• Title/Summary/Keyword: Viscoplastic behavior

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Deformation Analysis of Soft Foundation with Vertical Drain Wells using the Interface Element Method -With Emphasis on Model Foundation and Actual Sand Drain Well Foundation- (접합요소에 의한 Vertical Drain Well 지반의 변형해석 - 모델지반과 실제 Sand Drain Well 지반을 중심으로 -)

  • Lee, Jean Soo
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.13 no.4
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    • pp.227-237
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    • 1993
  • This paper dealt with numerical analysis of sand drain considering the smear effect around drain wells and discontinuous deformation behavior due to difference in rigidity between drain materials and adjacent clayey soils. Biot's equation was selected as governing equation coupled with MODCAM (Modified Cam-clay) model or EVP(Elasto-Viscoplastic) model as constitutive equation. The validity as well as the accuracy of the method developed by author was checked by comparing the proposed method with those by Siriwardane and Ghaboussi using joint element. The FEM analysis developed in this study was applied to both 2-dimensional model foundation and actual foundation. the result of which proved to be satisfactory.

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Numerical study on the rate-dependent behavior of geogrid reinforced sand retaining walls

  • Li, Fulin;Ma, Tianran;Yang, Yugui
    • Geomechanics and Engineering
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    • v.25 no.3
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    • pp.195-205
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    • 2021
  • Time effect on the deformation and strength characteristics of geogrid reinforced sand retaining wall has become an important issue in geotechnical and transportation engineering. Three physical model tests on geogrid reinforced sand retaining walls performed under various loading conditions were simulated to study their rate-dependent behaviors, using the presented nonlinear finite element method (FEM) analysis procedure. This FEM was based on the dynamic relaxation method and return mapping scheme, in which the combined effects of the rate-dependent behaviors of both the backfill soil and the geosynthetic reinforcement have been included. The rate-dependent behaviors of sands and geogrids should be attributed to the viscous property of materials, which can be described by the unified three-component elasto-viscoplastic constitutive model. By comparing the FEM simulations and the test results, it can be found that the present FEM was able to be successfully extended to the boundary value problems of geosynthetic reinforced soil retaining walls. The deformation and strength characteristics of the geogrid reinforced sand retaining walls can be well reproduced. Loading rate effect, the trends of jump in footing pressure upon the step-changes in the loading rate, occurred not only on sands and geogrids but also on geogrid reinforced sands retaining walls. The lateral earth pressure distributions against the back of retaining wall, the local tensile force in the geogrid arranged in the retaining wall and the local stresses beneath the footing under various loading conditions can also be predicted well in the FEM simulations.

Development of Polymer Elastic Bump Formation Process and Bump Deformation Behavior Analysis for Flexible Semiconductor Package Assembly (유연 반도체 패키지 접속을 위한 폴리머 탄성범프 범핑 공정 개발 및 범프 변형 거동 분석)

  • Lee, Jae Hak;Song, Jun-Yeob;Kim, Seung Man;Kim, Yong Jin;Park, Ah-Young
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.2
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    • pp.31-43
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    • 2019
  • In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

A Coupled Analysis of Finite Elements and Boundary Elements for Time Dependent Inelastic Problems (시간의존 비탄성 문제의 유한요소-경계요소 조합에 의한 해석)

  • Kim, Moon Kyum;Huh, Taik Nyung;Jang, Jung Bum;Oh, Se Ho
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.13 no.3
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    • pp.25-34
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    • 1993
  • The long-term behavior, such as in excavation problems of weak medium, can be dealt with by the elasto-viscoplasticity models. In this paper, a combined formulation of elasto-viscoplasticity using boundary elements and finite elements without using internal cells is presented. The domain integral introduced due to the viscoplastic stresses is transformed into a boundary integral applying direct integration in cylindrical coordinates. The results of the developed boundary element analysis are compared with those from the explicit solution and from the finite element analysis. It is observed that the boundary element analysis without internal cells results in some error because of its deficiency in handling the nonlinearity in local stress concentration. Therefore, a coupled analysis of boundary elements and finite elements, in which finite elements are used in the area of stress concentration, is developed. The coupled method is applied to a time dependent inelastic problem with semi-infinite boundaries. It results in reasonable solution compared with other methods where relatively higher degree of freedoms are employed. Thus, it is concluded that the combined analysis may be used for such problems in the effective manner.

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