• Journal of the Korean Ceramic Society
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• v.42 no.6 s.277
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• pp.425-431
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• 2005

Line Shaped Solid Oxide Fuel Cell (SOFC) with multilayered structure has been fabricated via direct-writing process. The cell is electrolyte of Ni-YSZ cermet anode, YSZ electrolyte and LSM cathode. They were processed into pastes for the direct writing process. Syringe filled with each electrode and electrolyte paste was loaded into the computer-controlled robe-dispensing machine and the paste was dispensed through cylindrical nozzle of 0.21 mm in diameter under the air pressure of 0.1 tow onto a moving plate with 1.22 mm/s. First of all, the anode paste was dispensed on the PSZ porous substrate, and then the electrolyte paste was dispensed. The anode/electrolyte and the PSZ substrate were co-fired at $1350^{\circ}C$ in air atmosphere for 3 h. The cathode layer was similarly dispensed and sintered at $1200^{\circ}C$ for 1 h. All the electrode/electrolyte lines were visually aligned during the direct writing process. The effective reaction area of fabricated SOFC was $0.03 cm^2$, and the thickness of anode, electrolyte and cathode was 20 $\mu$m, 15 $\mu$m, and 10 $\mu$m, respectively. The single line-shaped SOFC fabricated by direct-writing process exhibited OCV of 0.95 V and maximum power density of $0.35W/cm^2$ at $810^{\circ}C$.

• Progress in Superconductivity and Cryogenics
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• v.6 no.3
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• pp.50-55
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• 2004

We fabricated and tested a resistive type superconducting fault current limiter (SFCL) of three-phase 6.6 $kV_{rms}/200 A_{rms}$ rating based on YBCO thin films grown on sapphire substrates with a diameter of 4 inches, Short circuit tests were carried out at a accredited test facility for single line-to- ground faults, phase-to-phase faults and three-phase faults, Each phase of the SFCL was composed of 8${\times}$6 elements connected in series and parallel respectively. Each element was designed to have the rated voltage of 600 $V_{rms}$. A NiCr shunt resistor of 23 Ω was connected to each element for simultaneous quenches. Firstly, single phase-to-ground fault tests were carried out. The SFCL successfully developed the impedance in the circuit within 0.12 msec after fault and controlled the fault current of 10 $kA_{rms} below 816 A_{peak}$ at the first half cycle. In addition, in case of phase-to-phase fault and three- phase fault test. simultaneous quenches among the SFCLs of the phases successfully accomplished. In conclusion. the SFCL showed excellent performance of current limitation upon fault and stable operation regardless of the amplitude of fault currents.

• Journal of the Korean Society for Heat Treatment
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• v.20 no.6
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• pp.323-328
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• 2007

This study has been investigated the effect of high temperature gas nitriding (HTGN) heat treatment of STS 444 (18Cr-0.01Ni-0.01C-0.2Nb) ferritic stainless steel in an atmosphere of nitrogen gas at the temperature range between $1050^{\circ}C\;and\;1150^{\circ}C$. The surface layer was changed into martensite and austenite with the nitrides of NbCrN by HTGN treatment. Due to the precipitation of nitrides and matrensite formation, the hardness of the surface layer showed $400Hv{\sim}530Hv$. The nitrogen concentration of the surface layer appeared as 0.05%, 0.12% and 0.92%, respectively, at $1050^{\circ}C,\;1100^{\circ}C\;and\;1150^{\circ}C$. When the nitrogen is permeated from surface to interior, Nb and Cr, which have strong affinities with nitrogen, also move from interior to surface. Therefore it is considered that this counter-current of atoms promotes the formation of NbCrN at the surface layer.

• Journal of Soil and Groundwater Environment
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• v.19 no.5
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• pp.26-34
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• 2014

A $1.5m(L){\times}1.0m(W){\times}1.1m(H)$ polypropylene (PP) field scale electroniketic system coupled with stainless steel electrodes was designed to examined metal removal performance applied 0.2-0.35 V/cm potential gradient and 0.05-0.5M lactic acid for 20 day. Electroosmosis permeabilities of $2.2{\times}10^{-5}cm^2/V-s$ to $4.8{\times}10^{-5}cm^2/V-s$ were observed and it increased with the potential gradient increased. The reservoir pH controlled at $7.0{\pm}1.0$ has been effectively diminished the clogging of most metal oxides. The best removal efficiency of Zn, Pb, and Ni was 78.4%, 84.3%, and 40.1%, respectively, in the field scale EK system applied 0.35 V/cm and 0.05M lactic acid for 20 days. Increasing potential gradient would more effectively enhance metal removal than increasing concentration of processing fluid. The reservoir and soil temperatures were majorly related to potential gradient and power consumptio. A $4-16^{\circ}C$ above room temperature was observed in the investigated system. It was found that the temperature increase in soil transported the pore water and metals from bottom to the topsoil. This vertical transport phenomenon is critical for the electrokinetic process to remediate in-situ deep pollution.

• Transactions of Materials Processing
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• v.20 no.2
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• pp.140-145
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• 2011

The aim of the present study is to derive optimized post heat treatment temperatures to get a proper formability for Ti/STS409L/Ti clad materials. These clad materials were fabricated by cold rolling followed by a post heat treatment process for 10 minutes at temperatures ranging from $500^{\circ}C$ to $850^{\circ}C$. The microstructure of the interface was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersive X-ray Analyser(EDX) in order to investigate the effects of post heat treatment on the bonding properties of the Ti/STS409L/Ti clad materials. Diffusion bonding was observed at the interfaces with a diffusion layer thickness increasing with the post heat treatment temperature. The diffusion layer was composed of a type of(${\varepsilon}+{\zeta}$) intermetallic compound containing additional elements, namely, Fe, Ti and Ni. The micro Knoop hardness of the Ti/STS409L interfaces was found to increase with heat treatment up to $800^{\circ}C$ and then decrease for temperatures rising up to $850^{\circ}C$. The tensile strength was shown to decrease for heat treatment temperature increasing to $750^{\circ}C$ and then increase rapidly for temperature rising up to $850^{\circ}C$. A post heat treatment temperature range of $700{\sim}750^{\circ}C$ was found to optimize the formability of Ti/STS409L/Ti clad materials.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.20.1-20.1
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• 2011

The nano-sized quantum structure has been an attractive candidate for investigations of the fundamental physical properties and potential applications of next-generation electronic devices. Metal nano-particles form deep quantum wells between control and tunnel oxides due to a difference in work functions. The charge storage capacity of nanoparticles has led to their use in the development of nano-floating gate memory (NFGM) devices. When compared with conventional floating gate memory devices, NFGM devices offer a number of advantages that have attracted a great deal of attention: a greater inherent scalability, better endurance, a faster write/erase speed, and more processes that are compatible with conventional silicon processes. To improve the performance of NFGM, metal nanocrystals such as Au, Ag, Ni Pt, and W have been proposed due to superior density, a strong coupling with the conduction channel, a wide range of work function selectivity, and a small energy perturbation. In the present study, bismuth metal nanocrystals were self-assembled within high-k $Bi_2Mg_{2/3}Nb_{4/3}O_7$ (BMN) films grown at room temperature in Ar ambient via radio-frequency magnetron sputtering. The work function of the bismuth metal nanocrystals (4.34 eV) was important for nanocrystal-based nonvolatile memory (NVM) applications. If transparent NFGM devices can be integrated with transparent solar cells, non-volatile memory fields will open a new platform for flexible electron devices.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.4
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• pp.409-416
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• 2012

Recently, surface modification technology is of importance to improve the wear resistance and the corrosive resistance for high accurate mechanical parts such as LM guide, Ball Screw and Roller Bearing etc., Those has generally featured on rolling contact mechanism to improve not only the wear and the friction, but also the accuracy and the corrosion performances. For surface modifications of high accurate mechanical parts, normally thermal spray, PVD, CVD and E.P. processes have been used with many materials such as DLC, raydent, W, Ni, Ti etc. Diamondlike carbon (DLC) films possess a combination of attractive properties and have been largely employed to modify the tribological behaviors such as friction, wear, corrosion, fretting fatigue, biocompatibility, etc. However, for rolling contact mechanism mechanical parts DLC films are needed to study for commercial benefit. Rolling contact mechanism has features on effects of cyclic motions and stresses, and also not simply sliding motions. The papers focused on the performance test of wear and corrosive resistance according to Me-DLC film thickness. And also, its thickness effect of wear analysis was carried out through the simulation of the maximum shear stress under the rolling contact surface. As the results, Me-DLC films have more potential to improve the wear resistance for high precision mechanical parts than raydent films.

• Proceedings of the KSRS Conference
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• v.1
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• pp.21-24
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• 2006

Processes controlling the interannual variation of mixed layer temperature (MLT) averaged over the NINO3 domain ($150-90^{\circ}W$, $5^{\circ}N-5^{\circ}S$) are studied using an ocean data assimilation product that covers the period of 1993 to 2003. Advective tendencies are estimated here as the temperature fluxes through the domain's boundaries, with the boundary temperature referenced to the domain-averaged temperature to remove the dependence on temperature scale. The overall balance is such that surface heat flux opposes the MLT change but horizontal advection and subsurface processes assist the change. The zonal advective tendency is caused primarily by large-scale advection of warm-pool water through the western boundary of the domain. The meridional advective tendency is contributed mostly by Ekman current advecting large-scale temperature anomalies though the southern boundary of the domain. Unlike many previous studies, we explicitly evaluate the subsurface processes that consist of vertical mixing and entrainment. In particular, a rigorous method to estimate entrainment allows an exact budget closure. The vertical mixing across the mixed layer (ML) base has a contribution in phase with the MLT change. The entrainment tendency due to temporal change in ML depth is negligible comparing to other subsurface processes. The entrainment tendency by vertical advection across the ML base is dominated by large-scale changes in wind-driven upwelling and temperature of upwelling water. Tropical instability waves (TIWs) result in smaller-scale vertical advection that warms the domain during La Ni? cooling events. When the advective tendencies are evaluated by spatially averaging the conventional local advective tendencies of temperature, the apparent effects of currents with spatial scales smaller than the domain (such as TIWs) become very important as they redistribute heat within the NINO3 domain. However, such internal redistribution of heat does not represent external processes that control the domain-averaged MLT.

• Journal of Magnetics
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• v.13 no.2
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• pp.37-42
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• 2008

In this paper, design parameters of high Q (> 50), high current inductor for on-chip power module were optimized by 4 Xs 3 Ys DOE (Design of Experiment). Coil spacing, coil thickness, ferrite thickness, and permeability were assigned to Xs, and inductance (L) and Q factor at 10 MHz, and resonance frequency ($f_r$) were determined Ys. Effects of each X on the Ys were demonstrated and explained using known inductor theory. Multiple response optimizations were accomplished by three derived regression equations on the Ys. As a result, L of 125 nH, Q factor of 197.5, and $f_r$ of 316.3 MHz were obtained with coil space of $127\;{\mu}m$, Cu thickness of $67.8\;{\mu}m$, ferrite thickness of $130.3\;{\mu}m$, and permeability 156.5. Loss tan ${\delta}=0$ was assumed for the estimation. Accordingly, Q factor of about 60 is expected at tan ${\delta}=0.02$.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.