• 한국전자파학회논문지
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• 제30권1호
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• pp.8-11
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• 2019

본 논문에서는 Wolfspeed사(社)의 CGHV1J070D GaN HEMT를 사용하여 Ku-대역에서 동작하는 50 W급 내부 정합 전력증폭기를 설계하고 제작하였다. 전력 트랜지스터를 구성하는 단위 트랜지스터 셀의 출력 신호 간 크기와 위상을 맞추기 위해 슬릿과 비대칭 T-junction을 입출력 정합회로에 사용하였다. 비유전율이 40과 9.8인 두 종류의 박막 기판을 사용하여 제작된 내부 정합 전력증폭기는 펄스 주기 $330{\mu}s$, 듀티 6 %의 펄스 모드 조건에서 전력 성능이 측정되었으며, 16.2~16.8 GHz에서 50~73 W의 포화 출력 전력과 35.4~46.4 %의 드레인 효율, 4.5~6.5 dB의 전력 이득을 보였다.

• 한국진공학회지
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• 제14권3호
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• pp.153-158
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• 2005

순간 증착법으로 제조한 n형 $Bi_2Te_{2.4}Se_{0.6}$ 박막에 대하여 유효 평균 자유 행로 모델을 적용하여 박막의 두께가 열전 특성에 영향을 미치지 않는 임계 두께를 구하였다. 또한 열처리 전후 전자 농도 및 이동도의 변화를 조사하여 열처리에 의한 열전 특성의 변화를 역구조 결함과 관련하여 설명하였다. Seebeck 계수와 전기 비저항 모두 두레의 역수와 직선적인 관계를 보였으며, 이로부터 구한 평균 자유 행로는 $5120\AA$이었다. 열처리에 의해 전자의 이동도가 증가하였지만, 역구조 결함의 감소로 인해 운반자의 전자 농도가 현저히 감소하여, 결국 전기전도도가 감소하고 Seebeck 계수가 증가하였다 473k에서 1시간 동안 열처리한 Seebeck 계수와 전기전도도는 각각 $-200\;\mu V/k$와 $510\omega^{-1}cm^{-1}$이었다 또한, 열처리에 의해 열전 성능 인자가 상당히 향상되어 $20\times10^{-4}\;W/(mK^2)$를 나타내었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.67-67
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• 2009

Due to the scaling down of the dielectrics thickness, the leakage currents arising from electron tunneling through the dielectrics has become the major technical barrier. Thus, much works has focused on the development of high k dielectrics in both cases of memories and CMOS fields. Among the high-k materials, $Al_2O_3$ considered as good candidate has been attracting much attentions, which own some good properties as high dielectric constant k value (~9), a high bandgap (~2eV) and elevated crystallization temperature, etc. Due to the easy control of ion energy and flux, low ownership and simple structure of the inductively coupled plasma (ICP), we chose it for high-density plasma in our study. And the $BCl_3$ was included in the gas due to the effective extraction of oxygen in the form of BClxOy compound. In this study, the etch characteristic of ALD deposited $Al_2O_3$ thin film was investigated in $BCl_3/N_2$ plasma. The experiment were performed by comparing etch rates and selectivity of $Al_2O_3$ over $SiO_2$ as functions of the input plasma parameters such as gas mixing ratio, DC-bias voltage and RF power and process pressure. The maximum etch rate was obtained under 15 mTorr process perssure, 700 W RF power, $BCl_3$(6 sccm)/$N_2$(14 sccm) plasma, and the highest etch selectivity was 1.9. We used the x-ray photoelectron spectroscopy (XPS) to investigate the chemical reactions on the etched surface. The Auger electron spectroscopy (AES) was used for elemental analysis of etched surface.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2004년도 제22회 춘계학술대회논문집
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• pp.611-616
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• 2004

In this study, microfabrication of a micro-arcjet nozzle with Fifth-harmonic generation Nd：YAG pulses (wavelength 213 nm) and its thrust performance tests were conducted. A micro-arcjet nozzle was machined in a 1.2 mm thick quartz plate. Sizes of the nozzle were 0.44 mm in width of the nozzle exit and constrictor diameter of 0.1 mm. For an anode, a thin film of Au (~100 nm thick) was deposited by DC discharge PVD in vacuum on divergent part of the nozzle. As for a cathode, an Au film was also coated on inner wall surface. In operational tests, a stable discharge was observed for mass flow of 1.0mg/sec, discharge current of 6 ㎃, discharge voltage of 600 V, or 3.6 W input power (specific power of 3.6 MW/kg). In this case, plenum pressure of the discharge chamber was 80 ㎪. With 3.6 W input power, thrust obtained was 1.4 mN giving specific impulse of 138 sec with thrust efficiency of 24 %.

• 한국전기전자재료학회논문지
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• 제22권10호
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• pp.826-831
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• 2009

In this paper, a high power RF amplifier module using AlN substrate of high thermal conductivity has been proposed. This RF amplifier module has the advantage of compact size and effective heat dissipation for the packaging of high power chip. To fabricate the thru-hole and scribing line on AlN substrate, the key parameters of $CO_2$ laser were experimented. And then, microstrip lines and spiral planar inductors were fabricated on an AlN substrate using the thin-film process. The fabricated microstrip lines on the AlN substrate has an attenuation value of 0.1 dB/mm up to 10 GHz. The fabricated spiral planar inductor has a high quality factor, a maximum of about 62 at 1 GHz for a 5.65 nH inductor. Packaging of a RF power amplifier was implemented on an AlN substrate with thru-hole. From the measured results, the gain is 24 dB from 13 to 15 GHz and the output power is 33.65 dBm(2.3 W).

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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• pp.81-83
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• 2000

Tin-doped indium oxide(ITO) thin films were deposited on polyethylene terephthalate(PET) at room temperature by oxygen ion beam assisted evaporator system and the effects of oxygen gas flow rate on the properties of room temperature ITO thin films were investigated. Plasma characteristics of the ion gun such as oxygen ions and atomic oxygen radicals as a function of oxygen flow rate were investigated using optical emission spectroscopy(OES). Faraday cup also used to measure oxygen ion density. The increase of oxygen flow rate to the ion gun generally increase the optical transmittance of the deposited ITO up to 6sccm of $O_2$ and the further increase of oxygen flow rate appears to saturate the optical transmittance. In the case of electrical property, the resistivity showed a minimum at 6 sccm of $O_2$ with the increase of oxygen flow rate. Therefore, the improved ITO properties at 6 sccm of $O_2$ appear to be more related to the incorporation of low energy oxygen radicals to deposited ITO film rather than the irradiation of high energy oxygen ions to the substrate. At an optimal deposition condition, ITO thin films deposited on PET substrates showed the resistivity of $6.6{\times}10^{-4}$ ${\Omega}$ cm and optical transmittance of above 90%.

• Progress in Superconductivity
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• 제9권2호
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• pp.177-182
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• 2008

[ $MgB_2$ ] thin films were fabricated using hybrid physical-chemical vapor deposition (HPCVD) method on silicon substrates with buffers of alumina grown by using atomic layer deposition method. The growth war in a range of temperatures $500\;{\sim}\;600^{\circ}C$ and under the reactor pressures of $25\;{\sim}\;50\;Torr$. There are some interfacial reactions in the as-grown films with impurities of mostly $Mg_2Si$, $MgAl_2O_4$, and other phases. The $T_c$'s of $MgB_2$ films were observed to be as high as 39 K, but the transition widths were increased with growth temperatures. The magnetization was measured as a function of temperature down to the temperature of 5 K, but the complete Meissner effect was not observed, which shows that the granular nature of weak links is prevailing. The formation of mostly $Mg_2Si$ impurity in HPCVD process is discussed, considering the diffusion and reaction of Mg vapor with silicon substrates.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1404_1405
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• 2009

For quantitative understanding of gas discharge phenomena, we should know electron collision cross section. $GeH_4$ is used in many applications with $Si_2H_6$ gas, such as amorphous alloy, a thin film of silicon and solar cell. Therefore, we understand the electron transport characteristics and analysed the electron transport coefficients, the electron drift velocity W, the longitudinal and transverse diffusion coefficient $ND_L$ and $ND_T$, and the ionization coefficient $\alpha$/N in $GeH_4$gas over the E/N range from 0.01 to 1000 Td by two-term approximation of the Boltzmann equation.

• 한국수산과학회지
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• 제41권4호
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• pp.237-242
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• 2008

The tunic of Styela clava(SCT) consists of a proteoglycan network. Regenerated cellulose films were prepared by solution casting and coagulation of SCT in N-methylmorpholine-N-oxide(NMMO)/$H_2O$(87/13 wt%). The crystalline structure of powdered SCT was primarily that of cellulose I. The crystalline structure of SCT films exhibited a cellulose II structure, similar to that of viscose rayon. Physical characterization of SCT films and fibers revealed an intrinsic viscosity($\eta$) of 6.35 dL/g, average molecular weight($M_w$) of 423,000 g/M, and fiber density of 1.50 $g/cm^3$ with a moisture regain and water absorption of 10.20% and 365%, respectively. The results were similar to those of cellulose films regenerated from wood pulp. Films prepared with 6 wt% SCT exhibited strong tensile strength, high water absorption, and a greater degree of elongation. Scanning electron micrographs(SEM) of film cross-sections showed a layered, sponge-like structure.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권8호
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• pp.319-324
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• 2003

AIN thin films are deposited on Si (100) and $SiO_2$/Si substrates by using an RF magnetron sputtering method and by changing the conditions of deposition variables, such as RF power, $N_2$/Ar flow ratio, and substrate temperature ($T_sub$). For all the deposited AIN films, XRD Peak patterns are monitored to examine the effect of deposition condition on the crystal orientation. Highly (002)-oriented AIN films are obtained at following nominal deposition conditions; RF Power : 350W, $N_2$/Ar ratio = 10/20, T$_{sub}$ : $250^{\circ}C$, and working pressure = 5mTorr, respectively. AIN-based SAW devices are fabricated using a lift-off method by varying the thickness of AIN layer. Insertion losses and side-lobe rejection levels of fabricated SAW devices are extracted from their frequency response characteristics, which are also compared in terms of AIN thickness and substrate. Relationships between the film properties of AIN films and the frequency responses of SAW devices are discussed. It is concluded from the experimental results that the (002)-preferred orientation as well as the surface roughness of AIN film may play a crucial role of determining the device performances of AIN-SAW devices.s.