• 전기화학회지
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• 제12권4호
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• pp.317-323
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• 2009

돌출부를 지니고 있는 전극의 전기도금 공정에 대한 이론적 이차 전류분포에 대하여 고찰하였다. 전극이 모두 전도체인 경우(Case 1)와 돌출부위만 전도체인 경우(Case 2) 두 가지 경우에 대하여 인가전위, 이온교환 전류밀도와 용액의 비전도도의 비인 $\xi$값, aspect ratio의 영향 등에 대하여 살펴보았다. 그 결과 인가 전위와 $\xi$값이 증가할수록 전류분포는 불균등화가 심화됨을 알 수 있었다. Aspect ratio가 작아질수록 전류분포가 보다 균등화되며 Case 2의 경우가 Case 1의 경우 보다 균등도가 좋아짐을 알 수 있었다. 돌출부위가 다양한 모양으로 이루진 전극에 대해서도 이 모델을 적용한 결과 전극 표면에 따른 국부 전류분포를 동시에 계산할 수 있음을 알 수 있었고 이 경우에도 이전과 마찬가지로 $\xi$값이 감소할수록 전류분포의 균등도가 좋아짐을 알 수 있었다.

• 한국초전도ㆍ저온공학회논문지
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• 제14권2호
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• pp.16-19
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• 2012

The influence of current distribution on the transport current loss in vertically stacked high-$T_c$ superconductor (HTS) tapes was evaluated. AC loss was analyzed as a function of current distribution by introducing a current distribution parameter through a numerical method (finite element analysis). AC loss under non-uniform current distribution is always higher than that for a uniformly distributed transport current in a conductor. Although the effect of non-uniformity is relatively insignificant in low transport current, AC loss increases substantially in high transport current regions as non-uniformity is enlarged. The results verify that non-uniform current distribution causes extra loss by examining the cross-sectional view of current densities in stacked conductor.

• 한국재료학회지
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• 제14권3호
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• pp.196-202
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• 2004

A numerical simulation based on the finite element method is used to investigate the effect of a reciprocal paddle on the uniformity of deposition rates at a patterned electrode. The calculated deposition rates agreed well with the measured values. The influences of the paddle velocity, the gap between cathodes and paddles, anode size and the distance between the anode and cathode have been studied. The optimum conditions on the paddle and geometric factors for electrodeposit uniformity could be obtained.

• 한국표면공학회지
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• 제18권3호
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• pp.105-115
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• 1985

Lead-tin-copper ternary alloy electrodeposition is conducted onto the inner bore surface of plain bearings as an overlay in order to investigate the effect of slot width, current density and fluoboric acid concentration on the uniformity of overlay. The thickness of overlay is analyzed by means of current distribution resulting from the overvoltage of plating bath and the apparent distance between cathode and anode. The result demonstrate that the uniformity of overlay is remarkably dependent of the slot size and current density, but has little bearing on the fluoboric acid concentration over 100g/L. This present study indicates that uniform overlay is obtainable within the tolerable thickness of ${\pm}2{\mu}m$ by using the slot width of 22mm. The surface morphology examination also shows the important role of concentration polarization of the micro-uniformity of overlay. The micro-uniformity has improved at the low concentration polarization which resulted from operating at the low current density and high fluoboric acid concentration. The surface morphology of deposits exhibits the vivid pyramid crystalline in the plating condition of low concentration polarizatio and all deposits have columnar structure parallel to the applied electric field regardless of the electroplating condition used.

• 한국표면공학회지
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• 제24권3호
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• pp.125-136
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• 1991

a mathematical model is presented to describe the current distribution on a rotaing disk electrode under the galvanostatic pulse conlitions. A numerical technique by finite difference method to the transient convective diffusion equation, coordinate transformation and separation of variables to Laplace equation, and an iterative algorithm to solve the above equations simtltaneously with approximate boundary conditions were developed. An experimental investigated based on copper deposition in a copper sulfate-sulfuric acid system was performed and satisfactory agreement was obtained between expermental and theoretical current distribution. The current distribution of copper deposition is secondary current distribution within the experimental conditions. Dimensionless variables, N and J as well as Wagner number were used to determine the criteria for the uniformity of current distribution.

• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2008년도 추계학술대회
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• pp.599-610
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• 2008

It is an important and urgent issue to improve process capability in quality control. Process capability refers to the uniformity of the process. The variability in the process is a measure of the uniformity of output. A simple, quantitative way to express process capability, the degree of variability from target in specification is defined by process capability index(PCI). Almost process capability indices are defined under normal distribution. However, these indices can not be applied to the process of non-normal distribution including reliability. We investigate current research on the process of non-normal distribution, and advanced method and technology for developing more reliable and efficient PCI. Finally we suggest the perspective for future study.

• 한국표면공학회지
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• 제27권6호
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• pp.340-346
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• 1994

The method of uniforming current distribution in Hull cell are studied by using auxiliary anode, current shield bipolar electrode, and combinings bipolar electrode with current shield in order to find a way of uni-form deposition. The current density distributions are measured by each ammeter of the same inner resistance connected to divided cathode pannel respectively. The current density distributions of cathode electrode divided into five sections with 5mm width have a tendency of linear inclination, and that of twenty sections have a tendency of smoother curve than the curve of original Hull cell pannel. Their results showed lower value on the high current density portion and higher value on the low portion than that original Hull cell pannel. The current distribution in Hull cell is able to unify by using auxiliary anode, or combining bipo-lar electrode with current shield, but not efficient in using one of both individually.

• 한국광학회:학술대회논문집
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• 한국광학회 2000년도 하계학술발표회
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• pp.162-163
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• 2000

We have observed the short-channel effect, narrow-channel effect and small-geometry effect in terms of a variation of the threshold voltage. For a short-channel effect the threshold voltage was largely determined by the DIBL effect which stimulates more carrier injection in the channel by reducing the potential barrier between the source and channel. The effect becomes more significant for a shorter-channel device. However, the potential, field and current density distributions in the channel along the transverse direction showed a better uniformity for shorter-channel devices under the same voltage conditions. The uniformity of the current density distribution near the drain on the potential minimum point becomes worse with increasing the drain voltage due to the enhanced DIBL effect. This means that considerations for channel-width effect should be given due to the variation of the channel distributions for short-channel devices. For CCDs which are always operated at a pinch-off state the channel uniformity thus becomes significant since they often use a device structure with a channel length of > 4 ${\mu}{\textrm}{m}$ and a very high drain (or diffusion) voltage. (omitted)

• 한국연소학회:학술대회논문집
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• 한국연소학회 2004년도 제29회 KOSCI SYMPOSIUM 논문집
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• pp.217-222
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• 2004

In recent year, as the current and future emission regulations go stringent, the research of exhaust manifold and CCC has become the subject of increasing interest and attention. This study is concerned with the systematic approach to improve catalyst flow uniformity and light-off behavior through the basic understanding of exhaust flow characteristics. Computational approach to the unsteady compressible flow for exhaust manifold of 4-1 type and 4-2-1 type and CCC system of a 4-cylinder DOHC gasoline engine was performed to investigate the flow distribution of exhaust gases. In this study, through calculation, the effects of geometric configuration of exhaust manifold on flow structure and its maldistribution in monolith were mainly investigated to understand the exhaust flow patterns in terms of flow uniformity. Based on the design guidance resulting from this fundamental study, the flow uniformity of 4-2-1 type exhaust manifold demonstrated the more improved exhaust characteristics than that of the 4-1 type one.

• Korean Chemical Engineering Research
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• 제54권1호
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• pp.108-113
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• 2016

A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.