• Journal of computational fluids engineering
• /
• v.5 no.3
• /
• pp.8-15
• /
• 2000

This research is aimed to find out how the inlet angle of secondary air affects the uniformity of temperature distribution inside a small incinerator. A commercial code, PHOENICS, is used to simulate the thermal-flow field of an incinerator. The computational grid system is constructed by Multi-Block technique provided by PHOENICS. Numerical experiments are done with the five different angles of secondary air inlet. The uniformity of temperature distribution is evaluated by checking the standard deviation of temperature distribution in an incinerator. The computational results show that there is the minimum value of standard deviation at the certain angle of secondary air inlet, which means that there is an optimum angle of secondary air inlet that could improve the uniformity of temperature distribution in an incinerator. The optimum angle of secondary air inlet is between 30 degree and 45 degree in this particular case.

• Journal of computational fluids engineering
• /
• v.14 no.3
• /
• pp.1-8
• /
• 2009

Diverging channel from gas engine exit to the inlet section of Heat Recovery Steam Generator (HRSG) has been re-designed for 1 MW system. To improve the uniformity in velocity and temperature distribution of existing design(Case A and B), two additional test geometries have been chosen for the numerical simulation. At first, gas burner exit section has been centered to the inlet section of the boiler(Case C) and uniformity in velocity and temperature distribution has been improved considerably. Secondly, the diverging channel length can be further reduced to compact geometry with new guide vane design (Case D and E). Proposed design shows overall improvement in uniformity in velocity and temperature distribution compared to existing one.

• Proceedings of the KSME Conference
• /
• 2000.11b
• /
• pp.261-266
• /
• 2000

Temperature variation during silicon wafer baking is mainly due to natural convection caused by temperature difference between silicon wafer and upper plate. Several cases are tested and calculated numerically to improve temperature uniformity. The temperature difference and velocity magnitude in the flow cell is reduced for a small gap between the wafer and upper plate because the natural convection force is suppressed in the small space. The uniform temperature distribution can be obtained with controling the incoming flow distribution from the upper plate. An alternative method is the adiabatic wall condition on the upper plate to maintain the temperature uniformity within $0.3^{\circ}C$ on the water plate.

• 한국전산유체공학회:학술대회논문집
• /
• 2008.03a
• /
• pp.148-154
• /
• 2008

Diverging channel from gas burner exit to the inlet section of Heat Recovery Steam Generator (HRSG) has been re-designed for 1 MW system. To improve the uniformity in velocity and temperature distribution of existing design(Case A and B) of 300 kW HRSG system, two additional test geometries have been chosen for the numerical simulation. At first, gas burner exit section has been centered to the inlet section of boiler(Case C) and uniformity has been improved considerably. Secondly, the diverging channel length can be further reduced for compact geometry with new guide vane design (Case D and E). Proposed design shows overall improvement in uniformity in velocity and temperature distribution compared to existing one.

• Journal of Industrial Technology
• /
• v.20 no.B
• /
• pp.63-70
• /
• 2000

One aims to find out how the operation condition of secondary inlet angle effects the temperature distribution inside a small incinerator. A finite volume commercial code, PHONICS, is used to simulate the temperature field in an incinerator. The computational grid system is constructed by Multi-Block technique. The governing equations based on the curvilinear coordinates are used. Numerical experiments are done with the five variations of secondary air inlet. The temperature distribution is quantified by the statistical deviation of temperature in an incinerator. The computational analysis says that the certain angle of secondary air inlet could improve the uniformity of temperature distribution in an incinerator.

• Journal of Mechanical Science and Technology
• /
• v.19 no.10
• /
• pp.1950-1956
• /
• 2005

An analysis has been carried out to investigate the effect of the reflectivity on the temperature distribution of a glass panel by infrared radiant heating. Halogen lamps are used to heat the panel, located near the top and bottom of the rectangular chamber. The thermal energy is transferred from the lamps to the panel only by radiation and it is considered by using view factor. The conductive transfer is limited inside the panel. The results show that the uniformity of the temperature distribution of the panel is improved and, at the same time, the time for heating increases as the wall reflectivity increases. The temperature difference between the center and the corner reaches a maximum in the early stage of the heating process and then decreases until it reaches a uniform steady-state value.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.25 no.6
• /
• pp.647-653
• /
• 1988

A rapid thermal annealing system using tungsten halogen lamp has been designed and assembled. A control scheme where the temperature control is executed with calculated wafer temperature by considering the thermocouple delay rather than measured thermocouple temperature,is proposed. This control scheme gives more accurate control of the wafer temperature. In addition, the distribution of transmitted light power to the wafer in the system has been simulated, and lamp interval modification has been able to give more uniform light power distribution. Considering incident light spectrum, absorption, reflection, radiation of silicon, etc., temperature profile has been simulated. When the light power uniformity on the 3" wafer is below 1%, the temperature uniformity is about 2%.

• Journal of the Korean Society of Visualization
• /
• v.14 no.2
• /
• pp.25-30
• /
• 2016

The wafer temperature and its uniformity inside the LPCVD chamber were analyzed. The temperature uniformity at the end of the wafer load depends on the heat-insulating cap. The finite difference method was used to investigate the radiation and conduction heat transfer mechanisms, and the temperature field and heat diffusion in the LPCVD chamber was visualized. It was found that the temperature uniformity of the wafers could be controlled by the size and distance of the heat-insulating cap.

• Journal of the Korean institute of surface engineering
• /
• v.43 no.6
• /
• pp.304-308
• /
• 2010

Deposition temperature uniformity of GaN based MQW (multiple quantum well) layers is an important key which affects the wavelength uniformity of white LEDs. Temperature uniformity was assessed by infrared images for both cases of a static and a rotating susceptor. Rotating the susceptor at 2.5 rpm over the induction heater gave 4.3% of temperature non-uniformity. Temperature distribution of the graphite susceptor over the induction heater was numerically modelled and agreed with experimental results.

• Proceedings of the KSME Conference
• /
• 2003.11a
• /
• pp.278-283
• /
• 2003

Analysis has been carried out to investigate the temperature variation and the uniformity of the temperature distribution of the glass panel by infrared radiant heating. Halogen lamps are used to heat the panel and located near the top and bottom of the rectangular chamber. The thermal energy is transfered only by radiation and the radiation exchange occurs only on the solid surfaces and is considered by using the view factor. The results show that the uniformity of the temperature distribution of the panel is improved but the time for heating increases as the wall reflectivity is large. The temperature difference reaches a maximum in the early stage of the heating process and then decreases until it reaches the uniform steady-state value.