• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.355-358
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• 2003

This paper presents characteristics of vacuum preloaded porous air bearing. Pressure distribution of a porous pad and vacuum pocket are calculated. And load capacity and stiffness of the bearing are analyzed with various vacuum parameters, that is. clearance height. tube diameter, tube length. pumping speed of vacuum pump, vacuum pocket to porous pad area ratio. From the simulation results, optimum clearance for best performance can be selected adjusting these parameters, especially tube diameter which is the most dominant source.

• 대한조선학회논문집
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• 제59권3호
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• pp.157-163
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• 2022

An automatic mooring system for a ship consists of a vacuum suction pad and a mechanical part, enabling quick and safe mooring of a ship. In the development of a mooring system, the design of a vacuum suction pad is a key to secure enough mooring forces and achieve stable operation of a mooring system. In the vacuum suction pad, properly designing its rubber seal determines the performance of the suction pad. Therefore, it is necessary to appropriately design the rubber seal for maintaining a high-vacuum condition inside the pad as well as achieving its mechanical robustness for long-time use. Finite element analysis for the design of the rubber seal requires the use of an appropriate strain energy function model to accurately simulate mechanical behavior of the rubber seal material. In this study, we conducted simple uniaxial tensile testing of Chloroprene Rubber (CR) to explore the strain energy function model best-fitted to its experimentally measured engineering strain-stress curves depending on various temperature environments. This study elucidates the temperature-dependent mechanical behaviors of CR and will be foundational to design rubber seal for an automatic mooring system under various temperature conditions.

• 한국산업융합학회 논문집
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• 제21권4호
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• pp.175-181
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• 2018

Stamping process and rubber pad forming process were performed to manufacture the bipolar plate for fuel cells. For that, a vacuum die casting process and a semi-solid forming process wherein liquid-state materials were used were adopted. After preparing the blank with the stainless steel thin plate having a thickness of 0.1 mm, the bipolar plate channel was formed with the stamping process and rubber pad forming process. The depth of the bipolar plate channel prepared by the stamping method was 0.45 mm and the depth of the bipolar plate channel prepared by the rubber pad forming process was 0.41 mm. Meanwhile, with the vacuum die casting and semi solid forming, the bipolar plate having a channel depth of 0.3 mm, same as the size of the die, could be formed.

• 한국인터넷방송통신학회논문지
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• 제20권5호
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• pp.79-88
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• 2020

본 연구에서는 태양광 패널 청소 로봇이 진공 패드 압력을 이용하여 경사진 패널 위를 미끄러짐 없이 효율적으로 주행하는 방법을 제안한다. 이 방법에서는 로봇을 경사로 패널에 고정시키기 위해 로봇 발에 부착된 고무 패드의 압력을 진공으로 만들게 된다. 구동 방식으로 Linkage 매커니즘을 적용하여 미끄러짐을 방지함과 동시에 중량을 감소하여 소모전력을 낮추는 방법을 제안하였다. 로봇의 안전한 구동을 위하여 솔레노이드 밸브, 근접 센서, 엔코더를 사용하여 로봇의 움직임을 감지하며, 주행할 때 고무 패드의 압력을 제어하여 안전한 경사로 주행을 가능하게 하였다. 로봇의 전진 동작을 위하여 다중의 솔레노이드 밸브들의 동작 시퀀스를 완성하여 양쪽 발에 부착된 6개의 진공패드가 진공 및 대기압을 정확하게 형성 할수 있도록 제어하여 이동 중 미끄러짐 없이 전진할 수 있게 하였다. 마지막으로 주행 및 회전 실험을 통해 36도의 태양광 패널에서 직진 및 회전 동작을 수행할 수 있음을 확인하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.434-437
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• 2005

Chemical Mechanical Polishing (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. In general, CMP is a surface planarization method in which a silicon wafer is rotated against a polishing pad in the presence of slurry under pressure. The polishing pad, generally a polyurethane-based material, consists of polymeric foam cell walls, which aid in removal of the reaction products at the wafer interface. It has been found that the material removal rate of any polishing pad decreases due to the so-called 'pad glazing' after several wafer lots have been processed. Therefore, the pad restoration and conditioning has become essential in CMP processes to keep the urethane polishing pad at the proper friction coefficient and to allow effective slurry transport to the wafer surface. Diamond pad conditioner employs a single layer of brazed bonded diamond crystals. Due to the corrosive nature of the polishing slurry required in low pH metal CMP such as copper, it is essential to minimize the possibility of chemical interaction between very low pH slurry (pH <2) and the bond alloy. In this paper, we report an exceptional protective coated conditioner for in-situ pad conditioning in low pH Cu CMP process. The protective Cr-coated conditioner has been tested in slurry with pH levels as low as 1.5 without bond degradation.

• 한국정밀공학회지
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• 제23권10호
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• pp.103-112
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• 2006

This paper describes a theoretical analysis and experimental verification on the performances of a vacuum-compatible air bearing, which is designed with a cascaded exhaust scheme to minimize the air leakage in a vacuum environment. The design of the vacuum-compatible air bearing equipped with the differential exhaust system requires great care because several design parameters, such as the number of exhaust stages, diameter of exhaust tube, pumping speed of a vacuum pump, and bearing clearance greatly influence the air leakage and thus degree of vacuum. In this study, a performance analysis method was proposed to estimate the performances of the air bearing, such as load capacity, stiffness, and air leakage. Results indicate that the load capacity and stiffness of the air bearing was improved as its boundary pressure, which was determined by the $1^{st}$ exhaust method, was lowered, and the dominant factors on the chamber's degree of vacuum were the number of exhaust stages, exhaust tube diameter and bearing clearance. A vacuum chamber and air bearing stage using porous pad were fabricated to verify the theoretical analysis. The results demonstrate that chamber pressure up to an order of $10^{-3}$ Pa was achieved with the air bearing stage operating inside the chamber, and this analysis method was valid by comparing predicted values with experimental data, for the mass flow rates from the porous pad, and pressures at each exhaust port and chamber, respectively.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.854-857
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• 2000

Chemical Mechanical Polishing(CMP) has been accepted as one of the essential processes for VLSI fabrication. However, as the polishing process continues, pad pores get to be glazed by polishing residues, which hinder the supply of new slurry. This defect makes removal rate decrease with a number of polished wafer and the desired within-chip planarity, within wafer and wafer-to-wafer nonuniformity are unable to be achieved. So, pad conditioning is essential to overcome this defect. The eletroplated diamond grit disk is used as the conventional conditioner, And alumina long fiber, the .jet power of high pressure deionized water and vacuum compression are under investigation. But, these methods have the defects like scratches on wafer surface by out of diamond grits, subsidences of pad pores by over-conditioning, and the limits of conditioning effect. To improve these conditioning methods. this paper presents the Characteristics of Ultrasonic conditioning aided by cavitation.

• 산업기술연구
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• 제34권
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• pp.67-70
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• 2014

In this paper, we propose a diagnosis algorithm for 25.8kV $N_2$ insulated Pad-mounted Switchgear in oder to improve reliability by preventing of fault in advance. The proposed algorithm can diagnose the problems of Pad-mounted Switchgear such as gas leakage and VI(Vacuum Interrupter) trouble (contact abrasion, coil aging etc.) by using pressure sensor, stroke sensor and coil current sensor.

• 한국산학기술학회논문지
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• 제17권3호
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• pp.622-628
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• 2016

자동차에 부착하여 사용하는 자전거 캐리어 지지용 흡착 패드는 운행 중 임의의 진동과 원심력과 같은 과도한 동적 하중을 받을 수 있어, 구조 안전성의 검토가 중요하다. 이를 위해서는 유체-구조 연계 유한요소해석을 이용하여 패드의 하부 압력이 패드에 가해지는 하중이나 모멘트의 변화에 따라 실시간으로 변화하는 것을 고려하여야 하나, 실제 상황의 모델링이 어렵고 계산을 위한 소프트웨어 비용이 높은 단점이 있기도 하지만, 정확한 결과를 얻기도 어렵다. 따라서 이 논문에서는 실험과 전산적인 방법을 조합하여 활용하는 새로운 방법을 제시한다. 이는 변화하는 하중에 따라 패드 하부의 압력과 접촉 면적을 실시간으로 측정하고 여기서 얻어진 데이터를 비선형 탄성 유한요소해석에 입력하여 활용하는 방법이다. 개발 단계의 제품 형상으로 실험 및 계산을 수행한 결과, 마운트 패드는 축 방향 하중에 대해서는 비교적 안전하나, 회전 하중이 과도하게 작용할 경우 패드가 바닥으로부터 분리되거나 패드 표면에 국부적인 손상이 일어날 수 있어 안전 여유가 많지 않음을 보여주었다. 작용하는 하중의 크기 및 형태에 따라 변화하는 접촉 거동을 예측하는 결과는 실험 결과와 잘 일치하였다. 본 연구에서 제안하는 해석 방법은 유사한 흡착 패드 시스템을 설계할 때 유용하게 활용될 수 있을 것으로 보인다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.86-89
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• 2003

Chemical Mechanical Planarization(CMP) has been accepted as the most effective processes for ultra large scale integrated (ULSI) chip manufacturing. However, as the polishing process continues, pad pores get to be glazed by polishing residues, which hinder the supply of new slurry. And pad surface is ununiformly deformed as real contact distance. These defects make material removal rate(MRR) decrease with a number of polishied wafer. Also the desired within-chip planarity, within wafer non-uniformity(WIWNU) and wafer to wafer non-uniformity(WTWNU) arc unable to be achieved. So, pad conditioning in CMP Process is essential to overcome these defects. The eletroplated or brazed diamond conditioner is used as the conventional conditioning. And. allumina long fiber, the jet power of high pressure deionized water, vacuum compression. ultrasonic conditioner aided by cavitation effect and ceramic plate conditioner are once used or under investigation. But. these methods arc not sufficient for ununiformly deformed pad surface and the limits of conditioning effect. So this paper focuses on the characteristics of diamond conditioner which reopens glazed pores and removes ununiformly deformed pad away.