• 대한전기학회:학술대회논문집
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• 대한전기학회 2015년도 제46회 하계학술대회
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• pp.1253-1254
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• 2015

양면형으로 구성된 가유전체 기판에 마이크로파 대역 전송선로를 설계하여 크기를 약 절반으로 줄이는 방법을 제안한다. 가유전체 기판의 특성에 의하여 표준형 전송선로보다 길이가 현저하게 줄어드는 효과에 더하여, 가유전체 기판을 양면형으로 구성함으로서 다시 물리적 크기가 약 절반으로 줄어드는 효과가 보인다. 양면 전송선로는 신호선 비어홀(via-hole)에 의하여 연결되어 상하 전송선로 간에 전달특성이 양호함이 제시된다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.244-244
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• 2012

Polymer memory devices have attracted considerable attention because of their advantages such as low cost potential, good scalability, flexibility, simplicity in structure, and large capacity for data storage. Metal/poly (4,4'-aminotriphenylene hexafluoroisopropylidenediphthalimide) (6F-TPA PI)/metal system has been found to show an electrical bi-stable behavior. Here, we show a novel set-up of 6F-TPA PI/Al sample in which holes are injected by photoelectron emission process instead of direct charge carrier injection via metal electrode. In this process, an irreversible electrical phase transition of 6F-TPA PI is found, leading to a write-once-read-many (WORM) behavior. The photoelectron spectroscopy results measured before and after the switching process revealed that the irreversible electrical phase transition of 6F-TPA PI is attributed to the chemical modification of the carbonyl group in phthalimide moiety.

• 한국분말재료학회지
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• 제24권4호
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• pp.279-284
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• 2017

The formation mechanism and photocatalytic properties of a multiwalled carbon nanotube (MWCNT)/$TiO_2$-based nanotube (TNTs) composite are investigated. The CNT/TNT composite is synthesized via a solution chemical route. It is confirmed that this 1-D nanotube composite has a core-shell nanotubular structure, where the TNT surrounds the CNT core. The photocatalytic activity investigated based on the methylene blue degradation test is superior to that of with pure TNT. The CNTs play two important roles in enhancing the photocatalytic activity. One is to act as a template to form the core-shell structure while titanate nanosheets are converted into nanotubes. The other is to act as an electron reservoir that facilitates charge separation and electron transfer from the TNT, thus decreasing the electron-hole recombination efficiency.

• 한국세라믹학회지
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• 제34권6호
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• pp.601-610
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• 1997

In cofiring of multilayered alumina with tungsten, the change of camber with lamination condition was experimented and the effect of sintering shrinkage of alumina and tungsten was investigated. From the exact measurement of sintering shrinkage of tungsten thick film, as lamination pressure increased, the sintering shrinkage of alumina decreased but that of tungsten thick film was not changed. So it was though that the main factor which induced the sintering shrinkage difference between ceramics and metal with lamination condition was the change of sintering shrinkage of ceramics. In case of high lamination pressure, high green sheet density, the cofired specimen showed low camber due to low shrinkage difference between alumina and tungsten and there was a linear relation between camber and shrinkage difference. It was found that this shrinkage difference could change the thickness of tungsten film and the microstructure within via hole during cofiring.

• Bulletin of the Korean Chemical Society
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• 제35권2호
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• pp.513-517
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• 2014

Two donor-acceptor-donor monomers such as 3,5-bis(4-bromophenyl)-1,2,4-oxadiazole (BOB) and 3,5-bis(5-bromothiophen-2-yl)-1,2,4-oxadiazole (TOT) incorporating electron transporting and hole blocking 1,2,4-oxadiazloe moiety were copolymerized with light emitting fluorene derivative via Suzuki polycondensation to afford two new polymers, PFBOB and PFTOT, respectively. The optical studies for polymers PFBOB and PFTOT revealed that the band gaps are 3.10 eV and 2.72 eV, respectively, and polymer PFBOB exhibited a deep-blue emission while polymer PFTOT showed blue emission in chloroform and as thin film. The photoluminescence quantum efficiencies (${\Phi}_f$) of polymers PFBOB and PFTOT in chloroform calculated against highly blue emitting 9,10-diphenylanthracene (DPA, ${\Phi}_f=0.90$) were 1.00 and 0.44, respectively.

• 마이크로전자및패키징학회지
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• 제4권2호
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• pp.25-32
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• 1997

대용량, 고속 정보처리가 요구되는 System의 모듈은 Data 처리의 고속성 및 회로의 고집적이 가능한 MCM의 형태로 구현되어 ATM, GPS 및 PCS 등의 분야에 광범위하게 응 용되고 있다. 위와 같은 High Speed 응용분야에서의 System 성능은 Interconnect Line의 전달지연, 임피던스 부정합에 의한 신호 반사 손실. 신호선 간의 Crosstalk, Ground Bounce 등의 현상에 대한 최적화 여부에 결정적인 영향을 받는다. 그러나 Interconnect의 특성상 정 형이 존재하지 않으므로 추상적인 Library를 구축하는 형식으로 접근할 수밖에 없으며 이를 위하여 여러기본 구조를 정의한후 각 Dimension을 변수로 두고 해석 결과를 합성하여 Database화하는 접근방식이다. 본 논문에서는 MCM-D 공정을 이용하여 Interconnect Line 특성을 분석하고 Database화 하기 위한 Test Pattern을 구현하고 Time Domain reflectometry(TDR)을 이용하여 그특성들을 측정 분석하였다. Test pattern 제작은 MCM-D 공정으로 최소선폭 27$\mu$m, Via Hole 75$\mu$m으로 형성하였고 2 Layer Signal과 GND로 총 3Layer를 구현하였다. 특성분석을 위해 TDR장비와 모데링 및 Simulation S/W인 IPA 510 을 사용하였다. 이를 통해 MCM-D를 이용한 공정에서 Interconcet Line의 고주파 특성을 측정하고 정량화하여 LIbrary를 제작할수 있었다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제7권3호
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• pp.133-139
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• 2007

Future MEMS systems will be composed of larger varieties of devices with very different functionality such as electronics, mechanics, optics and bio-chemistry. Integration technology of heterogeneous devices must be developed. This article first deals with the current development trend of new fabrication technologies; those include self-assembling of parts over a large area, wafer-scale encapsulation by wafer-bonding, nano imprinting, and roll-to-roll printing. In the latter half of the article, the concept towards the heterogeneous integration of devices and functionality into micro/nano systems is described. The key idea is to combine the conventional top-down technologies and the novel bottom-up technologies for building nano systems. A simple example is the carbon nano tube interconnection that is grown in the via-hole of a VLSI chip. In the laboratory level, the position-specific self-assembly of nano parts on a DNA template was demonstrated through hybridization of probe DNA segments attached to the parts. Also, bio molecular motors were incorporated in a micro fluidic system and utilized as a nano actuator for transporting objects in the channel.

• 반도체디스플레이기술학회지
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• 제3권3호
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• pp.5-9
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• 2004

A new wafer level packaging scheme is presented as an alternative to MEMS package. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the idea for MEMS wafer level packaging. The scheme of this work is developed using an electroplated tin (Sn) solder. The critical difference over conventional ones is that wafers are laterally bonded by solder reflow after LEGO-like assembly. This lateral bonding scheme has merits basically in morphological insensitivity and its better bonding strength over conventional ones and also enables not only the hermetic sealing but also its electrical interconnection solving an open-circuit problem by notching through via-hole. The bonding strength of the lateral bonding is over 30 Mpa as evaluated under shear and the hermeticity of the encapsulation is 2.0$\times10^{-9}$mbar.$l$/sec as examined by pressurized Helium leak rate. Results show that the new scheme is feasible and could be an alternative method for high yield wafer level packaging.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.74-78
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• 2002

MEMS공정을 이용하여 폴리실리콘의 piezoresistivity를 이용한 스트레인 센서어레이를 제작하였고, 이 센서 어레이를 flexible substrate에 패키징하는 공정을 개발하였다. 실리콘 웨이퍼에 표면 가공(surface micromachining)된 센서는 폴리이미드 코팅, release-etch 방법을 통해 웨이퍼로부터 분리되어 폴리이미드를 기판으로 하는 flexible sensor array module을 완성할 수 있었다. 공정은 희생층과 절연층을 증착하고 폴리실리콘 0.5 $\mu\textrm{m}$을 증착, 도핑 및 패터닝하여 센서 어레이를 구성하였다. 이 센서어레이를 flexible substrate에 패키징 하기 위해서 폴리이미드를 코팅하여 15 $\mu\textrm{m}$의 막을 구성하였고, 100% $O_2$RIE를 이용한 선택적 식각 방법으로 via hole을 구성하였다. 이후 전기도금을 통해 회로를 구성하여 1단계 패키징(die to chip carrier)과 2단계 패키징(chip to substrate)을 웨이퍼 레벨에서 완성하였다. 희생층을 제거함으로서 웨이퍼로부터 센서어레이 모듈을 분리하였다. 제작되어진 센서 모듈은 임의의 곡면에 실장이 가능하도록 충분한 flexibility를 얻을 수 있었다.

• 한국전기전자재료학회논문지
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• 제19권6호
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• pp.558-562
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• 2006

We have synthesized a new p-type polymer, poly(9,9'-n-dioctylfluorene-alt-phenoxazine) (PFPO), via the palladium catalyzed coupling reaction. The number average molecular weight ($M_n$) of PFPO was found to be 23,000. PFPO dissolves in common organic solvents such as chloroform and toluene. The UV-visible absorption maximum of the PFPO thin film is clearly blue-shifted with respect to that of F8T2, poly-(9,9'-n-dioctylfluorene-alt-bithiophene). The introduction of the phenoxazine moiety into the polymer system results in better field-effect transistor (FET) performance than that of F8T2. A solution processed PFPO TFT device with a top contact geometry was found to exhibit a hole mobility of $2.7{\times}10^{-4}cm^2/Vs$ and a low threshold voltage of -2 V with high on/off ratio(${\sim}10^4$).