• Progress in Superconductivity and Cryogenics
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• v.16 no.4
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• pp.36-39
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• 2014

We report on the superconducting and structural characteristics of Pb-based alloy ($Pb_{0.9}In_{0.1}$, $Pb_{0.8}In_{0.2}$ and $Pb_{0.85}Bi_{0.15}$) thin films, depending on the film deposition rate. The maximum critical magnetic field strength of $Pb_{0.85}Bi_{0.15}$ is almost six times larger than that of $Pb_{0.9}In_{0.1}$, and more rapid growth of the film enhances the critical magnetic field strength even for the same alloy material. Scanning electron microscopy inspection indicates that lower deposition rate condition is vulnerable to the formation of void structure in the film. Topographic images using atomic force microscopy are useful to optimize the deposition condition for the growth of smooth superconducting film. Our work can be utilized for future studies on hybrid superconducting devices using low-dimensional nanostructures.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.1 s.94
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• pp.227-237
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• 1999

As the interface bonding phenomenon between the matrix and the reinforcements has a large effect on the mechanical properties of MMCs, a sugestion of the strength analysis technique considering the residual stress and the interface bonding phenomenon is very important for the design of pans and the estimation of fatigue behavior. In this paper the three dimensional finite element anaysis is performed during the elasto-plastic deformation of the particulate reinforced metal matrix composites. It was analyzed with the volume fractions in view of microscale. Bonding strength. interface separation and matrix void growth between the matrix and the reinforcements will be predicted on deformation under tensile loading. An interface seperation is estimated by the fracture criterion which is a critical value of generalized plastic work per unit volume. The shape of the reinforcement is assumed to be a perfect sphere. And the type of the reinforcement distribution is assumed as FCC array. The thermal residual stress in MMCs is induced by the heat treatment. It is included at the simulation as an initial residual stress. The element birth and death method of the ANSYS program is used for the estimation of the interface bonding strength, void generation and propagation. It is assumed that the fracture in the matrix region begin to occur under the external loading when the plastic work per unit volume is equal to the critical value. The fracture strain will be defined. The experimental data of the extruded $SiC_p$>/606l Al composites are compared with the theoretical results.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.281-287
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• 2005

in-situ electromigration test was carried out for edge drift lines of eutectic SnPb solder using Scanning Electron Microscopy (SEM). The electromigration test for the eutectic SnPb solder sample was conducted at temperature of $90^{\circ}C$ and the current density of $6{\times}10^4A/cm^2$. Edge drift at cathode and hillock growth at anode were observed in-situ in a SEM chamber during electromigration test. It was clearly revealed that eutectic SnPb solder lines has an incubation stage before void formation during electromigration test, which seemed to be related to the void nucleation stage of flip chip solder electromigration behaviors.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.374-378
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• 2012

In an effort to overcome the problems which arise when fabricating high-aspect-ratio TSV(through silicon via), we performed experiments involving the void-free Cu filling of a TSV(10~20 ${\mu}m$ in diameter with an aspect ratio of 5~7) by controlling the plating DC current density and the additive SPS concentration. Initially, the copper deposit growth mode in and around the trench and the TSV was estimated by the change in the plating DC current density. According to the variation of the plating current density, the deposition rate during Cu electroplating differed at the top and the bottom of the trench. Specifically, at a current density 2.5 mA/$cm^2$, the deposition rate in the corner of the trench was lower than that at the top and on the bottom sides. From this result, we confirmed that a plating current density 2.5 mA/$cm^2$ is very useful for void-free Cu filling of a TSV. In order to reduce the plating time, we attempted TSV Cu filling by controlling the accelerator SPS concentration at a plating current density of 2.5 mA/$cm^2$. A TSV with a diameter 10 ${\mu}m$ and an aspect ratio of 7 was filled completely with Cu plating material in 90 min at a current density 2.5 mA/$cm^2$ with an addition of SPS at 50 mg/L. Finally, we found that TSV can be filled rapidly with plated Cu without voids by controlling the SPS concentration at the optimized plating current density.

• Korean Journal of Materials Research
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• v.16 no.4
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• pp.257-263
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• 2006

We have investigated the effect of silver added to Cu films on the microstructure evolution, resistivity, surface morphology, stress relaxation temperature, and adhesion properties of Cu(Ag) alloy thin films deposited on Mo glue layer upon annealing. In addition, pure Cu films deposited on Mo has been annealed and compared. The results show that the silver in Cu(Ag) thin films control the grain growth through the coarsening of its precipitates upon annealing at $300^{\circ}C{\sim}600^{\circ}C$ and the grain growth of Cu reveals the activation energy of 0.22 eV, approximately one third of activation energy for diffusion of Ag dopant along the grain boundaries in Cu matrix (0.75 eV). This indicates that the grain growth can be controlled by Ag diffusion along the grain boundaries. In addition, the grain growth can be a major contributor to the decreased resistivity of Cu(Ag) alloy thin films at the temperature of $300^{\circ}C{\sim}500^{\circ}C$, and decreases the resistivity of Cu(Ag) thin films to $1.96{\mu}{\Omega}-cm$ after annealing at $600^{\circ}C$. Furthermore, the addition of Ag increases the stress relaxation temperature of Cu(Ag) thin films, and thus leading to the enhanced resistance to the void formation, which starts at $300^{\circ}C$ in the pure Cu thin films. Moreover, Cu(Ag) thin films shows the increased adhesion properties, possibly resulting from the Ag segregating to the interface. Consequently, the Cu(Ag) thin films can be used as a metallization of advanced TFT-LCDs.

• Korean Journal of Agricultural Science
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• v.37 no.1
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• pp.87-96
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• 2010

This study was performed to evaluate the planting properties of herbaceous plant and cool-season grass in porous polymer blocks that were manufactured by using recycled coarse aggregates and unsaturated polyester resin to develop environmentally friendly planting blocks. Unsaturated polyester resin, natural and recycled coarse aggregates and $CaCO_3$ were used. The mix proportions were determined to satisfy the requirement for the workability and slump according to aggregate sizes(5-10 and 5-20mm). Tests for the void ratio and compressive strength of porous polymer concrete were performed at curing age 7 days. Also, porous polymer block using recycled coarse aggregates were applied to kinds of plants such as tall fescue, Perennial ryegrass, Lesedeza and Alfalfa. After seed, initial germination, germination ratio, cover view and growth length for planting blocks were estimated by various methods.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2008.11a
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• pp.193-197
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• 2008

This study enforced to produce the planting concrete block which could be applied to various slopes economically. First of all, the physical properties was investigated with the various types of aggregate and aggregate ratio of the paste for the lead to mixture proportion of the planting concrete. As a result, the orchid stone as aggregate and 30% of aggregate ratio of the paste were used as the basic mixture proportion considering 20~30% of maintained void ratio for the growth of plant, over 20% of capillary suction for holding water, and 3MPa as the minimum strength. For the result of the test to the new planting block which was quite different from existing planting concrete block, it could complement the problems and be possible to produce effectively and economically because various slopes like 40ﾟ~75ﾟ, continual produce by extrusion, and pumping out were possible were possible.

• Transactions on Electrical and Electronic Materials
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• v.11 no.5
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• pp.212-215
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• 2010

$BiFeO_3/Pb(Zr_{0.95}Ti_{0.05})O_3$ (BFO/PZT) heterolayered thin films were fabricated by the spin coating method on a Pt/Ti/$SiO_2$/Si substrate using metal alkoxide solutions. The coating and heating procedure was repeated 6 times to form the heterolayered films. The thickness of the BFO/PZT films after one cycle of drying/sintering is about 30-40 nm. All BFO/PZT films show a void free uniform grain structure without the presence of rosette structures. It can be assumed that the crystal growth of the upper BFO layers can be influenced by the lower PZT layers. As the number of coatings increased, the dielectric constant increased, so that the value for the 6-layer film was 1360 at 1 KHz.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.6
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• pp.914-922
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• 2003

In this paper, the strain localization of voided ductile material has been analyzed by nonlocal plasticity formulation in which the yield strength not only depends on an equivalent plastic strain measure (hardening parameter), but also on the Laplacian thereof. The gradient terms in yield criterion show an important role on modeling strain-softening phenomena of material. The influence of the mesh size on the elastic -plastic deformation behavior and the effect of the characteristic length parameter for localization prediction are also investigated. The proposed nonlocal plasticity shows that the load -strain curves converge to one curve. Results using nonlocal plasticity also exhibit the dependence of mesh size is much less sensitivity than that for a corresponding local plasticity formulation.

• Journal of Korean Neurosurgical Society
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• v.39 no.2
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• pp.152-155
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• 2006

Central neurocytoma is a rare, well-differentiated neuronal tumor and is usually located in the lateral or third ventricle of young adults. The occurrence of an intraventricular tumor with a characterisitic magnetic resonance image findings including isointense signal in T1-weighted images, the presence of a cystic component, small signal-void areas due to calcification, heterogenous and hyperintense "bubbly" appearance in T2-weighted images in a young patient should suggest preoperatively the diagnosis of central neurocytoma. The typical immunohistochemical finding, positivity for synaptophysin, is the main pathological feature. We experienced two cases of central neurocytomas with typical radiological and histopathological findings. We expect growth arrest of these cases by subtotal removal to avoid postoperative neurologic deficit followed by radiation therapy.