• Korean Journal of Materials Research
• /
• v.14 no.4
• /
• pp.281-286
• /
• 2004

The oxide scales formed on Ni-18W(at.%) coating that was electrodeposited on steel were investigated using XRD, SEM and TEM. The oxide scales consisted mainly of an outer NiO layer, and an inner thick ($NiWO_4$+NiO) mixed layer. The unoxidized coating below the oxide scale was rich in Ni and depleted in W, owing to the consumption of Wand the resultant Ni enrichment. The oxidation resistance of Ni-18W coating was poorer than that of the TiN coating, due to the formation of nonprotective NiWO$_4$. During oxidation, Ni and the substrate element of Fe diffused outward, while oxygen inward, according to the concentration gradients.

• Journal of the Semiconductor & Display Technology
• /
• v.6 no.2 s.19
• /
• pp.25-28
• /
• 2007

Electroless Ni-P coating is widely used for chemical, electronic, and semiconductor equipment parts because of its corrosion resistance. The incorporation of chemically-inert PTFE particles into the Ni-P films improves properties such as, non-stick, anti-adhesive and better corrosion resistance. However, soft PTFE particles degrade the hardness, wear and abrasion resistance. In this study, effects of PTFE and W addition to the Ni-P-coatings were compared by the XRD, SEM, sheet resistance, contact angle, and microhardness measurements. The change in sheet resistance was negligible, but contact angle was doubled by the addition of PTFE and W. The microhardness was lower for Ni-P-PTFE, but higher for Ni-P-PTFE-W coatings, compared to that of Ni-P coatings.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.1
• /
• pp.25-31
• /
• 2010

In this study, we investigated the morphology and thermal stability of interfacial phases in joint between lead free solder(Sn-3.0Ag-0.5Cu) and electroless Ni-W-P under bump metallizations(UBM) with different tungsten contents as a function of thermal aging. Content of phosphorus of each deposits was fixed at 8 wt.%, and content of tungsten was variated each 0, 3, 6 and 9 wt.%. Specimens were prepared by reflowing at $255^{\circ}C$, aging range was $200^{\circ}C$ and up to 2 weeks. After reflow process, in the electroless Ni(W)-P/solder joint, the interfacial intermetallic compound(IMC) was showed both $(Cu,Ni)_6Sn_5$ and $(Ni,Cu)_3Sn_4$. UBM and generated IMC at the interface of lead free solder was proportionally increased with aging time. The thickness of IMC was increased because the generation rate of $Ni(W)_3P$ decreased with increasing contents of W.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.11a
• /
• pp.28-29
• /
• 2006

The magnetic properties of a series of both annealed and as-rolled Ni-$W_y$ alloy tapes with compositions y = 0, 1, 3, and 5 at.%, were studied. To compare with Ni-W alloys, the magnetic properties of a series of both annealed and as-rolled $[Ni_{97at.%}W_{3at.%}]_{100-x}Cu_x$ alloy tapes with compositions x = 0, 1, 3, 5 and 7 at.%, were studied, as well. Both the isothermal mass magnetization M(H) of a series of samples, such as both Ni-W and [Ni-W]-Cu alloy tapes, at different fixed temperatures and M(T) in fixed field, were measured using a PPMS-9 (Quantum Design). The degree of ferromagnetism of Ni-$W_y$ alloys have reduced as W-content y increases. Both the saturation magnetization $M_{sat}$ and Curie temperature $T_c$ decrease linearly with W-content y, and both $M_{sat}$ and $T_c$ go to zero at critical concentration of $y_c$ ~ 9.50 at.% W. The effect of Cu addition on both the saturation magnetization $M_sat$ and Curie temperature $T_c$ decrease linearly with Cu-content x in $[Ni_{97at.%}W_{3at.%}]_{100-x}Cu_x$ alloy tapes with compositions x = 0, 1, 3, 5, and 7 at.%. The results confirm that [Ni-W]-Cu alloy tapes can have much reduced ferromagnetism as Cu-content x increases.

• Korean Journal of Materials Research
• /
• v.12 no.1
• /
• pp.16-20
• /
• 2002

In this study, the 95W heavy alloys of 3/7, 5/5 and 7/3 of Ni/Fe ratio were sintered at the temperature range between 1420 and $1480^{\circ}C$ for 1h and their microstructures were discussed for an effect of the ${\mu}$-phase $(Fe_7W_6)$ on the microstructure. The ${\mu}$-phase was observed in the only 95W-1.5Ni-3.5Fe alloy of 3/7 and it is thought to be formed and grown from the surface of the W particle. The W particle was surrounded with the ${\mu}$-phase and there were only the W particles and this phase without Ni-Fe-W matrix at the most part. The ${\mu}$-phase changed the interphase structure in the alloy and the grain growth of the W was suppressed because of interrupting the solution-reprecipitation of the W. The W content in the matrix was considered to be lowered due to the interruption of the solution-reprecipitation and the formation of the ${\mu}$-phase in the .

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2010.06a
• /
• pp.370-370
• /
• 2010

The effects of adding higher-valence impurities on the bipolar resistive switching characteristics of Pt/$NiO_{1+x}$/TiN MIM stacks and physical properties were investigated. $NiO_{1+x}$ films with 14% W deposited at 20% oxygen partial pressure exhibited the bipolar resistance switching characteristics in Pt/$NiO_{1+x}$/TiN MIM stacks, while $NiO_{1+x}$ films with 8.2% W show unipolar resistance switching behavior. The relationship of W-doping and the crystallinity was studied by X-ray diffraction. The metallic Ni contents and $WO_x$ binding states with W amount was investigated by XPS. Our result showed that the metallic Ni, $WO_x$ binding states, and crystallinity in $NiO_{1+x}$ played an important role on the bipolar resistive switching.

• Korean Journal of Metals and Materials
• /
• v.49 no.9
• /
• pp.720-725
• /
• 2011

W-Ni-Fe heavy alloys have been used in various fields, such as kinetic energy penetrators and radiation shielding materials, due to their high density and good mechanical properties. In this study, the sintering of W-Ni-Fe alloys with various Ni/Fe ratios was demonstrated to improve the mechanical properties and penetration capabilities of heavy alloys by formation of interfacial phase. The microstructural changes and the mechanical properties of the W-Ni-Fe alloys after liquid-phase sintering were investigated. The Vickers hardness and tensile strength of the 95W1.3Ni3.7Fe sample, which had coated W grains by $Fe_7W_6$ phase (${\mu}$-phase), were 450 Hv and 1560 MPa, respectively. As a result, enhancement of the mechanical properties was considered to have uniformly generated ${\mu}$-phase around W grains.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2013.05a
• /
• pp.59-59
• /
• 2013

Ni-P 도금 피막층에 W를 함유시켜 고내식성을 목적으로 하는 Ni-W-P 도금에 대하여 연구 하였다. 도금액 조건의 최적화 및 도금온도와 pH 등이 가 피막특성에 미치는 영향을 조사하여 피막 크랙이 발생하지 않고 내식성 및 내마모성이 우수한 무전해 Ni-W-P 도금 공정을 확립하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2012.05a
• /
• pp.305-305
• /
• 2012

Ni-W 합금의 고경도 특성을 연구하기 위하여 전해 도금 방법을 이용하여 Ni-W 합금을 제작하였다. 전해 도금시 여러 가지 제어인자 중 전류밀도, pH, Ni 금속염의 양 그리고 도금욕의 온도 등을 변수로 하여 실험을 하였다. 도금층 내 Ni과W의 함량 조성비를 EDS를 이용하여 분석하였으며, 각각의 변수에 따른 Ni-W 합금의 결정구조를 XRD를 이용하여 측정하였다. Ni-W 합금 도금층내 성분 조성비 및 결정구조에 따른 경도를 비커스 경도계를 이용하여 측정하였다.

• Progress in Superconductivity
• /
• v.7 no.1
• /
• pp.64-68
• /
• 2005

We fabricated Ni-based alloy substrates for YBCO coated conductor using powder metallurgy. Tungsten and copper were selected as alloy elements due to their mutual solubility to the base element of nickel. The alloying elements were mixed with nickel using ball milling and dried in air. The powder mixtures were packed in a rubber mold, cold isostatic pressed 200 MPa and made into rods. The compacted rods were sintered at $1150^{\circ}C$ for 6 hours for densification. It was confirmed by neutron diffraction experiment that W and Cu atoms made complete solid solution with Ni. Lattice constant of nickel alloy increased by $0.004{\AA}$ for 1at. $\%$ W in Ni-W alloy, $0.0006{\AA}$ for 1 at. $\%$ Cu in Ni-W-Cu alloy.