• Title/Summary/Keyword: W-Ni

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Synthesis of Graphene on Ni/SiO2/Si Substrate by Inductively-Coupled Plasma-Enhanced Chemical Vapor Deposition (유도결합 플라즈마 화학기상증착법을 이용한 Ni/SiO2/Si 기판에서 그라핀 제조)

  • Park, Young-Soo;Huh, Hoon-Hoe;Kim, Eui-Tae
    • Korean Journal of Materials Research
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    • v.19 no.10
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    • pp.522-526
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    • 2009
  • Graphene has been effectively synthesized on Ni/SiO$_2$/Si substrates with CH$_4$ (1 SCCM) diluted in Ar/H$_2$(10%) (99 SCCM) by using an inductively-coupled plasma-enhanced chemical vapor deposition. Graphene was formed on the entire surface of the 500 nm thick Ni substrate even at 700 $^{\circ}C$, although CH$_4$ and Ar/H$_2$ gas were supplied under plasma of 600 W for 1 second. The Raman spectrum showed typical graphene features with D, G, and 2D peaks at 1356, 1584, and 2710 cm$^{-1}$, respectively. With increase of growth temperature to 900 $^{\circ}C$, the ratios of the D band intensity to the G band intensity and the 2D band intensity to the G band intensity were increased and decreased, respectively. The results were strongly correlated to a rougher and coarser Ni surface due to the enhanced recrystallization process at higher temperatures. In contrast, highquality graphene was synthesized at 1000 $^{\circ}C$ on smooth and large Ni grains, which were formed by decreasing Ni deposition thickness to 300 nm.

Phase Transformation and Reversible Shape Memory Effect of Ti-Ni-Cu Alloys (Ti-Ni-Cu 합금의 상변태 및 가역형상기억효과)

  • Hong, S.W.;Lee, O.Y.;Kim, D.K.
    • Journal of the Korean Society for Heat Treatment
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    • v.5 no.3
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    • pp.149-156
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    • 1992
  • Transformation behavior and reversible shape memory effct of Ti-Ni-Cu alloys with various Cu content has been investigated by means of electrical resistivity measurement, differential scanning calorimetry. X-ray diffraction and strain gage sensor. The transformation sequence in Ti-Ni-Cu alloys substituted by Cu for Ni up to 5at.% occurs to $B2{\leftrightarrow}B19^{\prime}$ and it proceeds in two stages by addition of 10 at.%Cu. i.e. $B2{\leftrightarrow}B19{\leftrightarrow}B19^{\prime}$. But the content of Cu increases up to 20at.%, it has been transformed in one stage ; $B2{\leftrightarrow}B19$. The shape change of Ti-40Ni-10Cu alloy which was constrain aged in circular form bended in $B2{\leftrightarrow}B19$ transformation but it spreaded out in $B19{\leftrightarrow}B19^{\prime}$ transformation. The amount of reversible shape change (${\Delta}{\varepsilon}$) of Ti-47Ni-3Cu alloy constrain aged at $400^{\circ}C$ after solution treatment has a maximum value of about $5.6{\times}10^{-3}$, but that of cold rolled and constrain aged specimens exhibits a little value independent of Cu concentrations.

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Low Temperature lateral Crystallization of Amorphous Silicon Films Induced by Ni and Pd. (Ni과 Pd을 이용한 비정질 실리콘의 저온 측면 결정화에 관한 연구)

  • Lee, Byeong-Il;Kim, Gwang-Ho;Jeong, Won-Cheol;Sin, Jin-Uk;An, Pyeong-Su;Ju, Seung-Gi
    • Korean Journal of Materials Research
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    • v.6 no.9
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    • pp.900-904
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    • 1996
  • 비정질 실리콘의 표면에 Ni과 Pd를 형성하여 측면으로의 결정화 속도를 향상시켰다. Ni에 의해 비정질 실리콘이 측면으로 결정화될 때 그 성장 속도는 50$0^{\circ}C$에서 3w$\mu\textrm{m}$/hour였으며 이때의 활성화 에너지는 2.87eV로 나타났다. Pd의 경우는 Pd2Si의 형성에 의해 압축 응력이 유발되어 Pdrks의 간격이 좁을수록 측면으로의 결정화 속도가 증가하였다. Ni과 Pd을 각각 다른 부분에 증착시키고 결정화시키면 Ni에 의해 측면으로 결정화되는 속도가 Ni만으로 결정화시킬 때 보다 약 2배 이상의 측면결정화 속도를 보였다.

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Effect of Aging Treatment Temperature on Surface Modifications in Ni-Ti alloy (Ni-Ti합금의 표면개질에 미치는 시효처리 온도의 영향)

  • Park, J.M.;Kim, W.C.
    • Journal of the Korean Society for Heat Treatment
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    • v.22 no.6
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    • pp.368-374
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    • 2009
  • Nickel titanium shape memory alloys (NiTi) have been investigated for applications in the biomedical industry. However, little is known about the influences of surface modifications on the propertise of these alloys. The effect of electropolishing and heat treatments was found to exhibit significant surface roughness. Change of phase was B2, r-phase and B19' by heat treatments. In this study, effect of the electropolishing conditions on surface roughness is investigated in Ni-Ti alloys (Nitinol). Variation in phases with heat treatment temperature is investigated for a Ni-Ti alloy by X-ray diffraction and DSC. Characteristic of the microstructure have been observed by SEM. Surface roughness have been measured by AFM. The results clearly show that significant different in surface property to heat treated at $500^{\circ}C$ (R-phase). $TiO_2$ phases preciritated all of the specimens. It is not good effect of surface roughness because made to surface relief. The surface roughness appears to be important in the property of Ni-Ti alloys for biomedical applications.

Fundamental Study on Ni-Base Self-Fluxing Alloy Coating by Thermal Spraying(I) - Effect of Splat Behavior of Sprayed Particles on Mechanical Properties of Coating Layer - (Ni-기 자융성합금의 코팅에 관한 기초적 연구(I) - 용사입자의 편평거동이 코팅층의 기계적 특성에 미치는 영향 -)

  • Kim, Y.S.;Kim, H.S.;Nam, K.W.
    • Journal of Power System Engineering
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    • v.1 no.1
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    • pp.70-79
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    • 1997
  • Ni-base self-fluxing alloy powder particles were flame sprayed onto the SS400 mild steel substrate surface. The effects of both substrate temperature and spraying distance on the splat behavior of sprayed particles were examined. The results obtained are summarized as follows: 1) In the splat behavior of Ni-base self-fulxing alloy particles sprayed onto the SS400 mild steel substrate, splashing was observed under the room temperature condition. On the contrary, it showed circular plate pattern in the substrate temperature range over 373K. 2) It was cleared that there was close relationship between mechanical properties of coating layer and splat behavior of sprayed particles. 3) From the experimental results, optimum spraying conditions showed excellent mechanical properties in the case of Ni-base self fluxing alloy sprayed onto the SS400 mild substrate were 473K of substrate temperature and 250mm of spraying distance.

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Characteristics of PECVD-W thin films deposited on $Si_3N_4$ ($Si_3N_4$상에 PECVD법으로 형성한 텅스텐 박막의 특성)

  • 이찬용;배성찬;최시영
    • Journal of the Korean Vacuum Society
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    • v.7 no.2
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    • pp.141-149
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    • 1998
  • The W thin films were deposited on Si3N4 by a PECVD technique. The effects of substrate temperature and gas flow ratio on the properties of the W films were investigated. The deposition of W films were limited by surface reaction at the temperature range of 150>~$250^{\circ}C$, W films had the deposition rate of 150~530 $\AA$/min and stress of 0.85~$14.35\times10 ^9 \textrm {dynes/cm}^2}$ at various substrate temperatures and $SiH_4/WF_6$ flow ratios. $SiH_4/WF_6$ flow ratio affected the deposition rate and stress of the W films, expecially, excessive flow of SiH4 abruptly changed the structure, chemical bonding, and stress of the W films. Among the deposited W films on TiN, Ti, Mo, NiCr and Al adhesion layer, the one on the Al had the best adhesion property.

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