• 제목/요약/키워드: W-N thin film

검색결과 303건 처리시간 0.03초

3C-SiC 마이크로 히터의 제작과 그 특성 (Fabrication of 3C-SiC micro heaters and its characteristics)

  • 정귀상;정재민
    • 센서학회지
    • /
    • 제18권4호
    • /
    • pp.311-315
    • /
    • 2009
  • This paper describes the characteristics of a poly 3C-SiC micro heater which was fabricated on AlN(0.1 $\mu$m)/3C-SiC(1.0 $\mu$m) suspended membranes by surface micro-machining technology. The 3C-SiC and AlN thin films which have wide energy band gap and very low lattice mismatch were used sensors for high temperature and voltage environments. The 3C-SiC thin film was used as micro heaters and temperature sensor materials simultaneously. The implemented 3CSiC RTD(resistance of temperature detector) and the power consumption of micro heaters were measured and calculated. The TCR(thermal coefficient of the resistance) of 3C-SiC RTD is about -5200 ppm/$^{\circ}C$ within a temperature range from 25 $^{\circ}C$ to 50 $^{\circ}C$ and -1040 ppm/$^{\circ}C$ at 500 $^{\circ}C$. The micro heater generates the heat about 500 $^{\circ}C$ at 10.3 mW. Moreover, durability of 3C-SiC micro heaters in high voltages is better than Pt micro heaters. A thermal distribution measured and simulated by IR thermovision and COMSOL is uniform on the membrane surface.

Influence of processing parameters for adhesion strength of TiAlN films prepared by Arc Ion Plating

  • 주윤곤;;조동율;윤재홍
    • 한국표면공학회:학술대회논문집
    • /
    • 한국표면공학회 2007년도 추계학술대회 논문집
    • /
    • pp.136-137
    • /
    • 2007
  • Wear resistant TiAlN thin film has been widely deposited on the surface of cutting and forming tools by using Arc Ion Plating. TiAlN films are deposited by the processes designed by the Taguchi L18 experimental design. The L18 experimental design is applied to achieve surface properties and adhesion. The deposition parameters are working pressure, substrate temperature, bias voltage, arc power and pre-sputtering bias voltage and time. The most influential parameters on surface properties and adhesion are substrate bias voltage, working nitrogen pressure and arc power. The optimal coating processes are obtained for surface properties and adhesion.

  • PDF

전자가 도핑된 $Sr_{0.9}$$La_{0.1}$Cu$O_2$초전도체의 홀 효과

  • Kim, Hyun-Jung;W. N. Kang;Kim, Kijoon H. P.;Lee, Sung-Ik;S. Karimoto
    • Progress in Superconductivity
    • /
    • 제4권1호
    • /
    • pp.32-36
    • /
    • 2002
  • We have measured the Hall effect in infinite-layer Sr/sub 0.9/La/sub 0.1/$CuO_2$ thin films grown by molecular beam epitaxy. We do not observe $T^{2}$ dependence of the cotangent of Hall angle, which is commonly observed in other cuprate High-Tc superconductors. Therefore, this result cannot be interpreted within two different scattering mechanism based on charge-spin separation theory. The mixed-state Hall effect shows no sign anomaly, implying that tile hydrodynamic contribution of vortex core is negligibly small.

  • PDF

Mixed-state Hall Effect of $MgB_2$ Thin Films

  • Kim, Bo-Yeon;Jung, Soon-Gil;Moon, Kyeong-Hee;Kang, W.N.;Choi, Eun-Mi;Kim, Heon-Jung;Lee, Sung-Ik;Kim, Hyeong-Jin
    • 한국초전도학회:학술대회논문집
    • /
    • 한국초전도학회 2005년도 High Temperature Superconductivity Vol.XV
    • /
    • pp.27-27
    • /
    • 2005
  • PDF

반응성 스퍼터링법으로 AI/AIN/GaAs 커패시터 제조시 (NH4)2S 처리에 따른 전기적 특성 (Electrical Characteristic of AI/AIN/GaAs MIS capacitor Fabricated by Reactive Sputtering Method for the (NH4)2S Treatment)

  • 추순남;권정열;박정철;이헌용
    • 한국전기전자재료학회논문지
    • /
    • 제20권1호
    • /
    • pp.8-13
    • /
    • 2007
  • In MIS capacitor structure, we have studied the electrical properties in Ammonium Sulfide solution treatment while AIN thin film as a insulator is being formed by reactive sputtering method. The deposition process conditions of AIN thin film we temperature $250^{\circ}C$, DC Power 150 W, pressure 5 mTorr and 8 sccm(Ar : 4 sccm, $N_{2}$ : 4 sccm). The surface of GaAs was treated with Ammonium Sulfide solution, it was shown the leakage current was less than $10^{-8}\;A/cm^{2}$. The deep depletion phenomena of inverse area with treating Ammonium Sulfide solution in C-V analysis was improved as compared the condition of without Ammonium Sulfide solution and hysteresis property as well.

PECVD 방법으로 제조된 비정질 Si 박막의 RTP를 이용한 결정화 연구 (Use of a Rapid Thermal Process Technique to study on the crystallization of amorphous Si films fabricated by PECVD)

  • 심찬호;김하나;김성준;김정우;권정열;이헌용
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 2005년도 제36회 하계학술대회 논문집 C
    • /
    • pp.2052-2054
    • /
    • 2005
  • TFT-LCD requires to use poly silicon for High resolution and High integration. Thin film make of Poly silicon on the excimer laser-induced crystallization of PECVD(plasma-enhanced chemical vapor deposition)-grown amorphous silicon. In the thin film hydrogen affects to a device performance from bad elements like eruption, void and etc. So dehydrogenation prior to laser exposure was necessary. In this study, use RTP(Rapid Thermal Process) at various temperature from $670^{\circ}C$ to $750^{\circ}C$ and fabricate poly-silicon. it propose optimized RTP window to compare grain size to use poly silicon's SEM pictures and crystallization to analyze Raman curved lines.

  • PDF

FPD에 사용되는 고분자 재료의 기계적 물성특성 연구 (Micro Scale Mechanical property of Polymeric materials for FPD(Flat Panel display))

  • 이낙규;이혜진;이형욱;정유진;최두선
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2005년도 춘계학술대회 논문집
    • /
    • pp.220-224
    • /
    • 2005
  • The technology trend of Flat Panel Display (FPD) equipments have been demanded that there are compact and multi-function. Therefore, nano/micro scale patterned on polymeric materials of Back Light Unit (BLU) in Liquid Crystal Display (LCD) that has been investigated. This paper describes a series of Horizontal Type Micro Tensile Tester that were carried out to investigate the load strain distance performance of typical polymeric material sheets. The polymeric materials film that micro size shaped specimens for tensile test are used by Cold-Isostatic-Press (CIP). Test equipment is Horizontal type Micro Tensile Tester that is presented to measure the micro scale mechanical property of thin film for FPD. This paper presents which easy testing tools measure for micro patterned on polyethylene (PET) specimens.

  • PDF

W-C-N 확산방지막의 전자거동(ElectroMigration) 특성과 표면 강도(Surface Hardness) 특성 연구 (Characteristics of Electomigration & Surface Hardness about Tungsten-Carbon-Nitrogen(W-C-N) Related Diffusion Barrier)

  • 김수인;김창성;이재윤;박준;노재규;안찬근;오찬우;함동식;황영주;유경환;이창우
    • 한국진공학회지
    • /
    • 제18권3호
    • /
    • pp.203-207
    • /
    • 2009
  • 반도체 공정에서 기존 금속배선으로 사용되던 Al을 대체하여 사용되는 금속배선으로는 Cu가 그 대안으로 인식되고 있다. 이는 비저항값이 Al ($2.66{\mu}{\Omega}$-cm)보다 Cu ($1.67{\mu}{\Omega}$-cm)가 더 작아 RC 지연 시간 (RC delay time)을 극복하기 때문이다. 그러나 Cu의 녹는점은 $1085^{\circ}C$로 높지만 저온에서 쉽게 Si기판과 반응하는 특성을 가지고 있고, 또한 Si과의 접착력이 좋이 않는 것으로 알려져 있다. 이러한 이유로 Cu와 Si과의 반응을 방지하고 접착력을 높이기 위하여 확산방지막의 연구가 꾸준히 진행되고 있다. 본 연구그룹에서는 Cu의 확산을 방지하기 위하여 W-C-N의 확산방지막에 대하여 연구하여 왔다. 지금까지 보고된 연구 결과에 의하면 W-C-N (tungsten-carbon-nitrogen) 확산방지막은 고온에서도 Cu와 Si과의 확산을 효과적으로 방지하는 것으로 보고되었다. 이 논문에서는 W-C-N 확산방지막에 질소(N) 비율을 다르게 증착하여 지금까지 진행한 연구 결과를 기반으로 새로이 Cu의 전자거동현상(Electromigration)에 대하여 연구하였고, 고온 열처리 과정에서 박막의 표면강도 (Surface hardness)를 Nano-Indenter system을 이용하여 연구하였다. 이러한 연구를 통하여 박막내 질소가 포함된 W-C-N 확산방지막이 Cu의 전자거동에 더 안정적이며, 고온 열처리 과정에서도 표면 강도가 더 안정한 연구 결과를 획득하였다.

코스퍼터링법을 이용한 GaN LED 투명접촉전극용 NiO-AZO 박막의 제조 및 물성평가 (Fabrication and Characteristics of NiO-AZO Thin Films Deposited by Co-sputtering System for GaN LED Transparent Contact Electrode)

  • 박희우;방준호;;송풍근
    • 한국표면공학회지
    • /
    • 제44권6호
    • /
    • pp.250-254
    • /
    • 2011
  • NiO-AZO films were deposited on glass substrate by DC and RF magnetron co-sputtering system in pure $O_2$ gas without substrate heating during deposition. In order to control the chemical composition of the film, NiO target was supplied with constant RF power of 150 W and AZO target (doped with 2.98 at% aluminum) with DC power varied between 40 W to 80 W. Deposited NiO-AZO films were evaluated by structural and chemical analysis. With introducing AZO, XRD and XPS data reveal that NiO were supplied with more oxygen. these results could be strongly affected by the higher bond enthalpy of NiO compared to ZnO, which makes it possible for NiO to obtain excessive oxygen from ZnO.

RF 마그네트론 스퍼터링을 이용한 FBAR 소자용 ZnO 박막의 특성 (Characteristics of ZnO thin films by RF magnetron sputtering for FBAR application)

  • 김선영;이능헌;김수길;박성현;정민곤;신영화;지승한;이덕출
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 2003년도 하계학술대회 논문집 C
    • /
    • pp.1523-1525
    • /
    • 2003
  • Due to the rapid development of wireless networking system, researches on the communication devices are mainly focus on microwave frequency devices such as filters, resonators, and phase shifters. Among them, Film bulk acoustic resonator (FBAR) has been paid extensive attentions for their high performance. In this research, ZnO thin films were deposited by RF-magnetron sputtering on Al/$SiO_2$/Si wafer and then crystalline properties and surface morphology were examined. To measure crystalline structure and surface morphology X-ray diffraction (XRD) and Scanning Electron Microscope (SEM) were employed. It was showed that crystalline properties of ZnO thin films were strongly dependant on the deposition conditions. As increasing the deposition temperature and the deposition pressures, the peak intensities of ZnO(002) plane were increased until $300^{\circ}C$, then decreased rapidly. At the sputtering conditions of RF power of 213 W and working pressure of 15 m Torr, ZnO film had excellent c-axis orientation, surface morphology, and adhesion to the substrate. In conclusion we optimized smooth surface with very small grains as well as highly c-axis oriented ZnO film for FBAR applications.

  • PDF