• KSII Transactions on Internet and Information Systems (TIIS)
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• v.18 no.8
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• pp.2366-2380
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• 2024

In this study, a high-speed template matching system is proposed for wafer-vision alignment. The proposed system is designed to rapidly locate markers in semiconductor equipment used for wafer-vision alignment. We optimized and implemented a template-matching algorithm for the high-speed processing of high-resolution wafer images. Owing to the simplicity of wafer markers, we removed unnecessary components in the algorithm and designed the system using a field-programmable gate array (FPGA) to implement high-speed processing. The hardware blocks were designed using the Xilinx ZCU104 board, and the pyramid and matching blocks were designed using programmable logic for accelerated operations. To validate the proposed system, we established a verification environment using stage equipment commonly used in industrial settings and reference-software-based validation frameworks. The output results from the FPGA were transmitted to the wafer-alignment controller for system verification. The proposed system reduced the data-processing time by approximately 30% and achieved a level of accuracy in detecting wafer markers that was comparable to that achieved by reference software, with minimal deviation. This system can be used to increase precision and productivity during semiconductor manufacturing processes.

• Korean Journal of Optics and Photonics
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• v.20 no.4
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• pp.223-229
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• 2009

This paper describes the development of a simulator which can numerically calculate an image to be acquired in a machine vision system for automated optical inspection. The simulator is based on a ray tracing technique and composed of three modules which are an illuminating system, a specimen and an imaging system. Kinds of model parameters for modules and their values are carefully chosen from the direct measurement and the observation of related phenomena. Finally, the validity of the simulator is evaluated by logical analysis and by comparison with measured images.

• Journal of Korean Society for Quality Management
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• v.25 no.1
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• pp.1-16
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• 1997

In this paper, we illustrate how to design screening inspections for minimizing a total quality costs in a multi-stage manufacturing systems. The total quality cost model consists of inspection costs, internal failure costs, external failure costs, and Taguchi's loss function. Although, the use of automatic test equipment such as machnie vision and CMM has greatly increased inspection speed and accuracy, screeing(100% inspection) could be considered only as a short-term method to remove nonconforming items from a population, not for a long-term quality improvement. However, screeing should be used for certain situations such as before costly operations and after unsatisfied operations. This paper ends with an example that demonstrates the usefulness of the model.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2023.05a
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• pp.287-288
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• 2023

The inspection work at construction sites is one of the important supervisory tasks, which involves verifying that the building is being constructed by the numerical values specified in the design drawings. The conventional measuring method for inspection involves using tools or equipment such as rulers directly by the personnel at the site, and it is usually confirmed by vision. Therefore, this study proposes an model to measure numerical values on images of the construction site. Through the case study to measure the installation interval of jack supports, the proposed algorithm was verified the effiect and validity. The results of this study suggest that it can support inspection work even in the office, which may have been overlooked by on-site inspectors, and contribute to the digitization of inspection work at construction sites.

• Smart Structures and Systems
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• v.24 no.5
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• pp.669-681
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• 2019

Bridge collapses may deliver a huge impact on our society in a very negative way. Out of many reasons why bridges collapse, poor maintenance is becoming a main contributing factor to many recent collapses. Furthermore, the aging of bridges is able to make the situation much worse. In order to prevent this unwanted event, it is indispensable to conduct continuous bridge monitoring and timely maintenance. Visual inspection is the most widely used method, but it is heavily dependent on the experience of the inspectors. It is also time-consuming, labor-intensive, costly, disruptive, and even unsafe for the inspectors. In order to address its limitations, in recent years increasing interests have been paid to the use of unmanned aerial vehicles (UAVs), which is expected to make the inspection process safer, faster and more cost-effective. In addition, it can cover the area where it is too hard to reach by inspectors. However, this strategy is still in a primitive stage because there are many things to be addressed for real implementation. In this paper, a typical procedure of bridge inspection using UAVs consisting of three phases (i.e., pre-inspection, inspection, and post-inspection phases) and the detailed tasks by phase are described. Also, three major challenges, which are related to a UAV's flight, image data acquisition, and damage identification, respectively, are identified from a practical perspective (e.g., localization of a UAV under the bridge, high-quality image capture, etc.) and their possible solutions are discussed by examining recently developed or currently developing techniques such as the graph-based localization algorithm, and the image quality assessment and enhancement strategy. In particular, deep learning based algorithms such as R-CNN and Mask R-CNN for classifying, localizing and quantifying several damage types (e.g., cracks, corrosion, spalling, efflorescence, etc.) in an automatic manner are discussed. This strategy is based on a huge amount of image data obtained from unmanned inspection equipment consisting of the UAV and imaging devices (vision and IR cameras).

• Journal of Advanced Information Technology and Convergence
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• v.8 no.2
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• pp.139-145
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• 2018

Improvement of the speed of the gantry among equipment that mounts a chip using SMT can improve productivity. In order to improve the performance of the gantry, there are studies such as a method of increasing the speed of adsorption, the speed of the gantry by reducing the weight, and a method of facilitating the use of the gantry. But all of these are ways of improving equipment. In this paper, we propose a method to improve the speed of gantry mounting microchip. The method is to shorten the driving time of the gantry. To do this, calculate the driving time using the existing method. And we calculate the travel time using the method presented in this paper. As a result, the time calculated by the proposed method is reduced by 14%.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.273-277
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• 2003

A general process of electronic assembly is composed of a series of geometric alignments and bonding/screwing processes. After assembly, the function is tested in a following process of inspection. However, assembly of micro-optic devices requires both processes to be performed in equipment. Coarse geometric alignment is made by using vision and optical function is improved by the following fine motion based on feedback of tunable laser interferometer. The general system is composed of a precision robot system for 3D assembly, a 3D vision guided system for geometric alignment and an optical feedback system with a tunable laser. In this study, we propose a new fast alignment algorithm of micro-optic devices for both of visual and optical alignments. The main goal is to find a fastest alignment process and algorithms with state-of-the-art technology. We propose a new approach with an optimal sequence of processes, a visual alignment algorithm and a search algorithm for an optimal optical alignment. A system is designed to show the effectiveness and efficiency of the proposed method.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.6
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• pp.88-95
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• 2003

This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand fur high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The geometrical relationship between PCB, cameras, and xy$\theta$ stage is derived, and analytical equations for alignment errors are also obtained. The unknown parameters including camera declining angles and etc. can be obtained by initialization process. Finally, the proposed algorithm is verified by experiments by using test bench.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.6
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• pp.96-104
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• 2003

This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand for high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The centers of fiducial marks are obtained by using moment, gradient method. The first method is calculating the centroid by using first moment of blob, and the latter method is calculating the center of the circle whose equation is obtained by curve-fitting the boundaries of fiducial mark. The operating system used to implement the whole set-up is carried in Window 98 (or NT) environment. Finally we implemented this system to PCB screen printer.

• Smart Structures and Systems
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• v.30 no.4
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• pp.385-395
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• 2022

Detecting cracks on a concrete structure is crucial for structural maintenance, a crack being an indicator of possible damage. Conventional crack detection methods which include visual inspection and non-destructive equipment, are typically limited to a small region and require time-consuming processes. Recently, to reduce the human intervention in the inspections, various researchers have sought computer vision-based crack analyses: One class is filter-based methods, which effectively transforms the image to detect crack edges. The other class is using deep-learning algorithms. For example, convolutional neural networks have shown high precision in identifying cracks in an image. However, when the objective is to classify not only the existence of crack but also the types of cracks, only a few studies have been reported, limiting their practical use. Thus, the presented study develops an image processing procedure that detects cracks and classifies crack types; whether the image contains a crazing-type, single crack, or multiple cracks. The properties and steps in the algorithm have been developed using field-obtained images. Subsequently, the algorithm is validated from additional 227 images obtained from an open database. For test datasets, the proposed algorithm showed accuracy of 92.8% in average. In summary, the developed algorithm can precisely classify crazing-type images, while some single crack images may misclassify into multiple cracks, yielding conservative results. As a result, the successful results of the presented study show potentials of using vision-based technologies for providing crack information with reduced human intervention.