• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.533-538
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• 2000

Ductile fracture of dual phase steel begins with void nucleation, at martensite-ferrite interface of deformed martensite particle. In this study, void nucleation, growth, and coalescence under various strain were studied in dual phase steel. Therefore, by means of the heat treatment of low carbon steel, the study deals with void nucleation and growth for ferrite grain size and martensite volume fraction of dual phase steel using statistical method. Void nucleation and growth with increasing strain are shown depend upon the ferrite grain size. Voids volume fraction generally increase as ferrite grain size decease.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.2
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• pp.58-62
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• 2004

The shape evolution of the interface void of copper metallization for intergrated circuits under electromigration stress is modeled. A 2-dimensional finite-difference numerical method is employed for computing time evolution of the void shape driven by surface diffusion, and the electrostatic problem is solved by boundary element method. When the diffusion coefficient is isotropic, the numerical results agree well with the known case of wedge-shape void evolution. The numerical results for the anisotropic diffusion coefficient show that the initially circular void evolves to become a fatal slitlike shape when the electron wind force is large, while the shape becomes non-fatal and circular as the electron wind force decreases. The results indicate that the open circuit failure caused by slit-like void shape is far less probable to be observed for copper metallization under a normal electromigration stress condition.

• Journal of Mechanical Science and Technology
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• v.15 no.10
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• pp.1349-1355
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• 2001

As most fractures of ductile materials in metal forming processes occurred due to the results of evolution of internal damage - void nucleation, growth and coalescence. In this paper, an approximate yield criterion for voided (porous) anisotropic ductile materials is developed. The proposed approximate yield function is based on Gurson's yield function in conjunction with the Hosford's non-quadratic anisotropic yield criterion in order to consider the characteristic of anisotropic properties of matrix material. The associated flow rules are presented and the laws governing void growth with strain are derided. Using the proposed model void growth of an anisotropic sheet under biaxial tensile loading and its effect on sheet metal formability are investigated. The yield surface of voided anisotropic sheet and void growth with strain are predicted and compared with the experimental results.

• Structural Engineering and Mechanics
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• v.72 no.3
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• pp.313-327
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• 2019

Damage evolution in the form of void nucleation, propagation and coalescence is the primary cause that is responsible for the ductile failure of microalloyed steels. The Gurson-Tvergaard-Needleman (GTN) damage model has proven to be extremely robust for characterizing the microscopic damage behavior of ductile metals. Nonetheless, successful applications of the model on a given metal type are limited by the correct identification of damage parameters as well as the validation of the calculated void growth rate. The purpose of this study is two-fold. First, we aim to identify the damage parameters of the GTN model for Q345 steel (Chinese code), due to its extensive application in mechanical and civil industries in China. The identification of damage parameters is facilitated by the well-suited response surface methodology, followed by a complete analysis of variance for evaluating the statistical significance of the identified model. Second, taking notched Q345 cylinders as an example, finite element simulations implemented with the identified GTN model are performed in order to analyze their microscopic damage behavior. In particular, the void growth rate predicted from the simulations is successfully correlated with experimentally measured acoustic emissions. The quantitative correlation suggests that during the yielding stage the void growth rate increases linearly with the acoustic emissions, while in the strain-hardening and softening period the dependence becomes an exponential function. The combined experimental and finite element approach provides a means for validating simulated void growth rate against experimental measurements of acoustic emissions in microalloyed steels.

• Transactions of the Korean hydrogen and new energy society
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• v.16 no.4
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• pp.324-333
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• 2005

The kinetics of external hydrogen embrittlememt is considered. The equation of the crack growth rate (CGR) is derived from modification of the model developed by Wilkinson and Vitek. After calculation of hydrogen pressure build-up in the void, the effect of the internal hydrogen pressure on the void growth is added. The CGR is expressed by two terms. One is the term dependent on the critical stress, which is exactly same as Wilkinson and Vitek. The other is term dependent on the pressure of the hydrogen in void.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.1-9
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• 2011

Understanding the void characterization in the solder joints has become more important because of the application of lead free solder materials and its reliability in electronic packaging technology. According to the JEDEC 217 standard, it describes void types formed in the solder joints, and divides into some categories depending on the void position and formation cause. Based on the previous papers and the standards related to the void, reliability of the BGA solder joints is determined by the size of void, as well as the location of void inside the BGA solder ball. Prior to reflow soldering process, OSP(organic surface preservative) finished Cu electrode was exposed under $85^{\circ}C$/60%RH(relative humidity) for 168 h. Voids induced by the exposure of $85^{\circ}C$/60%RH became larger and bigger with increasing aging times. The void position has more influence on mechanical strength property than the amount of void growth does.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.183-185
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• 2008

Forming Limit Diagram(FLD) is a representative tool for evaluating formability of sheet metals. This paper presents a methodology to determine the FLD using Finite Element Method. For predicting the forming limits numerically. Previous methods such as using the thickness strain or the ductile fracture criterion are limited at plane strain domain. These results suggest that behavior of the void growth in sheet metals is different from real one. In contrast to previous methods, a more exact model which takes void growth into account is used. This result agrees with the experimental result qualitatively.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.8 s.239
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• pp.1139-1145
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• 2005

Most failures of ductile materials in metal forming processes occurred due to material damage evolution - void nucleation, growth and coalescence. In this paper, the modified yield function of Liao et al in conjunction with the Hosford's yield criterion is studied to clarify the plastic deformation characteristic of voided anisotropic sheet metals. The void growth of an anisotropic sheet under biaxial tensile loading and damage effect of void growth on forming limits of sheet metals are investigated. Also the characteristic length defining the neck geometry is introduced in M-K model to incorporate the effect of triaxial stress in necked region on forming limits. The forming limits theoretically predicted are compared with experimental data. Satisfactory agreement was obtained between the predictions and experimental data.

• Polymer(Korea)
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• v.28 no.1
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• pp.35-40
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• 2004

The formation mechanism of void defect which deteriorate composite's property is various according to each composite process. In this paper, void formation and growth mechanism is analyzed by thermal analysis and GC/MS. We made a vacuum chamber for observing pressure effect. Thermal analysis has been done in various condition. Elements of volatiles during resin curing were turned out by GC/MS. The most of volatiles of polyester were composed of styrene (over 80%) and a small quantity of toluene. In case epoxy resin, butyl glycidyl ether was the main element of volatiles (over 90%). We concluded that the original sites of void growth existed in resin and they were eliminated by vacuum and heating process. And the growth of void was influenced by water, diluents, solvent, and reactants in resin.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1954-1956
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• 2000

In this paper, when void of XLPE was existed, electrical tree was growth in branch-type, and it was growth in bush-type when void of XLPE was not existed. Moreover, charge magnitude of partial discharge by deterioration time of XLPE sample was about proportion to output voltage of AE signals. When void was existed, charge magnitude of partial discharge, the output voltage Vp-p value of AE signals were increased with increasing deterioration time. However, when void were not existed, charge magnitude of partial discharge, the output voltage Vp-p value of AE signals were increased in fast deterioration time, but it were decreasing at after in middle deterioration time. Frequency spectrum response of AE signal was about 100-250[kHz].