• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.191-194
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• 2003

The results from a systematic study of the response of a Ti-6Al-4V alloy under quasi-static and dynamic loading at different strain rates and temperatures are presented. It has been shown that the work-hardening rate decreased as the strain rate and the strain increased. The correlations and predictions using modified KHL (Khan-Huang-Liang) viscoplastic constitutive model are compared with those from JC (Johnson-Cook) model and experimental observations. Overall, KHL model correlations and predictions compared much more favorably than the corresponding JC model predictions and correlations.

• Journal of Powder Materials
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• v.11 no.4
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• pp.341-347
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• 2004

In the study, a hybrid constitutive model for densification of metallic powders was applied to cold isostatic pressing. The model is based on a pressure-dependent plasticity model for porous materials combined with a dislocation density-based viscoplastic constitutive model considering microstructural features such as grain size and inter-particle spacing. Comparison of experiment and calculated results of microscale and nanoscale Cu powders was made. This theoretical approach is useful for powder densification analysis of various powder sizes, deformation routes and powder processing methods.

• Journal of the Korean Geotechnical Society
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• v.16 no.4
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• pp.183-190
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• 2000

In this research, the finite element analysis of piezocone penetration and dissipation tests have been conducted using the anisotropic elastoplastic-viscoplastic bounding surface model in the Updated Lagrangian reference frame for the large deformation and finite strain nu\ature of piezocone penetration. Accordingly, virtual work equation and corresponding finite element equations have been reformulated. Theory of mixtures has been incorporated to explain the behavior of the sol. It has been observed that the viscoplastic part of the soil model affected the whole formulation. The results of the finite element analysis have been compared and investigated with the experimental results. The formulations and the results are described in part 'I' and part 'II', respectively.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.4
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• pp.380-387
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• 2009

The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2000.04a
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• pp.40-43
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• 2000

A process optimal design methodology applicable to steady-state forming with a strain-hardening material is presented. in this approach the optimal design problem is formulated on the basis of a rigid-viscoplastic finite element process model and a derivative based approach is adopted as an optimization technique The process model the schemes for the evaluation of the design sensitivity considering the effect of strain-hardening and an iterative procedure for design optimization are described. the validity of the proposed approach is demonstrated through application to die shape optimal design in extrusion.

• Journal of Korean Association for Spatial Structures
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• v.14 no.1
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• pp.101-108
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• 2014

In order to overcome the key shortcoming of Hamilton's principle, recently, the extended framework of Hamilton's principle was developed. To investigate its potential in further applications especially for material non-linearity problems, the focus is initially on a classical single-degree-of-freedom elasto-viscoplastic model. More specifically, the extended framework is applied to the single-degree-of-freedom elasto-viscoplastic model, and a corresponding weak form is numerically implemented through a temporal finite element approach. The method provides a non-iterative algorithm along with unconditional stability with respect to the time step, while yielding whole information to investigate the further dynamics of the considered system.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1992.03a
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• pp.177-200
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• 1992

A thermo-viscoplastic finite element program was developed to analyze the compression molding of SMC process. Deformation of the material was modelled by using the flow-rule. Heat balance during the process was coupled to the deformation. In the cure study, a kinetic model was adopted to describe the cure behavior. The numerical kinetic model was integrated with the thermo-viscoplastic numerical analysis by adding heat generation due to the chemical reaction of the workpiece in the heat transfer analysis. The integrated finite element program can simulate a whole sequential molding process including deformation, heat transfer, and chemical reaction. A practical SMC molding process with T-shaped substructure was simulated. The simulated results showed good agreements with experiments.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1994.03a
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• pp.71-79
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• 1994

Strip drawing of strain-hardening, viscoplastic materials with damage is analyzed by a rigid plastic finite element method. A process model is formulated using two state variables, one for strain hardening from slip dominated plastic distortion and the other for damage from growth of microvoids. Application of the model to steady state drawing is given via implementation in a consistent penalty finite element formulation. The predicted density changes as a result of void growth are compared to those from experiments reported in the literature. The effects of drawing conditions such as drawing speed and die angle on the mechanical property changes are studied.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.5
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• pp.1657-1664
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• 1991

본 연구에서는 재료의 이방성을 고려한 점소성 모델을 제시하였다. 공학적 인 견지에서 볼 때 이방성 재료의 기계적 거동을 표한하기 위해서는 단순화 이론(si- mplified theory)의 개발이 필요하게 되었으며 이에따라 Betten은 등방성 소성 포텐셜 (isotropic plastic potential)에서 응력텐서를 재료의 이방성을 포함하는 변환 응력 텐서(mapped stress tensor)로 대체함으로써 이방성을 고려하였다. 그러므로 실제 이방성 재료의 비탄성 거동은 가상의 등방성 상태로 치환되며 여기에 소성 포텐셜 이 론을 적용하게 된다.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.8
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• pp.82-91
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• 1997

The major objective of this study is to establish analytical technique in order to analyze the behaviour of semi-solid material considering induction heating of the billet. Induction heating process is analyzed by using commerical finite element software. ANSYS. The finite element program, SFAC2D, for the simulation of deformation in semi-solid state is developed in the present study. The semi-solid behaviour is described by a viscoplastic model for the solid phase, and by the Darcy's law for the liquid flow. Simple compression and closed-die compression process considering induction heating are analyzed, and also it is found that the distribution of initial solid fraction of the billet has an important effect on deformation behaviour of semi-solid material. In order to verify the effectiveness of proposed analytical technique the simulation result is compared with experimental result.