• Title/Summary/Keyword: Vapor phase

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Property of Nickel Silicides with 10 nm-thick Ni/Amorphous Silicon Layers using Low Temperature Process (10 nm-Ni 층과 비정질 실리콘층으로 제조된 저온공정 나노급 니켈실리사이드의 물성 변화)

  • Choi, Youngyoun;Park, Jongsung;Song, Ohsung
    • Korean Journal of Metals and Materials
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    • v.47 no.5
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    • pp.322-329
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    • 2009
  • 60 nm- and 20 nm-thick hydrogenated amorphous silicon (a-Si:H) layers were deposited on 200 nm $SiO_2/Si$ substrates using ICP-CVD (inductively coupled plasma chemical vapor deposition). A 10 nm-Ni layer was then deposited by e-beam evaporation. Finally, 10 nm-Ni/60 nm a-Si:H/200 nm-$SiO_2/Si$ and 10 nm-Ni/20 nm a-Si:H/200 nm-$SiO_2/Si$ structures were prepared. The samples were annealed by rapid thermal annealing for 40 seconds at $200{\sim}500^{\circ}C$ to produce $NiSi_x$. The resulting changes in sheet resistance, microstructure, phase, chemical composition and surface roughness were examined. The nickel silicide on a 60 nm a-Si:H substrate showed a low sheet resistance at T (temperatures) >$450^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate showed a low sheet resistance at T > $300^{\circ}C$. HRXRD analysis revealed a phase transformation of the nickel silicide on a 60 nm a-Si:H substrate (${\delta}-Ni_2Si{\rightarrow}{\zeta}-Ni_2Si{\rightarrow}(NiSi+{\zeta}-Ni_2Si)$) at annealing temperatures of $300^{\circ}C{\rightarrow}400^{\circ}C{\rightarrow}500^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate had a composition of ${\delta}-Ni_2Si$ with no secondary phases. Through FE-SEM and TEM analysis, the nickel silicide layer on the 60 nm a-Si:H substrate showed a 60 nm-thick silicide layer with a columnar shape, which contained both residual a-Si:H and $Ni_2Si$ layers, regardless of annealing temperatures. The nickel silicide on the 20 nm a-Si:H substrate had a uniform thickness of 40 nm with a columnar shape and no residual silicon. SPM analysis shows that the surface roughness was < 1.8 nm regardless of the a-Si:H-thickness. It was confirmed that the low temperature silicide process using a 20 nm a-Si:H substrate is more suitable for thin film transistor (TFT) active layer applications.

Deposition of Poly-$Si_{1-x}Ge_x$ Thin Film by RTCVD (RTCVD에 의한 다결정 $Si_{1-x}Ge_x$ 박막 증착)

  • Kim, Jae-Jung;Lee, Seung-Ho;So, Myeong-Gi
    • Korean Journal of Materials Research
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    • v.5 no.6
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    • pp.690-698
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    • 1995
  • The Poly-S $i_{1-x}$G $e_{x}$ thin films were deposited on oxidized Si wafer by RTCVD(rapid thermal chemical vapor deposition) using Si $H_4$and Ge $H_4$, at 450 ~5$50^{\circ}C$. The variation of Ge mole fraction and the deposition rate of S $i_{1-x}$G $e_{x}$ thin film were studied as a function of the deposition temperature and the Ge $H_4$/Si $H_4$input ratio, and the crystal phase and the surface roughness were studied by XRD and AFM(atomic force microscopy), respectively. The experimental results showed that the activation energy for the deposition of poly-S $i_{1-x}$G $e_{x}$ was about 32~37Kca /mol and the deposition rate of S $i_{1-x}$G $e_{x}$ thin films was increased with increasing the deposition temperature and the input ratio. From the analysis of composition, it was known that the Ge mole fraction within the poly-S $i_{1-x}$G $e_{x}$ thin film was decreased with decreasing the input ratio and increasing the deposition temperature. As-deposited S $i_{1-x}$G $e_{x}$ thin films were polycrystalline over the entire experimental range. But those were amorphous at the deposition temperature of 450, 475$^{\circ}C$ and the input ratio of 0.05. By adding the Ge $H_4$, poly-S $i_{1-x}$G $e_{x}$ thin film were deposited at relatively lower deposition temperatures($\leq$ 5$50^{\circ}C$) than those of conventional poly-Si(>$600^{\circ}C$). From surface roughness measurement of poly-S $i_{1-x}$G $e_{x}$ it was found that the surface roughness( $R_{i}$ ) increased with increasing the deposition temperature and input ratio.and input ratio.

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Characterization of Respirable Suspended Particles and Polycyclic Aromatic Hydrocarbons associated with Environmental Tobacco Smoke

  • Baek, Sung-Ok;Park, Jin-Soo;Kim, Mi-Hyun;Roger A, Jenkins
    • Journal of Korean Society for Atmospheric Environment
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    • v.16 no.E
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    • pp.1-17
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    • 2000
  • In this study, the concentrations of particulate organic constituents of environmental tobacco smoke(ETS) were determined using an environmental smog chamber, where ETS is the sole source of target compounds. ETS was generated in a 30 ㎥ environmental chamber by a number of different cigarettes, including the Kentucky 1R4F reference cigarette and eight commercial brands. A total of 12 experimental runs was conducted, and target analytes included a group of ETS markers both in vapor and particulate phase and a class of polycylic aromatic hydrocarbos(PAHs) associated with ETS particles. The mass concentrations of PAH in ETS particles were also determined. The average contents of benzo(a) pyrene and benzo(a) anthracene in ETS particles for the commercial brands were 12.8 and 21.5$\mu\textrm{g}$/g, respectively, There values are all somewhat higher than those determined previously by other studies. Results form the chamber study are further used to estimate the average and variability of cigarette yields for target compounds associated with ETS. Finally, ratios of RSP to the surrogate standards of UVPM, FPM and solanesol were calculated for each sample. The average conversion factors factors for the eight commercial brands were 7.3, 38, and 41 for UVPM, EPM, and solanesol, respectively. The UVPM and FPM factors are in good agreement with the recently published values. Whereas there might be a substantial difference in the solanesol content among cigarettes produced in different countries, the variability is somewhat greater than those of UVPM and FPM, Unfortunately, comparison of the PAH yield data from this study with literature values was complicated by a lack of consistency in cigarette smoke generating methodology. Validation of the PAH yields was also difficult due to a lack of information on the ETS related PAH in the literature. From and engineering viewpoint , however, these data on the cigarette yields of ETS components may still provide useful information to studies on the mathematical modeling of indoor air quality management regarding tobacco smoke as a source of interest, or to studies on the assessment of human exposure to ETS.

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Studies on Partition and Extraction Equilibria of Metal-Dithiocarbamate Complexes(Ⅰ). Solvent Extraction of Inorganic Trace Mercury(Ⅱ) (Dithiocarbamate 금속착물의 분배 및 추출평형 (제 1 보) 흔적량 무기수은(Ⅱ)의 용매추출)

  • Ho-Seong Choi;Jong-Moon Choi;Hee-Seon Choi;Young-Sang Kim
    • Journal of the Korean Chemical Society
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    • v.38 no.12
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    • pp.898-907
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    • 1994
  • The solvent extraction of an inorganic trace mercury in sea water samples was studied using zinc diethyldithiocabamate $Zn(DDC)_2$ as chelating agent. The $Zn(DDC)_2$ which maintained the stability of DDC- in the acidic aqueous solution in the course of extraction was synthesized from NaDDC and $ZnSO_4$ in this laboratory. The trace of mercury(Ⅱ) was extracted at pH 3.0 from 100 ml of sea water into 10ml of chloroform containing 0.05 M $Zn(DDC)_2$ by shaking for 5 minutes. And from the organic phase, the $Hg(DDC)_2$ was back-extracted into 10ml of 1 to 1 mixed acid of each 3% (v/v) nitric acid and hydrochloric acid by shaking for 25 minutes. The mercury back-extracted was determined by a cold vapor atomic absorption spectrophotometry. The trace mercury(Ⅱ) was so successfully extracted that this procedure could be applied to its determination in the sea water. That is, the recoveries of mercury in two kinds of samples into which as given amount of Hg(Ⅱ) was spiked were 90.0% and 93.3%, respectively.

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The molten KOH/NaOH wet chemical etching of HVPE-grown GaN (HVPE로 성장된 GaN의 용융 KOH/NaOH 습식화학에칭)

  • Park, Jae Hwa;Hong, Yoon Pyo;Park, Cheol Woo;Kim, Hyun Mi;Oh, Dong Keun;Choi, Bong Geun;Lee, Seong Kuk;Shim, Kwang Bo
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.24 no.4
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    • pp.135-139
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    • 2014
  • The hydride vapor phase epitaxy (HVPE) grown GaN samples to precisely measure the surface characteristics was applied to a molten KOH/NaOH wet chemical etching. The etching rate by molten KOH/NaOH wet chemical etching method was slower than that by conventional etching methods, such as phosphoric and sulfuric acid etching, which may be due to the formation of insoluble coating layer. Therefore, the molten KOH/NaOH wet chemical etching is a better efficient method for the evaluation of etch pits density. The grown GaN single crystals were characterized by using X-ray diffraction (XRD) and X-ray rocking curve (XRC). The etching characteristics and surface morphologies were studied by scanning electron microscopy (SEM). From etching results, the optimum etching condition that the etch pits were well independently separated in space and clearly showed their shape, was $410^{\circ}C$ and 25 min. The etch pits density obtained by molten KOH/NaOH wet chemical etching under optimum etching condition was around $2.45{\times}10^6cm^{-2}$, which is commercially an available materials.

Experimental Study on Heat Flux Partitioning in Subcooled Nucleate Boiling on Vertical Wall (수직 벽면에서 과냉 핵비등 시 열유속 분배에 관한 실험적 연구)

  • Song, Junkyu;Park, Junseok;Jung, Satbyoul;Kim, Hyungdae
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.38 no.6
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    • pp.465-474
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    • 2014
  • To validate the accuracy of the boiling heat flux partitioning model, an experiment was performed to investigate how the wall heat flux is divided into the three heat transfer modes of evaporation, quenching, and single-phase convection during subcooled nucleate boiling on a vertical wall. For the experimental partitioning of the wall heat flux, the wall heat flux and liquid-vapor distributions were simultaneously obtained using synchronized infrared thermometry and the total reflection technique. Boiling experiments of water with subcooling of $10^{\circ}C$ were conducted under atmospheric pressure, and the results obtained at the wall superheat of $12^{\circ}C$ and average heat flux of $283kW/m^2$were analyzed. There was a large difference in the heat flux partitioning results between the experiment and correlation, and the bubble departure diameter and bubble influence factor, which account for a portion of the surrounding superheated liquid layer detached by the departure of a bubble, were found to be important fundamental boiling parameters.

Role of Crystallographic Tilt Angle of GaAs Substrate Surface on Elastic Characteristics and Crystal Quality of InGaP Epilayers (GaAs 기판표면의 Tilt각도가 InGaP 에피막의 탄성특성 및 결정질에 미치는 영향)

  • 이종원;이철로;김창수;오명석;임성욱
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.1
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    • pp.1-10
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    • 1999
  • InGaP epilayers were grown on the flat, $2^{\circ}$off, $6^{\circ}$ off, and $10^{\circ}$off GaAs substrates by organo-metallic vapor phase epitaxy, and influences of crystallographic misorientation of the substrate on the structural and optical properties such as lattice mismatch, elastic strain, lattice curvature, misfit stress, and PL intensity /line-width were investigated in this study. Material characterizations were carried out by TXRD( tripple-axis x-ray diffractometer) and low temperature (11K) PL (photoluminescence). With increase of the substrate misorientation angle (S.M.A.), the relative incorporation of Ga atoms on the substrate surface was found to be enhanced. Also, with increase of the S. M. A., the x-ray line-width of the InGaP epilayer was reduced, indicating that the crystal quality of the epilayer could be improved tilth a misoriented substrate. It was also found that the elastic accommodation of the strain-free lattice misfit was more remarkable in a misoriented sample. PL intensity increased, and PL line-width and emission wavelength decreased with the increase of S. M. A. The results conclude that the elastic characteristics and the crystal quality of the InGaP epilayer could be remarkably enhanced when the misoriented substrates were employed.

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Thermal CVD of Silica Thin Film by Organic Silane Compound (유기 실란화합물을 이용한 SiO2 박막의 열CVD)

  • Kim, Byung-Hoon;Ahn, Ho-Geun;Imaishi, Nobuyuki
    • Applied Chemistry for Engineering
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    • v.10 no.7
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    • pp.985-989
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    • 1999
  • Silica($SiO_2$) thin film was synthesized by a low pressure metal organic chemical vapor deposition(LPMOCVD) using organic silane compound. Triethyl orthosilicate was used as a source material. Operation pressure was 1~100 torr at outlet of the reactor and deposition temperature was $600{\sim}900^{\circ}C$. The experimental results showed that the high reaction temperature and high source gas concentration led to higher growth rate of $SiO_2$. The step coverage of films on micro-scale trenches was fairly good, which resulted from the phenomena that the condensed oligomers flow into the trenches. We estimated a reaction path that the source gas polymerizes and produces oligomers (dimer, trimer, tetramer, etc.), which diffuse and condense on the solid surface. The chemical species in the gas phase at the outlet of reactor tube were analyzed by quadrapole mass spectrometer. The peaks, assigned to be monomer, dimer of source gas and geavier molecules, were observed at 650 or $700^{\circ}C$. At higher temperature($900^{\circ}C$), the peaks of the heavy molecules disappeared, because almost all the source gas and intermediate(polymerized oligomer) molecules were oxidized or condensed on colder tube wall.

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Formation of GaN microstructures using metal catalysts on the vertex of GaN pyramids (금속촉매를 이용한 GaN 피라미드 꼭지점 위의 마이크로 GaN 구조 형성)

  • Yun, W.I.;Jo, D.W.;Ok, J.E.;Jeon, H.S.;Lee, G.S.;Jung, S.K.;Bae, S.M.;Ahn, H.S.;Yang, M.
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.21 no.3
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    • pp.110-113
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    • 2011
  • In this paper, we propose a new method for the fabrication of GaN microstructures formed only on the vertex of GaN pyramid by using of metal catalysts. GaN pyramidal structures were selectively grown on 3 ${\mu}m$ $SiO_2$ dot patterns followed by thin film deposition of Au and Cr only on the vertex area of the GaN pyramids with precisely controlled photolithography. After the metal deposition, the samples were loaded in the MOVPE reactor for the growth of GaN microstructures for 10 minutes. Temperature for the growth of the GaN microstructures was changed from $650^{\circ}C$ to $750^{\circ}C$. Rod type GaN microstructures were grown in the direction of vertical to the six {1-101} facets and the shape of the GaN microstructures was changed depend on the type of metal.

Growth and optical characteristics of the non-phosphor white LED by mixed-source HVPE (혼합소스 HVPE에 의한 비형광체 백색 LED의 성장과 광 특성)

  • Kim, E.J.;Jeon, H.S.;Hong, S.H.;Han, Y.H.;Lee, A.R.;Kim, K.H.;Ha, H.;Yang, M.;Ahn, H.S.;Hwang, S.L.;Cho, C.R.;Kim, S.W.
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.19 no.2
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    • pp.61-65
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    • 2009
  • In this paper, we report on the growth and optical characteristics of white-LED without fluorescent material. The growth of DH(double heterostructure) with AlGaN active layer was performed on a n-GaN/(0001) $Al_{2}O_{3}$ by the mixed-source HVPE and multi-sliding boat. The CRI(color rendering index) of packaging device charged in the range 72-93 with CIE chromaticity coordinates(x=$0.26{\sim}0.34$, y=$0.31{\sim}0.40$). And CCT(correlated color temperature) values was measured $5126{\sim}10406K$ with increasing injection current. The CIE point of conventional phosphor white LED shifts blue region, but cm point of non-phosphor white LED shifts opposite direction. These results show the mixed-source HVPE can be possible to newly fabricate method of phosphor free white LED with high CRI value.