• Title/Summary/Keyword: Unit Fabrication

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A Study on Factory Product System of Unit Modular Housing System in Korea, United States, Japan, Europe (친환경 유닛모듈라 주택의 공장생산시스템에 관한 비교 연구 -한국, 미국, 일본, 유럽의 사례를 중심으로-)

  • Lim, Seok-Ho;Park, Keun-Sung;Chae, Chang-U;Kwon, Bo-Min
    • Journal of the Korean housing association
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    • v.18 no.4
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    • pp.27-35
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    • 2007
  • The use of light steel framing as a method of house construction has increased significantly throughout Japan, United States and Europe. Industrialized unit method are prevailing in developed countries. Unit modular house industry has supported an intensive technical development, and housing systems are now available, which are highly adaptable in form and use. Unit modular house have their own merits and demerits, but the more crucial aspect is that the constant design standard should be applied in each design procedure. It entails the necessity of industrial housing development on the open system basis. This paper describes the general forms of factory product system of unit modular housing system in Korea, United States, Japan. And this study attempts to propose the unit factory product system of which the rate of pre-fabrication is the biggest, that can cope with the demand of user on the basis of open-system.

Design and Fabrication of C-Band GaN Based on Solid State High Power Amplifier Unit for a Radar System (레이다용 C-대역 GaN 기반 고출력전력증폭장치 설계 및 제작)

  • Jung, Hyoung Jin;Park, Ji Woong;Jin, Hyoung Seok;Lim, Jae Hwan;Park, Se Jun;Kang, Min Woo;Kang, Hyun Chul
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.28 no.9
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    • pp.685-697
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    • 2017
  • In this paper, it is presented the result of design and fabrication for C-band solid state high power amplifier unit and components using in search radar. The solid state power amplifier(SSPA) assembly was fabricated using GaN(Gallium Nitride), which is semiconductor device, and the transmit signal output power of the solid state high power amplifier unit is generated by combining the transmit signal power of the solid state power amplifier configured in parallel through a design and fabricated waveguide type transmit signal combine assembler. Designed solid state high power amplifier unit demonstrated C-band 500 MHz bandwidth, maximum 10.5% duty cycle, transmit pulse width from $0.0{\mu}s{\sim}000{\mu}s$, and transmit signal power is 44.98 kW(76.53 dBm).

Characterization of the LSGM-Based Electrolyte-Supported SOFCs (LSGM계 전해질 지지형 고체산화물 연료전지의 특성평가)

  • Song, Eun-Hwa;Kim, Kwang-Nyeon;Chung, Tai-Joo;Son, Ji-Won;Kim, Joo-Sun;Lee, Hae-Weon;Kim, Byung-Kook;Lee, Jong-Ho
    • Journal of the Korean Ceramic Society
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    • v.43 no.5 s.288
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    • pp.270-276
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    • 2006
  • LSGM(($La_xSr_{1-x})(Ga_yMg_{1-y})O_3$) electrolyte is known to show very serious interfacial reaction with other unit cell components, especially with an anode. Such an interfacial reaction induced the phase instability of constituent component and deterioration of the unit cell performance, which become the most challenging issues in LSGM-based SOFCs. In this study, we fabricated LSGM($La_{0.8}Sr_{0.2}Ga_{0.83}Mg_{0.17}O_x$) electrolyte supported-type cell in order to avoid such interfacial problem by lowering the heat-treatment temperature of the electrode fabrication. According to the microstructural and phase analysis, there was no serious interfacial reaction at both electrolyte/anode and electrolyte/cathode interfaces. Moreover, from the electrochemical characterization of the unit cell performance, there was no distinct deterioration of the open cell voltage as well as an internal cell resistance. These results demonstrate the most critical point to be concerned in LSGM-based SOFC is either to find a proper electrode material which will not give any interfacial reaction with LSGM electrolyte or to properly adjust the processing variables for unit cell fabrication, to reduce the interfacial reaction.

Modularization of plant structures (플랜트 구조물의 모듈화 공법)

  • Seo, Han Seol;Chang, Sang Soo
    • Plant Journal
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    • v.13 no.3
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    • pp.30-35
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    • 2017
  • Module can be categorized as PAS(Pre-Assembled Steel structure), PAR(Pre-Assembled pipe Rack), PAU(Pre-Assembled Unit), VAU(Vendor Assembled Unit) and VPU(Vendor Package Unit). At the stage of design and fabrication of module, the condition of land and ocean transportation is considered and these conditions are reflected on the module division design. The control of the module's center of gravity is important to transport and install modules safely and the steel structure should have the strength enough to resist the sea acceleration force during the ocean transportation. The transportation condition and the installation method influence the size and weight of module. The size and weight of module are considered for the design of module division.

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Fabrication and Characterization of Array Tactile Actuator Based on Cellulose Acetate (셀룰로오스 아세테이트 기반 어레이 촉각 액추에이터의 제작 및 특성평가)

  • Kim, Hyun-Chan;Yun, Sungryl;Ko, Hyun-U;Kim, Jaehwan
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.8
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    • pp.743-748
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    • 2015
  • This paper reports the enhanced fabrication and characterization of a $3{\times}3$ array tactile actuator composed of cellulose acetate. The array tactile actuator, with dimensions of $15{\times}15{\times}1mm^3$, consists of 9 pillar-supported cells made from a cellulose-acetate molding. The fabrication process and performance test along with the results for the suggested actuator are explained. To improve the cell-array fabrication, a laser cut was adopted after the molding process. The displacement of the unit cell increased the input voltage and frequency. Various top masses are added onto the actuator to mimic the touch force, and the acceleration of the actuator is measured under actuation. When 2 kV is applied to the actuator, the maximum acceleration is 0.64 g, which is above the vibrotactile threshold. The actuation mechanism is associated with the electrostatic force between the top and bottom electrodes.

Development of Integrated Optical Pickup for Small Form Factor Optical Disc Drive (Small Form Factor 광 디스크 드라이브용 초소형 집적형 광픽업 개발)

  • Cho, Eun-Hyoung;Sohn, Jin-Seung;Lee, Myung-Bok;Suh, Sung-Dong;Kim, Hae-Sung;Kang, Sung-Mook;Park, No-Cheol;Park, Young-Pil
    • Transactions of the Society of Information Storage Systems
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    • v.2 no.3
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    • pp.163-168
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    • 2006
  • Small form factor optical pickup (SFFOP) corresponding to BD specifications is strongly proposed for the next-generation portable storage device. In order to generate SFFOP, small sized optical pickup has been fabricated. We have developed a small sited optical pickup that is called the integrated optical pickup (IOP). The fabrication method of this system is mainly dependant on the use of the wafer based micro fabrication technology, which has been used in MEMS process such as photolithography, reactive ion etching, wafer bonding, and packaging process. This approach has the merits for mass production and high assembling accuracy. In this study, to generate the small sized optical pickup for high recording capacity, IOP corresponding to BD specifications has been designed and developed, including three main parts, 1) design, fabrication and evaluation of objective lens unit, 2) design and fabrication of IOP and 3) evaluation process of FES and TES.

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Fabrication of a stamper and injection molding for micro pattern product (미세 패턴 제품 마스터 제작 및 성형 공정 기술 개발)

  • Yoo Y.E;Seo Y.H;Je T.J.;Choi D.S
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.216-219
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    • 2005
  • In recent, LCD becomes one of the main display devices and expected to have quite good market share during the next couple of years. The demand for low cost and high performance, however, is becoming severe as the competition among other display devices like PDP, OLED increases. To satisfy this demand from market, we need to optimize the parts or modules of the LCD, reduce the number of the assemble and enhance the process for the high brightness and uniformity of the LCD. The LCD consists mainly of LCD panel and Backlight unit(BLU). BLU, which takes big portion of the cost for LCD, consists of light source, light guide panel and many kinds of functional film. Recently light guide panel or film for BLU has micro patterns on its surface and consequently to reduce the number of parts and enhace the brightness and its uniformity. In this study, some methodologies for the fabrication of the master/stamper and molding the light quide panel are introduced for 50um pitch of prizm patterned substrate. Mechanical machining process is adapted and optimized to fabricate micro patterned stamper using the micro cutting tool. Injection molding technology is also developed to obtain uniformly replicated micro patterned products.

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Laser Marking for Light Guide Panel using Design of Experiment and Construction of Web-based Prototyping System (실험계획법을 이용한 도광판 레이저 마킹 및 웹기반 시스템 구축)

  • Kang H.J.;Kim H.J.;Ahn S.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.728-731
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    • 2005
  • A light guide panel (LGP) is an element of the LCD back light unit, which is used for display devices. In this study, a laser marking process is applied to the fabrication of light guide panels as the new fabrication process. In order to obtain a light guide panel which has high luminance and uniformity, four principal parameters such as power, scanning speed, ratio of line gap, and number of line were selected as important factors. A Web-based design tool was developed to generate patterns of light guide panel, and the tool may assist the designer to develop optimized patterns. Topcon-BM7 was used for luminance measurement of each specimen 100mm$\times$100mm area. By Taguchi method optimized levels of each parameters such as 40W of power, 30mm/s of scanning speed, 100:50 ratio of pattern gap, and 90 line of pattern were found by Taguchi method.

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Laser Marking for Light Guide Panel using Design of Experiment and Web-based Prototyping System (실험계획법과 웹기반 시스템에 의한 도광판의 레이저 마킹)

  • Kang Hyuk-Jin;Kim Hyung-Jung;Chu Won-Sik;Ahn Sung-Hoon
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.4 s.181
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    • pp.91-98
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    • 2006
  • A light guide panel (LGP) is an element of the LCD back light unit, which is used for display devices. In this study, the laser marking process is applied to the fabrication of light guide panels as the new fabrication process. In order to obtain a light guide panel which has high luminance and uniformity, four principal parameters such as power, scanning speed, ratio of line gap, and number of line were selected. A Web-based design tool was developed to generate patterns of light guide panel at any location, and the tool may assist the designer to develop optimized patterns. Topcon-BM7 was used for luminance measurement of each specimen with $100mm{\times}100mm$ area. By Taguchi method optimized levels of each parameters were found, and luminance of $3523cd/cm^2$ and uniformity of 92% were achieved using the laser machined BLU.

A Study on the Improvement of Optical Efficiency for The 2 inch LGP Considering Injection Molding Characteristics (사출성형 특성을 고려한 2인치 도광판의 광효율 향상에 관한 연구)

  • Do, Y.S.;Hwang, C.J.;Yoon, K.H.
    • Transactions of Materials Processing
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    • v.17 no.5
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    • pp.322-327
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    • 2008
  • LGP is a key component of LCD back light unit because it determines brightness and sharpness of the display image. Usually, it has optical patterns fabricated on the bottom surface. These optical patterns convert point or line sources placed in the side of LGP to plane source at the top surface by changing the propagating direction of the incident light. In the present paper the LiGA-reflow method was applied to fabricate the LGP mold. Furthermore, the optical simulation considering the replication ratio of pattern height was applied to the pattern design. The optical simulation through systematic correction scheme was adopted to find the optimum distribution of pattern density. Finally, the stamper fabricated by this method was installed in the mold and LGP was produced by injection molding. As a result of luminance measurement for the final product, the average luminance and luminance uniformity was measured 3,180 nit and 84%, respectively. Consequently, the mold fabrication method using the LiGA-reflow and optical simulation(CAE) can save the expense and time compared with the existing fabrication methods(laser ablation and chemical etching).