• Journal of the Korean Society for Precision Engineering
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• v.13 no.3
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• pp.70-79
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• 1996

In off-line process optimization, process parameters are controlled such that the process is robust against changes in equipment conditions and incoming materials. The off-line methods, however, are not effective when the changes are so large that process parameters need to be adjusted. On-line control can respond to such large changes, but process uniformity has not been controlled on-line due to the difficulties in modeling. This paper is aimed at developing a new on-line control methodology where the uniformity is controlled effectively. The process variability is categorized based on the physical considerations, and the process parameters are classi- fied considering their effects on the categorized process variabilities. On-line control is performed with the properly selected process parameters so that robustness may not be degraded. The developed methodology is applied to the single wafer plasma etching processes, which resulted in both higher within-a-wafer uniformity and compens- ation of the incoming material non-uniformity.

• Journal of radiological science and technology
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• v.46 no.1
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• pp.29-36
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• 2023

To have highly reliable diagnostic performance of it, this study comparatively analyzed spatial resolution of SPECT images and interrelationship depending on the changes of system uniformity of ga㎜a camera through phantom analysis. This study chose 6 kinds of results from quality control (uniformity) of triple head SPECT scanner operated in an university hospital in Seoul for six months. Then, study measured spatial resolutions (FWHM) of the images restructured by injecting radiopharmaceuticals to Jaszczak phantom, and doing SPECT scanning under the same conditions as clinical ones using the analytical program (image J). Quality controls performed by the experimental institution showed that differential uniformity of UFOV ranged from 2.76% to 7.61% (4.46±2.07), and integral uniformity of UFOV ranged from 1.98% to 5.42% (3.01±1.43). Meanwhile, Quantitative analysis evaluations of phantom images depending on the changes of uniformity of SPECT scanner detector showed that as the uniformity values of UFOV and CFOV decreased, FWHM values of phantom images decreased from 8.5 ㎜ to 5.8 ㎜. That is, it was quantitatively identified that the higher uniformity of detector is, the better spatial resolution of images gets (P<0.05). It is very important to perform continuous and consistent quality control of the nuclear medicinal system, and users should be clearly conscious of it.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.358-358
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• 2000

An iterative learning control technique based on a linear quadratic optimal criterion is proposed for temperature uniformity control of a silicon wafer in rapid thermal processing.

• Proceedings of the PSK Conference
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• 2003.10a
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• pp.40-41
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• 2003

The present topic in pharmaceutical industry is to establish Quality Assurance System for medicinal product Therefore, the most important and urgent subject to be solved in the field of the manufacturing industry is to establish, implement and maintain the control system for ensuring uniformity of medicinal product. In case of solid dosage forms for internal use, its quality was controlled by disintegration test, etc but at present bioavailability could be predicted with dissolution test and so the assurance of its uniformity should be prerequistie to preserve suitable dissolution of the manufactured medicinal product. (omitted)

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.6
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• pp.500-505
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• 2000

This paper deals with wafer temperature uniformity control essential in rapid thermal processing (RTP). One of the important control objectives of RTP is to keep the temperature over the wafer surface as uniformly as possible. For this, a discrete time state equation around the operating point is first identified by using the subspace fitting method, and a multivariable LQG(Linear Quadratic Gaussian) controller is designed based on the identified model. Simulation and experimental results show improvement in temperature uniformity over the conventional PID method.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.1685-1688
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• 2004

I propose a modeling of a mechanism for weight fire uniformity measurement of a tire and a way I interpret a Sampling signal by Loadcell through an analysis, and to measure fire uniformity in this study. Correct a weight fire uniformity measurement was possible through the production of conversion and influence factor of a signal with a basis with the model who was an oscillation mechanics enemy.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.183-184
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• 2011

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.2606-2611
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• 2003

Comprehensive study on the control system design for a RTP process has been conducted. The purpose of the control system is to maintain maximum temperature uniformity across the silicon wafer achieving precise tracking for various reference trajectories. The study has been carried out in two stages: thermal balance modeling on the basis of a semi-empirical radiation model, and optimal iterative learning controller design on the basis of a linear state space model. First, we found through steady state radiation modeling that the fourth power of wafer temperatures, lamp powers, and the fourth power of chamber wall temperature are related by an emissivity-independent linear equation. Next, for control of the MIMO system, a state space modeland LQG-based two-stage batch control technique was derived and employed to reduce the heavy computational demand in the original two-stage batch control technique. By accommodating the first result, a linear state space model for the controller design was identified between the lamp powers and the fourth power of wafer temperatures as inputs and outputs, respectively. The control system was applied to an experimental RTP equipment. As a consequence, great uniformity improvement could be attained over the entire time horizon compared to the original multi-loop PID control. In addition, controller implementation was standardized and facilitated by completely eliminating the tedious and lengthy control tuning trial.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.63-69
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• 2012

As decreasing size of chips, the need of wafer level packaging is increased in semi-conductor and display industries. Temperature uniformity is a crucial factor in vacuum soldering process to guarantee quality of bonding between chips and wafer. In this paper, a stepwise iterative algorithm has been suggested to obtain output profile of each heat source. Since this algorithm is based on open-loop stepwise iterative experimental technique, it is easier to implement and cost effective than real time feedback controls. Along with some experiments, it was shown that the suggested algorithm can remarkably improve temperature uniformity of wafer during whole heating process compared with the ordinary manual trial-and error method.

• Journal of Microbiology and Biotechnology
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• v.19 no.7
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• pp.658-665
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• 2009

Quality control QC for spot-uniformity is a critical point in fabricating an oligonucleotide array, and quantification of targets is very important in array analysis. We developed two new types of QC probes as a means of confirming the quality of the uniformity of attached probes and the quantification of targets. We compared the signal intensities and fluorescent images of the QC and target-specific probes of arrays containing only target-specific probes and those containing both QC and target-specific probes. In a comparison of quality control methods, it was found that the arrays containing QC probes could check spot-uniformity or spot defects during all processes of array fabrication, including after spotting, after washing, and after hybridization. In a comparison of quantification results, the array fabricated by the method using QC probes showed linear and regular results because it was possible to normalize variations in spot size and morphology and amount of attached probe. This method could avoid errors originating in probe concentration and spot morphology because it could be normalized by QC probes. There were significant differences in the signal intensities of all mixtures (P<0.05). This result indicates that the method using QC probes is more useful than the ordinary method for quantification of mixed target. In the quantification of mixed targets, this method could determine a range for mixed targets of various amounts. Our results suggest that methods using QC probes for array fabrication are very useful to the quality control of spots in the fabrication processes of quantitative oligonucleotide arrays.