• Title/Summary/Keyword: Wafer Processing

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The Study on the Wafer Surface and Pad Characteristic for Optimal Condition in Wafer Final Polishing (최적조건 선정을 위한 Pad 특성과 Wafer Final Polishing의 가공표면에 관한 연구)

  • Won, Jong-Koo;Lee, Eun-Sang;Lee, Sang-Gyun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.1
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    • pp.26-32
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    • 2012
  • Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the characteristic of wafer according to processing time, machining speed and pressure which have major influence on the abrasion of Si wafer polishing. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The characteristic of wafer surface according to processing condition is selected to use a result data that measure a pressure, machining speed, and the processing time. This result is appeared by the characteristic of wafer surface in machining condition. Through that, the study cans evaluation a wafer characteristic in variable machining condition. It is important to obtain optimal condition. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.

Optimization for robot operations in cluster tools for concurrent manufacturing of multiple wafer types (복수 타입의 웨이퍼 혼류생산을 위한 클러스터 장비 로봇 운영 최적화)

  • Tae-Sun Yu;Jun-Ho Lee;Sung-Gil Ko
    • Journal of Industrial Technology
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    • v.43 no.1
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    • pp.49-55
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    • 2023
  • Cluster tools are extensively employed in various wafer fabrication processes within the semiconductor manufacturing industry, including photo lithography, etching, and chemical vapor deposition. Contemporary fabrication facilities encounter customer orders with technical specifications that are similar yet slightly varied. Consequently, modern fabrications concurrently manufacture two or three different wafer types using a cluster tool to maximize chamber utilization and streamline the flow of wafer lots between different process stages. In this review, we introduce two methods of concurrent processing of multiple wafer types: 1) concurrent processing of multiple wafer types with different job flows, 2) concurrent processing of multiple wafer types with identical job flows. We describe relevant research trends and achievements and discuss future research directions.

Simulator of Integrated Single-Wafer Processing Tools with Contingency Handling (예외상황 처리를 고려한 반도체 통합제조장비 시뮬레이터)

  • Kim Woo Seok;Jeon Young Ha;Lee Doo Yong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.29 no.1 s.232
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    • pp.96-106
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    • 2005
  • An integrated single-wafer processing tool, composed of multiple single wafer processing modules, transfer robots, and load locks, has complex routing sequences, and often has critical post-processing residency constraints. Scheduling of these tools is an intricate problem, and testing schedulers with actual tools requires too much time and cost. The Single Wafer Processor (SWP) simulator presented in this paper is to validate an on-line scheduler, and evaluate performance of integrated single-wafer processing tools before the scheduler is actually deployed into real systems. The data transfer between the scheduler and the simulator is carried out with TCP/IP communication using messages and files. The developed simulator consists of six modules, i.e., GUI (Graphic User Interface), emulators, execution system, module managers, analyzer, and 3D animator. The overall framework is built using Microsoft Visual C++, and the animator is embodied using OpenGL API (Application Programming Interface).

Optimization of Glass Wafer Dicing Process using Sand Blast (Sand Blast를 이용한 Glass Wafer 절단 가공 최적화)

  • Seo, Won;Koo, Young-Mo;Ko, Jae-Woong;Kim, Gu-Sung
    • Journal of the Korean Ceramic Society
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    • v.46 no.1
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    • pp.30-34
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    • 2009
  • A Sand blasting technology has been used to address via and trench processing of glass wafer of optic semiconductor packaging. Manufactured sand blast that is controlled by blast nozzle and servomotor so that 8" wafer processing may be available. 10mm sq test device manufactured by Dry Film Resist (DFR) pattern process on 8" glass wafer of $500{\mu}m's$ thickness. Based on particle pressure and the wafer transfer speed, etch rate, mask erosion, and vertical trench slope have been analyzed. Perfect 500 um tooling has been performed at 0.3 MPa pressure and 100 rpm wafer speed. It is particle pressure that influence in processing depth and the transfer speed did not influence.

A study on the optimal parameter design of rapid thermal processing to improve wafer temperature uniformity (8인치 웨이퍼의 온도균일도향상을 위한 고속열처리공정기의 최적 파라미터에 설게에 관한 연구)

  • 최성규;최진영;권욱현
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.34D no.10
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    • pp.68-76
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    • 1997
  • In this paper, design parameters of rapid thermal processing(RTP) to minimize the wafer temperature uniformity errors are proposed. Lamp ring positions and the wafer height are important parameters for wafer temperature uniformity in RTP. We propose the method to seek lamp ring positions and the wafer gheight for optimal temperature uniformity. The proposed method is applied to seek optimal lamp ring positions and the wafer feight of 8 inch wafer. To seek the optimal lamp ring positions and the wafer height, we vary lamp ring positions and the wafer height and then formulate the wafer temperature uniformity problem to the linear programming problem. Finally, it is shown that the wafer temperature uniformity in RTP designed by optimal problem. Finally, it is hsown that the wafer temperature uniformity is RTP designed by optimal parameters is improved to comparing with RTP designed by the other method.

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Automated Wafer Separation from the Stacked Array of Solar Cell Silicon Wafers Using Continuous Water Jet

  • Kim, Kyoung-Jin;Kim, Dong-Joo;Kwak, Ho-Sang
    • Journal of the Semiconductor & Display Technology
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    • v.9 no.2
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    • pp.21-25
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    • 2010
  • In response to the industrial needs for automated handling of very thin solar cell wafers, this paper presents the design concept for the individual wafer separation from the stacked wafers by utilizing continuous water jet. The experimental apparatus for automated wafer separation was constructed and it includes the water jet system and the microprocessor controlled wafer stack advancing system. Through a series of tests, the performance of the proposed design is quantified into the success rate of single wafer separation and the rapidity of processing wafer stack. Also, the inclination angle of wafer equipped cartridge and the water jet flowrate are found to be important parameters to be considered for process optimization. The proposed design shows the concept for fast and efficient processing of wafer separation and can be implemented in the automated manufacturing of silicon based solar cell wafers.

The optimal paremeter design of rapid thermal processing to improve wafer temperature uniformity on the semiconductor manufacturing (반도체 공정에서 웨이퍼의 온도균일도향상을 위한 고속열처리공정기의 최적 파라미터 설계)

  • 최성규;최진영;권욱현
    • 제어로봇시스템학회:학술대회논문집
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    • 1997.10a
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    • pp.1508-1511
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    • 1997
  • In this paper, design parameters of Rapid Thermal Processing(RrW) to minimize the wafer tempera ture uniformity errors are proposed. 1,anip ling positions and the wafer height are important parameters for waf er temperature uniformity in R'I'P. We propose the method to seek lamp ling positions and the wafer height for optimal temperature uniformity. l'he ~~roposed method is applied to seek optimal lamp ling positions and the waf er height of 8 inch wafer. 'I'o seek the optimal lamp ling positions and the wafer height, we var\ulcorner. lamp ling 110s itions and the wafer height and then formulate the wafer temperature uniformity problem to the linear programmi ng problem. Finally, it is shown that the wafer temperature uniformity in RI'I' designed by optimal prarneters is improved to comparing with Ii'l'P designed by the other method.

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Control of Wafer Temperature Uniformity in Rapid Thermal Processing using an Optimal Iterative teaming Control Technique (최적 반복 학습 제어기법을 이용한 RTP의 웨이퍼 온도균일제어)

  • 이진호;진인식;이광순;최진훈
    • 제어로봇시스템학회:학술대회논문집
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    • 2000.10a
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    • pp.358-358
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    • 2000
  • An iterative learning control technique based on a linear quadratic optimal criterion is proposed for temperature uniformity control of a silicon wafer in rapid thermal processing.

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