working accuracy is within ${\pm}$1mm, ${\pm}$3$^{\circ}$. By application of this AGV, we can reduce the manufacturing tack time and bring cost down of equipment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.557-558
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• 2008

• Journal of the Korean Society for Precision Engineering
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• v.25 no.9
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• pp.45-52
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• 2008

As multiple functions arc required in a robot controller, RTOS(Real Time Operating System) should be adopted to manage complex situations, such as choosing most urgent task among competing ones. In this paper, we implemented RTAI(Real Time Application Interface) based robot controller for wafer handling robots including graphic simulator. We showed how multiple tasks are organized and also explained in detail about task priorities and execution periods. Finally, we presented simulation results.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.67-68
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• 2010

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.4
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• pp.563-569
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• 2012

In the semiconductor and display device production processes, the handling of sensitive objects needs new carrying technology. Floating carrying motion is a practical alternative solution for non-contact handling of parts and substrates. This paper presents a study of through paths inside the air pressure pick-up head to generate the floating motion. The air motion by conceptual designed paths inside the head gradually develops positive pressure and vacuum between narrow objects. Positive pressure occurs through the head tip before discharging outside of the head. Negative pressure is developed by evacuating the inside head bottom as result of the radial flow connecting the vertical through-holes. The numerical analysis was done to figure out the stable levitation caused by the two acting forces between surfaces. In comparing with the standard case that the levitation gap gets 0.7-0.9 mm, it confirms the suggested head characteristics to show floating capacity in accordance with the head size, number of through-hole, and locations of through-hole in succession of conceptual design for a prototype.

• The Journal of Korea Robotics Society
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• v.4 no.3
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• pp.250-256
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• 2009

Suppressing residual vibrations of flexible materials cheaply is an important issue to increase productivity of automated factory using wafer or glass handling robots. In this paper, we present Linux/RTAI-based implementation of input shaping control for reducing residual vibrations of a mechanical system. Experimental results show that residual vibrations of the mechanical system are reduced up to 82% at a point-to-point linear motion.