1 |
Q. Chen, D. J. Frankel, C. W. Lee, and N. V. Richardson, Chem. Phys. Lett., 349, 167 (2001)
DOI
ScienceOn
|
2 |
C. W. Lee and Y. T. Kim, J. Vac. Sci. Tech. B, 24(3), 1432 (2006)
DOI
ScienceOn
|
3 |
J. Klema, R. Pyle, and E. Domangue, Proceeding of 22nd Annual Int'l Reliability Symposium (IEEE, New York, 1984) p. 1
|
4 |
C. W. Lee, Y. T. Kim, and J. Y. Lee, Appl. Phys. Lett., 64(5), 619 (1994)
DOI
ScienceOn
|
5 |
Q. Chen, C. W. Lee, D. J. Frankel, and N. V. Richardson, J. Phys. Chem. Comm., 9, 1 (1999)
|
6 |
C. Weaver, Adhesion of thin films, J. Vac. Sci. Tech., 12, 18 (1975)
DOI
ScienceOn
|
7 |
M.Wittmer, J. Vac. Sci. Tech., A3, 1797 (1988)
|
8 |
Y. T. Kim, C. W. Lee, and S.-K. Min, Appl. Phys. Lett., 61(5), 537 (1991)
DOI
|
9 |
C. W. Lee and J. G. Kim, Phys. Stat. Sol. B, 241(7), 1645 (2004)
DOI
ScienceOn
|
10 |
S. I. Kim and C. W. Lee, J. Kor. Phys. Soc., 50(2), 489 (2007)
DOI
ScienceOn
|