• Title/Summary/Keyword: Void Formation

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Static Compressive Strength of Thick Unidirectional Carbon Fiber - Epoxy Laminate (두꺼운 일방향 탄소섬유-에폭시 적층판의 정적 압축 강도 연구)

  • Lee, J.;Soutis, C.;Gong, Chang-Deok
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2005.11a
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    • pp.61-65
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    • 2005
  • Existing test methods for thick-section specimens ( 4mm) have not provided precise compressive properties to date for the analysis and design of thick structure. A survey of the failure behaviour of such thick specimens revealed that the failure initiated at the top corner of the specimen and propagated down and across the width of the specimen as premature failure, not typically reported for thin compression specimens. In the current study, the premature failure was successfully avoided during compressive testing and the failure mode was quite similar regardless of increasing specimen thickness and specimen volume. Failure mode was similar regardless of increasing specimen thickness and specimen volume, i.e. brooming failure mode combined with longitudinal splitting, interlaminar cracking, fibre breakage and kinkband formation (fibre microbuckling). Nevertheless, average failure strengths of the specimens decreased with increasing specimen thicnkiness from 2mm to 8mm with the T800/924C system (36% strength reduction) and specimen volumes from scaling factor I to scaling factor 4 with the IM7/8552 system (46% strength reduction). It was revealed from the literature$^{11}$ that the thickness effect and scaling effect arc caused by manufacturing defects such as void content and fibre waviness.

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Study on the Bonding Interface in Directly Bonded Si-Si and Si-$SiO_2$ Si Wafer Pairs (직접 접합된 Si-Si, Si-$SiO_2$/Si기판쌍의 접합 계면에 관한 연구)

  • Ju, Byeong-Gwon;Bang, Jun-Ho;Lee, Yun-Hui;Cha, Gyun-Hyeon;O, Myeong-Hwan
    • Korean Journal of Materials Research
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    • v.4 no.2
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    • pp.127-135
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    • 1994
  • We investigated the bonding interfaces of directly-bonded Si-Si and $Si-Sio_{2}$/Si wafer pairs. By the angle lapping-delineation, anisotropic etching, and (FIR)-TEM observation methods, we studied on the interface defects and the transient region originated from the interface stress, the various types of voids, the formation and stability of interfacial oxide. We also compared the interface image of the bonded $Si-Sio_{2}$ with that of a typically grown $Si-Sio_{2}$.

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Characterizing Pb-based superconducting thin films

  • Park, Sang-Il;Kim, Hong-Seok;Lee, Joon Sung;Doh, Yong-Joo
    • Progress in Superconductivity and Cryogenics
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    • v.16 no.4
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    • pp.36-39
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    • 2014
  • We report on the superconducting and structural characteristics of Pb-based alloy ($Pb_{0.9}In_{0.1}$, $Pb_{0.8}In_{0.2}$ and $Pb_{0.85}Bi_{0.15}$) thin films, depending on the film deposition rate. The maximum critical magnetic field strength of $Pb_{0.85}Bi_{0.15}$ is almost six times larger than that of $Pb_{0.9}In_{0.1}$, and more rapid growth of the film enhances the critical magnetic field strength even for the same alloy material. Scanning electron microscopy inspection indicates that lower deposition rate condition is vulnerable to the formation of void structure in the film. Topographic images using atomic force microscopy are useful to optimize the deposition condition for the growth of smooth superconducting film. Our work can be utilized for future studies on hybrid superconducting devices using low-dimensional nanostructures.

Effects of Plasma Pretreatment of the Cu Seed Layer on Cu Electroplating (Cu seed layer 표면의 플라즈마 전처리가 Cu 전기도금 공정에 미치는 효과에 관한 연구)

  • O, Jun-Hwan;Lee, Seong-Uk;Lee, Jong-Mu
    • Korean Journal of Materials Research
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    • v.11 no.9
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    • pp.802-809
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    • 2001
  • Electroplating is an attractive alternative deposition method for copper with the need for a conformal and conductive seed layer In addition, the Cu seed layer should be highly pure so as not to compromise the effective resistivity of the filled copper interconnect structure. This seed layer requires low electrical resistivity, low levels of impurities, smooth interface, good adhesion to the barrier metal and low thickness concurrent with coherence for ensuring void-free fill. The electrical conductivity of the surface plays an important role in formation of initial Cu nuclei, Cu nucleation is much easier on the substrate with higher electrical conductivities. It is also known that the nucleation processes of Cu are very sensitive to surface condition. In this study, copper seed layers deposited by magnetron sputtering onto a tantalum nitride barrier layer were used for electroplating copper in the forward pulsed mode. Prior to electroplating a copper film, the Cu seed layer was cleaned by plasma H$_2$ and $N_2$. In the plasma treatment exposure tome was varied from 1 to 20 min and plasma power from 20 to 140W. Effects of plasma pretreatment to Cu seed/Tantalum nitride (TaN)/borophosphosilicate glass (BPSG) samples on electroplating of copper (Cu) films were investigated.

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The Effect of Cu Reflow on the Pd-Cu Alloy Membrane Formation for Hydrogen Separation (수소분리용 Pd-Cu 합금 분리막의 Cu Reflow 영향)

  • Mun, Jin-Uk;Kim, Dong-Won
    • Journal of the Korean institute of surface engineering
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    • v.39 no.6
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    • pp.255-262
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    • 2006
  • Pd-Cu alloy membrane for hydrogen separation was fabricated by sputtering and Cu reflow process. At first, the Pd and Cu was continuously deposited by sputtering method on oxidized Si support, the Cu reflow process was followed. Microstructure of the surface and permeability of the membrane was investigated depending on various reflow temperature, time, Pd/cu composition and supports. With respect to our result, Pd-Cu thin film (90 wt.% Pd/10 wt.% Cu) deposited by sputtering process with thickness of $2{\mu}m$ was heat-treated for Cu reflow The voids of the membrane surface were completely filled and the dense crystal surface was formed by Cu reflow behavior at $700^{\circ}C$ for 1 hour. Cu reflow process, which is adopted for our work, could be applied to fabrication of dense Pd-alloy membrane for hydrogen separation regardless of supports. Ceramic or metal support could be easily used for the membrane fabricated by reflow process. The Cu reflow process must result in void-free surface and dense crystalline of Pd-alloy membrane, which is responsible for improved selectivity oi the membrane.

A Study on the Transperancy expressed in Current Fashion(I) - In the Context of Ideal Effect- (복식에 표현된 '투명성'에 관한 연구(I) -관념적 효과를 중심으로-)

  • 정연자
    • Journal of the Korean Society of Costume
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    • v.43
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    • pp.41-52
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    • 1999
  • This study is to compare and analyze two types of 'transparency' concept expressed in architecture and garment which has not only been an important theme in the post-modern expression of architeture but been shown in various types of concept. This study examined the characteristics of transparency and through theoretical studies divided them into four types; frankness(purity ambiguity comparison exposure and eroticism) Purity building would use the matrial which is transparent glasses for the expprssion of its purity and clothing would use the transparent matrial for the expression of the natural beauty of human body and the purity of human of itself. Ambiguity is expressed in the outer side of architecture by duplicating transparent materials and by phenomenon of optical illusion and inflection. On the contrary in garment it is shown in the outward formation of underclothing. Comparison in architecture is expressed by the use of void but opaque materials as well as solid but transparent materials. Extinction is expressed with the visual effect of context of the surrounding by the use of opaque glass and reflexive glass. In garment the effect of comparison is expressed by the use of mixing transparent materials and opaque materials. Building would express the inside of itself by the way of its exposure and clothing would also express its frankness through the human body is partly opened or clossed at the same thime that arises from eroticism of the way of the expression of human feelings.

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A quantitative measurement of concrete air content using image analyses

  • Hwang, C.L.;Peng, S.S.;Wang, E.;Lin, S.H.;Huang, S.L.
    • Computers and Concrete
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    • v.7 no.3
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    • pp.239-247
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    • 2010
  • A proposed topology method is introduced to measure the air content of fresh cement paste and hardened concrete. The method takes advantage of chromatographic analysis in void areas that are highlighted using different color schemes and later calculated using built-in computer software. The air content measured by the topology method is compared with results obtained from the conventional ASTM methods. It is concluded that the proposed method is reliable, and costs less and is easier to operate compared with the ASTM methods. In addition, 3 dimensional pore models can be created using image post-processing techniques. The proposed method helps researchers in understanding the formation and existence of concrete pores. This paper reports a detailed test program demonstrating the standard operating procedure used for the proposed method and presents a comparison of results between the proposed method and conventional ASTM Specifications. It is also concluded that the air content increases with increasing size of pores and increasing percentage of coarse aggregates.

Marangoni Convection Effects on Crystal Growth (결정 성장에서 Marangoni 대류의 영향)

  • 강승민;최종건;오근호
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.2 no.2
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    • pp.77-82
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    • 1992
  • When a crystal is grown by FZ process, the melt zone is located at between the solid of upper and lower side and is kept by the solid-liquid interface tension. On the surface of the melt zone, a surface tension gradient is occured by the difference of temperature and solute concentration, it is the driving force of marangoni flow. The crystal even in the steady state growth can become imperfect for the dislocation distribution and the solute concentration in the peripheral region of the crystal are higher than those in the inner part and the probability of the formation of the defects such as voids, bubble penetration, secondary phase creation and crack is high near the solid-liquid interface. This is because the solid -liquid interface becomes irregular because of the local variation of temperature in that region due to marangoni convection.

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Effects of Sputtering Parameters on the Properties of Co/Pd Multilayered Films

  • Shin, J. N.;Hong, D. H.;Lee, T. D.
    • Journal of Magnetics
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    • v.8 no.4
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    • pp.146-148
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    • 2003
  • Multilayered films of Co/Pd have been studied as a candidate material for a high density perpendicular recording medium due to higher anisotropy energy. However, high exchange coupling among grains results in large transition noise. To reduce the exchange coupling and grain size, addition of 3rd elements and physical separation of grains have been attempted. In the present paper, effects of sputtering pressure, Co sublayer thickness and Pd underlayer thickness on magnetic properties and microstructures were studied. It was found that by increasing sputtering pressure from 5 mTorr to 25 mTorr, Ms decreased to one half and coercivity increased more than 5000 Oe. The increase of the coercivity is associated with physical separation of grains by high pressure sputtering. Ms per volume of Co for Co/Pd multilayered film deposited at 25 mTorr shows continuous decrease with increasing Co sublayer thickness. This was related to void formation and intermixing of Co/Pd interface. Also, effect of Pd underlayer thickness on magnetic properties will be discussed.

COMPARATIVE ANALYSIS OF STRUCTURAL CHANGES IN U-MO DISPERSED FUEL OF FULL-SIZE FUEL ELEMENTS AND MINI-RODS IRRADIATED IN THE MIR REACTOR

  • Izhutov, Aleksey.L.;Iakovlev, Valeriy.V.;Novoselov, Andrey.E.;Starkov, Vladimir.A.;Sheldyakov, Aleksey.A.;Shishin, Valeriy.Yu.;Kosenkov, Vladimir.M.;Vatulin, Aleksandr.V.;Dobrikova, Irina.V.;Suprun, Vladimir.B.;Kulakov, Gennadiy.V.
    • Nuclear Engineering and Technology
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    • v.45 no.7
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    • pp.859-870
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    • 2013
  • The paper summarizes the irradiation test and post-irradiation examination (PIE) data for the U-Mo low-enriched fuel that was irradiated in the MIR reactor under the RERTR Program. The PIE data were analyzed for both full-size fuel rods and mini-rods with atomized powder dispersed in Al matrix as well as with additions of 2%, 5% and 13% of silicon in the matrix and ZrN protective coating on the fuel particles. The full-size fuel rods were irradiated up to an average burnup of ${\sim}60%^{235}U$; the mini-rods were irradiated to an average burnup of ${\sim}85%^{235}U$. The presented data show a significant increase of the void fraction in the U-Mo alloy as the U-235 burnup rises from ~ 40% up to ~ 85%. The effect of irradiation test conditions and U-235 burnup were analyzed with regard to the formation of an interaction layer between the matrix and fuel particles as well as generation of porosity in the U-Mo alloy. Shown here are changes in distribution of U fission products as the U-235 burnup increases from ~ 40% up to ~ 85%.