• Journal of the Korean Electrochemical Society
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• v.12 no.4
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• pp.317-323
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• 2009

Theoretical calculations for the secondary current distributions for the electrode with a projection part in electroplating were performed. Two kinds of electrodes were considered. One is a electrode with the overall conducting surfaces(Case 1) and the other is an electrode in which only a projection part has a conducting surface(Case 2). The effects of applied potential, the ratio of ion exchange current to conductivity, $\xi$ and the aspect ratio on the current distribution were examined. The increase of applied current or the value of $\xi$ decreased the uniformity of current distribution. The small value of aspect ratio resulted the more uniform current distribution and Case 2 showed the better uniformity than Case 2. When this model was applied into an electrode with various projection parts, the local current distribution along the electrode surface were obtained successfully. In this case, the decrease of $\xi$ also increase the uniformity of current distribution as seen previously.

• Progress in Superconductivity and Cryogenics
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• v.14 no.2
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• pp.16-19
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• 2012

The influence of current distribution on the transport current loss in vertically stacked high-$T_c$ superconductor (HTS) tapes was evaluated. AC loss was analyzed as a function of current distribution by introducing a current distribution parameter through a numerical method (finite element analysis). AC loss under non-uniform current distribution is always higher than that for a uniformly distributed transport current in a conductor. Although the effect of non-uniformity is relatively insignificant in low transport current, AC loss increases substantially in high transport current regions as non-uniformity is enlarged. The results verify that non-uniform current distribution causes extra loss by examining the cross-sectional view of current densities in stacked conductor.

• Korean Journal of Materials Research
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• v.14 no.3
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• pp.196-202
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• 2004

A numerical simulation based on the finite element method is used to investigate the effect of a reciprocal paddle on the uniformity of deposition rates at a patterned electrode. The calculated deposition rates agreed well with the measured values. The influences of the paddle velocity, the gap between cathodes and paddles, anode size and the distance between the anode and cathode have been studied. The optimum conditions on the paddle and geometric factors for electrodeposit uniformity could be obtained.

• Journal of the Korean institute of surface engineering
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• v.18 no.3
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• pp.105-115
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• 1985

Lead-tin-copper ternary alloy electrodeposition is conducted onto the inner bore surface of plain bearings as an overlay in order to investigate the effect of slot width, current density and fluoboric acid concentration on the uniformity of overlay. The thickness of overlay is analyzed by means of current distribution resulting from the overvoltage of plating bath and the apparent distance between cathode and anode. The result demonstrate that the uniformity of overlay is remarkably dependent of the slot size and current density, but has little bearing on the fluoboric acid concentration over 100g/L. This present study indicates that uniform overlay is obtainable within the tolerable thickness of ${\pm}2{\mu}m$ by using the slot width of 22mm. The surface morphology examination also shows the important role of concentration polarization of the micro-uniformity of overlay. The micro-uniformity has improved at the low concentration polarization which resulted from operating at the low current density and high fluoboric acid concentration. The surface morphology of deposits exhibits the vivid pyramid crystalline in the plating condition of low concentration polarizatio and all deposits have columnar structure parallel to the applied electric field regardless of the electroplating condition used.

• Journal of the Korean institute of surface engineering
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• v.24 no.3
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• pp.125-136
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• 1991

a mathematical model is presented to describe the current distribution on a rotaing disk electrode under the galvanostatic pulse conlitions. A numerical technique by finite difference method to the transient convective diffusion equation, coordinate transformation and separation of variables to Laplace equation, and an iterative algorithm to solve the above equations simtltaneously with approximate boundary conditions were developed. An experimental investigated based on copper deposition in a copper sulfate-sulfuric acid system was performed and satisfactory agreement was obtained between expermental and theoretical current distribution. The current distribution of copper deposition is secondary current distribution within the experimental conditions. Dimensionless variables, N and J as well as Wagner number were used to determine the criteria for the uniformity of current distribution.

• Proceedings of the Safety Management and Science Conference
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• 2008.11a
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• pp.599-610
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• 2008

It is an important and urgent issue to improve process capability in quality control. Process capability refers to the uniformity of the process. The variability in the process is a measure of the uniformity of output. A simple, quantitative way to express process capability, the degree of variability from target in specification is defined by process capability index(PCI). Almost process capability indices are defined under normal distribution. However, these indices can not be applied to the process of non-normal distribution including reliability. We investigate current research on the process of non-normal distribution, and advanced method and technology for developing more reliable and efficient PCI. Finally we suggest the perspective for future study.

• Journal of the Korean institute of surface engineering
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• v.27 no.6
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• pp.340-346
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• 1994

The method of uniforming current distribution in Hull cell are studied by using auxiliary anode, current shield bipolar electrode, and combinings bipolar electrode with current shield in order to find a way of uni-form deposition. The current density distributions are measured by each ammeter of the same inner resistance connected to divided cathode pannel respectively. The current density distributions of cathode electrode divided into five sections with 5mm width have a tendency of linear inclination, and that of twenty sections have a tendency of smoother curve than the curve of original Hull cell pannel. Their results showed lower value on the high current density portion and higher value on the low portion than that original Hull cell pannel. The current distribution in Hull cell is able to unify by using auxiliary anode, or combining bipo-lar electrode with current shield, but not efficient in using one of both individually.

• Proceedings of the Optical Society of Korea Conference
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• 2000.08a
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• pp.162-163
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• 2000

We have observed the short-channel effect, narrow-channel effect and small-geometry effect in terms of a variation of the threshold voltage. For a short-channel effect the threshold voltage was largely determined by the DIBL effect which stimulates more carrier injection in the channel by reducing the potential barrier between the source and channel. The effect becomes more significant for a shorter-channel device. However, the potential, field and current density distributions in the channel along the transverse direction showed a better uniformity for shorter-channel devices under the same voltage conditions. The uniformity of the current density distribution near the drain on the potential minimum point becomes worse with increasing the drain voltage due to the enhanced DIBL effect. This means that considerations for channel-width effect should be given due to the variation of the channel distributions for short-channel devices. For CCDs which are always operated at a pinch-off state the channel uniformity thus becomes significant since they often use a device structure with a channel length of > 4 ${\mu}{\textrm}{m}$ and a very high drain (or diffusion) voltage. (omitted)

• 한국연소학회:학술대회논문집
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• 2004.11a
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• pp.217-222
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• 2004

In recent year, as the current and future emission regulations go stringent, the research of exhaust manifold and CCC has become the subject of increasing interest and attention. This study is concerned with the systematic approach to improve catalyst flow uniformity and light-off behavior through the basic understanding of exhaust flow characteristics. Computational approach to the unsteady compressible flow for exhaust manifold of 4-1 type and 4-2-1 type and CCC system of a 4-cylinder DOHC gasoline engine was performed to investigate the flow distribution of exhaust gases. In this study, through calculation, the effects of geometric configuration of exhaust manifold on flow structure and its maldistribution in monolith were mainly investigated to understand the exhaust flow patterns in terms of flow uniformity. Based on the design guidance resulting from this fundamental study, the flow uniformity of 4-2-1 type exhaust manifold demonstrated the more improved exhaust characteristics than that of the 4-1 type one.

• Korean Chemical Engineering Research
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• v.54 no.1
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• pp.108-113
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• 2016

A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.