• Transactions on Electrical and Electronic Materials
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• 제11권1호
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• pp.42-47
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• 2010

Polymer insulating materials such as cross linked polyethylene (XLPE) are employed in electric cables used for extra high voltage. These materials can degrade due to chemical, mechanical and electric stress, possibly caused by voids, the presence of extrinsic materials and protrusions. Therefore, this study measured discharge patterns, discharge phase angle, quantity and occurrence frequency as well as changes in XLPE under different temperatures and applied voltages. To quantitatively analyze the irregular partial discharge patterns measured, the discharge patterns were examined using a statistical program. A three layer sample was fabricated, wherein the upper and lower layers were composed of non-void XLPE, while the middle layer was composed of an air void and copper particles. After heating to room temperature and $50^{\circ}C$ and $80^{\circ}C$ in silicone oil, partial discharge characteristics were studied by increasing the voltage from the inception voltage to the breakdown voltage. Partial discharge statistical analysis showed that when the K-means clustering was carried out at 9 kV to determine the void discharge characteristics, the amount discharged at low temperatures was small but when the temperature was increased to $80^{\circ}C$, the discharge amount increased to be 5.7 times more than that at room temperature because electric charge injection became easier. An analysis of the kurtosis and the skewness confirmed that positive and negative polarity had counterclockwise and clockwise clustering distribution, respectively. When 5 kV was applied to copper particles, the K-means was conducted as the temperature changed from $50^{\circ}C$ to $80^{\circ}C$. The amount of charge at a positive polarity increased 20.3% and the amount of charge at a negative polarity increased 54.9%. The clustering distribution of a positive polarity and negative polarity showed a straight line in the kurtosis and skewness analyses.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1673-1675
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• 2001

In this paper, Partial Discharge(PD) patterns are compared by means of Low Frequency PD(LFPD, based on the IEC 270) and recently proposed High Frequency PD(HFPD). For this purpose, three different types of artificial defects are provided such as corona in air, void in epoxy insulator and needle defect in XLPE cable insulation. PD were generated from each defect and then detected respectively by two different methods such as LFPD and HFPD. As a result, remarkable resemblance in PD pattern for differ detecting method have been observed from each defect. Accordingly, it could be deduced that the pattern recognition by LFPD could be regarded as the reference for the investigations by HFPD.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1996년도 봄 학술발표회 논문집
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• pp.398-401
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• 1996

It is the aim of this study to introduce the application method for the new estimation system of deterioration caused performance decrement of exterior wall by infrared theromography. With this help of this trial test, the defect such as void and honeycomb of esveria wall can be shown easily. Espicially by selecting the weathering condition, it becomes easier to identify defect than with original image. It was confirmed that this trial monitoring system is very useful to identify the defect of exterior wall.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.160-164
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• 2007

In the steel industry, there is a need to produce large forged parts for the automobile industries, the flight and shipping industries ad military industries. In the steel-industry application, a cogging technique for cast ingots is required, because the major parts are needed as one large body in order to obtain higher quality. Therefore, cogging process is the primary step in manufacturing of practically large open-die forging. In the cogging process, internal voids have to be eliminated as defects, The present work is concerned with the elimination of the internal voids in large ingots so as obtain sound products. In this study, hot compression tests were carried out to obtain the flow stress of cast microstructure at different temperature and strain rates. The FEM analysis are performed to investigate the overlap defect of cast ingots during cogging stage. The measure flow stress data were used to simulate the cogging process of cast ingot using the practical material properties. Also the analysis of void closure are performed by using the $DEFORM^{TM}$-3D. The calculated results of void closure behavior are compared with the measured results before and after cogging, which are scanned by the X-ray scanner. From this result, the criteria for deformation amounts effect on the void closure can be investigated by the comparison of practical experiment and numerical analysis.

• Composites Research
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• 제32권6호
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• pp.395-402
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• 2019

RFI 공정은 진공백 내부에 섬유 매트와 수지 필름을 적층하여 성형하는 OoA 공정이다. 외부에서 따로 주입되는 수지가 없기 때문에 수지 필름의 양이 섬유가 필요로 하는 양보다 적은 경우 복합재 내부에 기공 결함이 발생하며 기계적 물성이 저하된다. 이러한 이유로 제작한 복합재를 실용화하기 위해서 비파괴검사를 이용한 기공예측이 필수적으로 요구된다. 따라서 본 연구에서는 RFI 공정에서 비파괴검사 시 기준으로 사용할 수 있는 표준 기공률 시편을 제조하는 방법을 제시하였다. 표준 기공률 시편 제작 방법으로 수지 필름 두께를 조절하는 방법을 사용하였으며, 목표 기공률별 수지 필름 두께를 설정하기 위한 방법으로 섬유 압착 실험을 제시하였다. 수지 필름 두께 조절을 통하여 0%, 2%, 4%의 목표 기공률 패널을 제작했고 비파괴시험과 기공률 측정을 통하여 기공률에 따른 비파괴검사 신호 감쇠를 측정했다. 또한 인장, 면내전단, 숏빔, 압축 시편의 신호 감쇠를 통하여 기공률을 추정하였고, 기공률에 따른 기계적 물성을 평가하였다.

• 콘크리트학회논문집
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• 제18권1호
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• pp.65-71
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• 2006

콘크리트는 내부에 결함 중 하나로써 존재하는 공극을 가진 재료이다. 만약 콘크리트의 공극률이 증가하면 콘크리트의 내구성은 감소하게 된다. 본 연구에서는 콘크리트의 표면 공극을 개선하기 위하여 표면 침투제를 시험체에 적용하였다. 그리고, 두 가지 유형의 표면 침투제를 이용하여 콘크리트에 도포함으로써 염화물 침투에 대한 저항성과 동결융해 저항성을 평가하였다. 결과에 따르면, 표면 침투제는 강도와 동결융해 저항성에 악영향을 미치지 않은 것으로 보인다. 염화물 침투 저항성에 있어 표면 침투제가 효과적임을 알 수 있었다.

• 한국주조공학회지
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• 제29권4호
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• pp.176-180
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• 2009

Effect of matrix microstructure on creep behaviors of squeeze cast magnesium matrix composites was investigated. Aluminum borate whisker was used as reinforcement and AZ31, AS52 and Sr added AS52 Mg alloys were used for matrix alloys. The reinforcement was distributed homogeneously and defect-free composite was manufactured. Creep tests were carried out at the temperature of $150^{\circ}C$ under the applied stress of 50 and 100 MPa for Mg alloys and Mg MMCs, respectively. The creep resistance of Mg MMCs was in this order: AS52-Sr > AS52 AZ31 MMCs. Void initiation during creep mainly occurred at $Mg/Mg_{17}Al_{12}$ interface and propagation went along grain boundaries. On the other hand, $Mg_2Si$ phase was not attributed to the creep void initiation.

• 한국전기전자재료학회논문지
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• 제24권11호
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• pp.890-894
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• 2011

In this thesis, the silicone filler with a sample size of 0~75 phr and void size of 2~4.5 mm is prepared in order to diagnose the defect of void which exists in widely used insulation material, silicone rubber. In this silicone rubber sample, electrodes are connected and whilst the voltage changes, applied voltage 7 kV~9 kV is increased constantly over time and discharge quantity, discharge frequency and applied voltage (T-QNV) were measured. The discharge quantity of the applied voltage (VQ) is measured to estimate inception voltage and extinction voltage. In addition, under the condition of maintaining constant applied voltage, discharge quantity and discharge frequency (QN) are measured, and its characteristics are analyzed.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 E
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• pp.2402-2404
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• 1999

In this study, we measured the PD pattern with multiple voids in PET film. The analysis of PD pattern was employed the statistical factor such like CCF(cross correlation factor), asymmetry, kurtosis and etc. The difference of PD patterns caused by arrangement of voids, even if the same size and numbers of void in PET film. Such result of experiment will be used to know the PD source in the real equipment about arrangement and numbers of the defect in insulator.