• 제목/요약/키워드: Vacuum printing encapsulation system

검색결과 2건 처리시간 0.016초

진공 프린팅 성형 인쇄법(VPES)을 이용한 R.G.B.Y(Red, Green, Blue, Yellow) LED 광원 연구 (A Study on RGBY LED Light using a Vacuum Printing Encapsulation Systems Method)

  • 장민석;김영우;신기해;박정욱;홍진표;송상빈;김재필
    • 조명전기설비학회논문지
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    • 제25권2호
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    • pp.10-18
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    • 2011
  • In order to develop highly-integrated RGBY(Red, Green, Blue, Yellow) LED light, a high thermal radiation ceramic package was manufactured, and the encapsulation process was applied with a vacuum printing encapsulation system(VPES). After the completion of vacuum printing, the shape of the encapsulation layer could be controlled by heat treatment during the curing process, and the optical power became highly increased as the encapsulation layer approached a dome shape. The optical characteristics involved in a Correlated Color Temperature(CCT), a Color Rendering Index (CRI), and the efficiency of RGBY LED light were able to be identified by the experimental designing method. Regarding the characteristics of the white light of RGBY LED light, which were measured on the basis of the aforementioned optical characteristics, CRI posted 88, CCT recorded 5,720[$^{\circ}K$], and efficiency exhibited 52[lm/W]. The chip temperature of RGBY LEDs was below 55[$^{\circ}C$] when the consumption power of LED chips was 0.1[W] for the red, 0.3[W] for the green, 0.08[W] for the blue, and 0.24[W] for the yellow. Also, the thermal resistance of the highly-integrated RGBY LED light measured by T3Ster was 2.3[K/W].

이중 몰딩에 의한 백색 LED의 광추출 효율 향상 (Enhancement of Light Extraction in White LED by Double Molding)

  • 장민석;김완호;강영래;김기현;송상빈;김진혁;김재필
    • 한국전기전자재료학회논문지
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    • 제25권10호
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    • pp.849-856
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    • 2012
  • Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.