• Journal of the Korean Vacuum Society
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• v.18 no.3
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• pp.203-207
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• 2009

Copper is known as a replacement for aluminum wire which is used for semiconductor. Because specific resistance of Cu ($1.67{\mu}{\Omega}$-cm) is lower than that of Al ($2.66{\mu}{\Omega}$-cm), Cu reduce RC delay time. Although melting point of Cu($1085^{\circ}C$) is higher than melting point of Al, Cu have characteristic to easily react with Silicon(Si) in low temperature, and it isn't good at adhesive strength with Si. For above these reason, research of diffusion barrier to prevent reaction between Cu and Si and to raise adhesive strength is steadily advanced. Our study group have researched on W-C-N (tungsten-carbon-nitrogen) Diffusion barrier for preventing diffusion of Cu through semiconductor. By recent studies, It's reported that W-C-N diffusion barrier can even precent Cu and Si diffusing effectively at high temperature. In this treatise, we vaporized different proportion of N into diffusion barrier to research Cu's Electromigration based on the results and studied surface hardness in the heat process using nano scale indentation system. We gain that diffusion barrier containing nitrogen is more stable for Cu's electromigration and has stronger surface hardness in heat treatment process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.109-110
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• 2005

We have suggested sputtered W-C-N thin film for preventing thermal budget between semiconductor and metal. These results show that the W-C-N thin film has good thermal stability and low resistivity. In this study we newly suggested sputtered W-B-C-N thin diffusion barrier. In order to improve the characteristics, we examined the impurity behaviors as a function of nitrogen gas flow ratio. This thin film is able to prevent the interdiffusion during high temperature (700 to $1000^{\circ}C$) annealing process and has low resistivity ($\sim$200$\mu{\Omega}-cm$). Through the analysis of X-Ray diffraction, resistivity and XPS, we studied structure behavior of W-B-C-N diffusion barrier.

• Journal of the Korean Vacuum Society
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• v.17 no.2
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• pp.109-112
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• 2008

The miniaturization of device size and submicron process causes serious problems in conventional metallization due to the solubility of silicon and metal at the interface, such as an increasing contact resistance in the contact hole and interdiffusion between metal and silicon. Moreover, the interaction between Cu and Si is so strong and detrimental to the electrical performance of Si even at temperatures below $200^{\circ}C$. Therefore it is necessary to implement a barrier layer between Cu and Si. So we study W-C-N diffusion barrier for prevent Cu diffusion as a function of $N_2$ gas flow and thermal stability. Especially, we also study the W-C-N diffusion barrier for analyzing the change of lattice constants.

• Korean Chemical Engineering Research
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• v.49 no.3
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• pp.357-360
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• 2011

N-doped ZnO nanofilms were prepared by plasma enhanced atomic layer deposition method. $Zn(C_{2}H_{5})_{2}$, $O_{2}$ and $N_{2}$ were used as Zn, O and N sources, respectively, for N-doped ZnO films under variation of radio frequency (rf) power from 50-300W. Structural, optical and electrical properties of as-grown ZnO films were investigated with Xray diffraction(XRD), photoluminescence(PL) and Hall-effect measurements, respectively. Nitrogen content and p-type conductivity in ZnO nanofilms increased with the rf power.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.3
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• pp.273-279
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• 1999

The home-made hot wall epitaxy (HWE) system was utilized for GaN epitaxial layer growth on the Si(001) substrate. It was appeared that GaN epilayer grow with mixed phase of Zinc blende and Wurtzite structure from photoluminescence (PL) and x-ray diffraction (XRD) analysis at the room temperature. We found that intial growth layer has Wurtzite structure from photoluminescence (PL) and x-ray diffractio (XRD) analyses at the room temperature. Wefound that initial growth layer has Wurtzite structure when initial deposition time, the temperature of substrate and source are 4 min, $720^{\circ}C$ and $860^{\circ}C$ respectively, and at the epi growth process GaN, epilayer was grown with relatively stable Wurtzite structure when the temperature of substrate and source are $1020^{\circ}C$ and $910^{\circ}C$ respectively.

• Journal of the Korean Ceramic Society
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• v.38 no.12
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• pp.1180-1186
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• 2001

W $O_3$-Sn $O_2$thin film sensors with approximately 1${\mu}{\textrm}{m}$ in thickness were fabricated by using a high-vacuum resistance-heating evaporator, were annealed at 50$0^{\circ}C$ for 4 hours in air, and then their crystallinities and surface microstructures were analyzed. As results of gas-sensing characteristics to oxidizing gas, N $O_2$, and reducing gas, CO, of 100 ppm, the highest gas sensitivities (S= $R_{gas}$/ $R_{air}$) were the W $O_3$thin-film sensor measured at 25$0^{\circ}C$ for N $O_2$(S≒1000) and the Sn $O_2$thin-film sensor measured at 15$0^{\circ}C$ to 25$0^{\circ}C$ range for CO (S≒0.25), respectively.ely.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.155-155
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• 2008

계속되는 반도체 산업의 발달로 반도체 배선 공정에서는 Al을 대체할 배선 금속으로 Cu에 대한 관심이 집중되고, 일부 공정에서는 Al을 대신하여 사용하고 있다. 이러한 Cu는 Al에 비교하여 많은 장점을 가지고 있지만 Si 기판과 저온에서 쉽게 확산되는 큰 문제점을 가지고 있다. 따라서 이러한 문제를 해결하기 위한 방법으로 현재까지 연구된 대안으로는 Cu와 Si기판 사이에 확산방지막을 삽입하는 것이 대안으로 알려져 있다. 본 연구는 Cu 금속배선 공정을 위하여 Cu와 Si기판과의 확산을 효과적으로 방지할 확산방지막을 텅스텐(W)을 주 구성 물질로 여기에 불순물을 첨가한 W-C-N 확산방지막에 대하여 연구하였으며, 특히 W-C-N 확산방지막의 결정 및 표면 구조에 대한 물성 특성을 연구하였다. 여러 조건변화에 따라서 확산방지막의 특성을 확인하기 위하여 조건이 다르게 증착된 W-C-N 확산방지막을 상온에서 고온으로 열처리하여 열처리 전후를 WET-SPM (Scanning Probe Microscope)을 사용하여 그 물리적 특성을 조사하였다. 이러한 분석을 통하여 가장 안정된 W-C-N 확산방지막의 증착조건을 확인하였으며, 이를 기반으로 박막의 물리적 특성을 연구하였다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.78-82
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• 2005

펄스 플라즈마 원자층 증착 방법 (PPALD : Pulse Plasma Atomic Layer Deposition)을 이용하여 삼원계 박막인 W-C-N 박막을 ILD layer인 TEOS 위에 제조하였다. 실험은 $WF_6,\;N_2.\;CH_4$ 가스의 순차적 주입과 $N_2$를 이용한 퍼징으로 이루어지며 $N_2$와 $CH_4$ 가스 주입 시에 pulse plasma가 적용되었다. 일반적인 ALD 증착 기구를 그대로 따르는 PPALD 방법에 의해 제조된 W-C-N 박막은 $H_2/N_2$ 플라즈마 초기 표면 처리에 의해 incubation cycles 없이 초기 cycles부터 0.2 nm/cycle의 일정한 증착율을 가지고 증착되므로 정확한 두께의 control이 가능하며 $300\;{\mu}{\Omega}-cm$의 매우 낮은 비저항 특성을 나타내었다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.6 no.3
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• pp.318-326
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• 1996

This study is to investigate a chemical vapor deposition technique of copper film which is expected to be more useful as metallizations of microcircuit fabrication. An experimental equipment was designed and set-up for this study, and a Cu-precursor used that is a metal-organic compound, named (hfac)Cu(I)VTMS ; (hevaflouoroacetylacetonate trimethyvinylsilane copper). Base pressure of the experimental system is in $10^{-6}$ Torr, and the chamber pressure and the substrate temperature can be controlled in the system. Before the deposition of copper thin film, tungsten or titanium nitride film was deposited onto the silicon wafer. Helium has been used as carrier gas to control the deposition rate. As a result, deposition rate was measured as $1,800\;{\AA}/min$ at $220^{\circ}C$ which is higher than the results of previous studies, and the average surface roughness was measured as about $200\;{\AA}$. A deposition selectivity was observed between W or TiN and $SiO_{2}$ substrates below $250^{\circ}C$, and optimum results are observed at $180^{\circ}C$ of substrate temperature and 0.8 Torr of chamber pressure.

• Journal of the Korean Magnetics Society
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• v.18 no.1
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• pp.32-35
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• 2008

Thermally stable diffusion barrier of tungsten carbon nitride(W-C-N) and of tungsten boron carbon nitride(W-B-C-N) thin films have studied to investigate the impurity behaviors of boron and nitrogen. In this paper we newly deposited tungsten boron carbon nitride(W-B-C-N) thin film for various $W_2B$ target power on silicon substrate. The impurities of the 100nm-thick W-C-N and W-B-C-N thin films provide stuffing effect for preventing the inter-diffusion between W-C-N or W-B-C-N thin films and silicon during the high temperature($700^{\circ}C{\sim}1000^{\circ}C$) annealing process.