• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.49-49
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• 2011

본 연구에서는 Fe계 합금전주도금 미세부품 및 금형 제조에 사용되는 전주용 Fe계 합금도금 기술을 개발을 위해 Fe-Ni 및 Fe-Ni-W 합금 전기도금에 대한 속도론적 고찰을 통해 Fe-Ni 합금도금층 내의 Fe과 Ni, Fe-Ni-W 합금 도금층 내의 Fe, Ni, W 성분 함유량에 대한 각각의 공정 제어인자를 규명하였다. Fe-Ni합금과 Fe-Ni-W합금도금층 구현에 있어 합금도금액의 합성, 최적 전류밀도 범위 도출, 합금도금층의 표면거칠기 및 경도 확보를 위한 공정조건 확립 등을 수행하였고, 전주(electroforming)를 이용하여 마이크로 기어 및 금형을 제조하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.81-81
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• 2018

Bi-Te계 열전소자는 상온에서의 열전 효율이 우수하기 때문에 항공, 컴퓨터 등의 열전발전 또는 열전냉각 모듈에 널리 사용된다. 이 열전소자를 활용한 열전모듈은 다수의 n형 및 p형 열전소자가 세라믹 위에 형성된 Cu 전극에 전기적으로 직렬이 되도록 서로 솔더링 접합이 되어 있는 구조를 가지고 있다. 이처럼 직렬 연결된 방식에서는 높은 접합강도를 필요로 한다. 열전모듈 제작 시 Bi-Te 계 소자를 바로 Cu 기판에 접합시키면 솔더에 들어있는 Sn과 기판의 Cu가 접합하는 과정에서 소재 내로 확산하여 접합강도를 저하시킨다. 이러한 열전모듈의 접합강도 저하를 막기 위해 무전해 Ni-W-P 도금층을 확산 방지층으로 적용하였다. 본 연구에서는 Ni-W-P 도금이 Bi-Te 계 열전 모듈의 접합강도에 미치는 영향을 조사하였다. 본 연구에서는 Bi-Te계 열전소자에 양호한 밀착성을 가지는 Ni-W-P 도금층을 형성시키기 위해서 알루미나 분말을 이용한 sand-blasting 방법을 사용하여 Bi-Te 소재 표면에 분사하는 방법으로 표면을 거칠게 하였다. 그 후 무전해 Ni-W-P 도금을 $85^{\circ}C$에서 20분간 실시하여 약 4um의 Ni-W-P 도금층을 형성시켰다. 열전 모듈은 Sn-Ag-Cu 솔더를 사용하여 제작하였으며 접합강도는 Bonding tester를 사용하여 측정하였다. 제작한 열전 모듈의 단면 및 파단면 관찰을 통하여 접합강도가 변하는 요인을 조사하였다. 제작한 열전 모듈의 단면을 FE-EPMA로 관찰한 결과 Ni-W-P 도금층이 Bi-Te 소자와 Sn과 Cu사이의 확산을 방지하는 확산방지층 역할을 하는 것을 관찰할 수 있었다. 또한 열처리 전 열전모듈과 200도, 150시간 열처리 후 접합강도를 각각 측정해 본 결과, 열처리 후의 접합강도가 상승하는 것을 확인 할 수 있었다. 따라서 Bi-Te계 열전모듈 제작에 무전해 Ni-W-P 도금층을 형성시키므로 인해 확산방지층의 생성과 접합강도의 상승에 도움을 주었다.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2003.04a
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• pp.14-15
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• 2003

• Korean Journal of Materials Research
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• v.13 no.10
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• pp.640-644
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• 2003

NiCr thin films were fabricated by rf magnetron sputtering for applying to both the top electrode and absorption layer on Pb(Zr, Ti)O$_3$(PZT) thin films for infrared sensors. The rms roughness and resistivity of NiCr films prepared with Ni power of 80 W and Cr power of 50 W showed the most stable oxidation resistance after annealing at $600^{\circ}C$ for 5 min in oxygen ambient. The rms roughness and resistivity of NiCr films annealed at $V^{\circ}C$ in oxygen ambient were about 2$0\AA$ and $70 \mu$Ω-cm, respectively. As-deposited Ni/PZT/Pt and NiCr (Ni 80 W, Cr 50 W)/PZT/Pt structures showed well saturated hysteresis loops. However, in case of the samples annealed at $500^{\circ}C$ in oxygen ambient, only NiCr/PZT/Pt showed saturated loops having a remanent polarization of 20$\mu$C/$\textrm{cm}^2$. Ultra-thin NiCr films showed a possibility as a top electrode for infrared sensors.

• Journal of Powder Materials
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• v.15 no.3
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• pp.239-243
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• 2008

Ni-W(1-5 at.%) alloy rods were made by powder metallurgy process including powder mixing, compacting and subsequent sintering. Ni and W powder of appropriate compositions were mixed by a ball milling and isostatically pressed in a rubber mold into a rod. The compacted rods were sintered at $1000^{\circ}C-1150^{\circ}C$ at a reduced atmosphere for densification. The lattice parameters of Ni-W alloys were estimated by a high resolution neutron powder diffractometer. All sintered rods were found to have a face centered cubic structure without any impurity phase, but the diffraction peak locations were linearly shifted with increasing W content. The lattice parameter of a pure Ni rod was $3.5238{\AA}$ which is consistent with the value reported in JCPDS data. The lattice parameter of N-W alloy rods increased by $0.004{\AA}$ for 1 atomic % of W, which indicates the formation of a Ni-W solid solution due to the substitution of nickel atoms by tungsten atoms of larger size.

• Journal of Powder Materials
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• v.5 no.1
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• pp.42-49
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• 1998

A study on the improvement of the impact energy in 93W heavy alloy with a Ni/Fe ratio of 9/1 has been carried out as a function of heat treatment temperature. The obtained results were compared to that of the traditional alloy system in which the Ni/Fe ratio is 7/3 or 8/2. With increasing heat treatment temperature from 1150 to 125$0^{\circ}C$, the impact energy of the alloy with the Ni/Fe ratio of 9/1 is remarkably increased from 42 to 72 J, which is higher than that of traditional alloy, up to 118$0^{\circ}C$ and then saturated. Fracture mode was also changed from brittle W/W boundary failure to W cleavage. The temperature showing the dramatic shrinkage by dilatometric anaysis of the heavy alloy with Ni/Fe ratio of 9/1 was found to be 1483 $^{\circ}C$, which is higher than that (146$0^{\circ}C$) of the heavy alloy with Ni/Fe ratio of 7/3. Auger Electron Spectroscopy showed that the segregation of impurities, such as S, P, and C in W/W grain boundary was considerably decreased with increasing heat treatment temperature from 1150 to l18$0^{\circ}C$. From the above results, it was found that the impurity segregation in W/W grain boundary played an important role on the decrease of impact properties, and the heat treatment temperature should be appropriately chosen, as considering the Ni/Fe ratio of the alloy, in order to get good impact properties.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.47-53
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• 2002

In this study, two different (NiCuZn)-ferrite which were fabricated by using ultra-fine powders synthesized by the wet processing and conventionally commercialized powder, were investigated and compared each other in terms of the low temperature sintering and electromagnetic properties. Composition of x and w in $(Ni_{0.4-x}Cu_xZn_{0.6})_{1+w}(Fe_2O_4)_{1-w}$ were controlled as 0.2 and 0.03, respectively. The sintering temperature were $900^{\circ}C$ for ultra-fine powders by way of initial heat treatment and $1150^{\circ}C$ for commercialized powders. The (NiCuZn)-ferrite by ultra-fine powders showed love. sintering temperature than that of commercialized powders by over $200^{\circ}C$, and excellent electromagnetic properties such as the quality factor which is a important factor in the multi-layered chip inductor. In addition, characteristics of B-H hysteresis, crystallinity, microstructure and powder morphology were analyzed by a vibrating sample method(VSM), x-ray diffractometer(XRD), transmission electron microscope (TEM) and scanning electron microscope(SEM).

• Journal of Powder Materials
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• v.14 no.1 s.60
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• pp.13-18
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• 2007

The mother Ni-W (1-5 wt.%) alloy billets for coated conductor substrate were fabricated by powder metallurgy process. The tensile test results for the sintered Ni-W rods showed the increase of mechanical strength and decrease of ductility with increasing W content due to the solid solution hardening. All the fracture surfaces of the tested specimens showed the typical ductile fracture mode of dimple rupture due to the local necking. The Ni-W alloy billets were made into tape by cold rolling. After the appropriate heat treatment for recrystallization, the brass texture formed by the cold rolling was converted to the complete cube texture. The in-plane and out of plane texture of the tapes estimated by x-ray pole figure were smaller than 9 degree and 7 degree, respectively. The effect of the W addition on the texture development seems not to be significant.

• Journal of the Korean institute of surface engineering
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• v.36 no.6
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• pp.430-436
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• 2003

The nanoocrystalline Ni-l5W(at.%) coating electrodeposited on the high carbon steel was oxidized at 700 and $800^{\circ}C$ in air, and the resultant oxidation properties were investigated using XRD, EPMA, TGA and TEM. The oxidation resistance of the coating was not so good that most of the coating was oxidized after oxidation at $800^{\circ}C$ for 5 hrs. The oxidation led to the formation of the outer, thin NiO oxide scale and the inner, porous, rather thick ($NiWO_4$＋NiO) mixed layer containing a bit of $WO_2$. During oxidation, substrate elements such as Fe and Cr diffused outwardly toward the coating, according to the concentration gradient.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1988.10a
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• pp.64-66
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• 1988

The present investigation has been performed on the manufacturing process of Ni-P doped W-Cu electric contacts by infiltration techniques. The addition of small amount of Ni-P alloy aimed at forming a rigid and homogeneous skeleton structure of W-powders which favours subsequent infiltration process of Cu-melts. The experimental results revealed that the small addition of Ni-P alloy appreciably enhances the sintering process of W at low temperatures (even at 1000$^{\circ}C$), simultaneously causing a considerable change of skeleton Morphology and its related best infiltration behaviour of Cu-melts.