• 한국주거학회논문집
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• 제17권4호
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• pp.25-36
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• 2006

The aim of this paper is to study on the background and the reasons of the uniformity of housing type and planning, and to find ways of coping with the related problems, focusing on the uniformity of apartment housing and it's excessive typical planning. In this process, I try to take suggestive hints from the case of Japan which already made an issue of uniformity of housing type and promoted the handling measure for the problem in a national level. The result includes that supplied apartment housing in Korea occupies about 80% of total housing supply each year, and the reasons for the increased apartment housing supply are attributed to many interactive influence factors. One of the influence factors is ascribed to mass housing system where many academic theories have supported the system under the interdisciplinary cooperation. In the case of Japan too many supplied condominium housing provoked the uniformity problem, however, the establishment of HOPE plan and a special association board oriented to the study of regional housing planning under Architectural Institute of Japan have considerably relaxed the uniformity problem.

• 전자공학회논문지D
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• 제34D권10호
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• pp.68-76
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• 1997

In this paper, design parameters of rapid thermal processing(RTP) to minimize the wafer temperature uniformity errors are proposed. Lamp ring positions and the wafer height are important parameters for wafer temperature uniformity in RTP. We propose the method to seek lamp ring positions and the wafer gheight for optimal temperature uniformity. The proposed method is applied to seek optimal lamp ring positions and the wafer feight of 8 inch wafer. To seek the optimal lamp ring positions and the wafer height, we vary lamp ring positions and the wafer height and then formulate the wafer temperature uniformity problem to the linear programming problem. Finally, it is shown that the wafer temperature uniformity in RTP designed by optimal problem. Finally, it is hsown that the wafer temperature uniformity is RTP designed by optimal parameters is improved to comparing with RTP designed by the other method.

• 대한인간공학회지
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• 제26권4호
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• pp.33-39
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• 2007

In the full white pattern, white uniformity means the degree of uniform distribution of white color and luminance across the whole screen. Among the FPDs(Flat Panel Displays), the TFT-LCD has weak point of viewing angle. The viewing angle considering location and direction can cause different image quality of the TFT-LCD. Therefore, white uniformity of the TFT-LCD must consider viewing angle. Based on international standards, this study proposes an alternative that is realistic and ergonomic measurement of white uniformity of the TFT-LCD.

• 반도체디스플레이기술학회지
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• 제18권3호
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• pp.60-65
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• 2019

In this paper, the hybrid illumination system for effectively detecting surface defects in steel plate with lowcontrast, non-uniformity and featureless is designed based on illuminance uniformity. First of all, characteristics of steel plate defects were considered and typical inspection illumination system is implemented. Optimum illumination parameters for uniformly illuminating an inspection area in the typical illumination system are selected based on the illuminance uniformity and illuminance distribution measurement. The illuminance uniformity and illuminance distribution are measured using an illuminometer based on the arduino. Through illuminance distribution analysis of the typical illumination, an hybrid illumination is designed by fusing bi-directional illumination and coaxial illumination. The hybrid illumination showed higher uniformity ratio and illuminance distribution than the typical illuminations. The hybrid illumination system showed the ability to uniformly illuminate the entire inspection region of steel plate surface.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.488-491
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• 2008

The variations of the TFT characteristics in AMOLEDs result in the decrease of the uniformity of the displays. Measurement of the long-range uniformity (LRU) is straightforward. However, there is no method for measuring the short-range uniformity (SRU) yet. Quantifying the SRU is important in evaluating various TFT backplanes and compensation circuits. We propose new methods for measuring SRU.

• Kyungpook Mathematical Journal
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• 제46권2호
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• pp.189-200
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• 2006

The semicontinuous quasi-uniformity is known to be one of the most important examples of transitive quasi-uniformities. The aim of this paper is to show that various facts in classical topology connected with the semicontinuous quasi-uniformity and semicontinuous real functions may be easily extended to pointfree topology via a construction introduced by the authors in a previous paper. Several consequences are derived.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.571-574
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• 2004

The LED backlight can be designed to have the desired uniformity by using many combination of reflector patterns. The uniformity of the LED backlight can improve by applying the specially designed reflector patterns. In this paper, it was shown that the 72.7% of luminance uniformity of the LED backlight with reflector patterns was obtained by computer simulation.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.223-227
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• 2002

As the channel length of device shrinks below $0.13{\mu}m$, CMP(chemical mechanical polishing) process got into key process for global planarization in the chip manufacturing process. The removal rate and non-uniformity of the CMP characteristics occupy an important position to CMP process control. Especially, the post-CMP thickness variation depends on the device yield as well as the stability of subsequent process. In this paper, every wafer polished two times for the improvement of oxide CMP process characteristics. Then, we discussed the removal rate and non-uniformity characteristics of post-CMP process. As a result of CMP experiment, we have obtained within-wafer non-uniformity (WIWNU) below 4 [%], and wafer-to-wafer non-uniformity (WTWNU) within 3.5 [%]. It is very good result, because the reliable non-uniformity of CMP process is within 5 [%].

• Agribusiness and Information Management
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• 제6권1호
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• pp.37-44
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• 2014

This study was conducted to evaluate light intensity and uniformity of two SMD (surface-mount device) type LEDs for protected crop production. A low-power (0.1 W) and a high-power (1 W) LEDs were selected and the intensity and uniformity was evaluated at different vertical (height) and horizontal (distance) intervals. When the horizontal interval of the LED bar was fixed, the light intensity increased and the uniformity decreased as the height decreased. At the 30~40 cm heights, 20~30% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. As the horizontal distance of the LED bars increased, while the uniformity increased as well, the light intensity decreased. At the distances of 6~10 cm, 17~23% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. When the LED bars were added to the sides, the light intensity and uniformity were generally improved. Results showed that the light intensity and uniformity depended on the height and interval of the LED bulbs; therefore, optimum arrangement for the crops interested should be determined through experiments.

• 한국항공우주학회지
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• 제50권4호
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• pp.269-275
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• 2022

펄스간 시간측정방법은 이상적인 조건에서는 정확한 반작용휠 속도를 측정할 수 있지만, 실제로는 타코펄스 불균일성 때문에 측정속도 오차가 존재한다. 본 연구에서는 불균일성을 극복하는 방법을 살펴본다. 우선 휠을 특정한 속도로 회전시켜서 타코펄스 불균일성을 측정하는 방법을 소개한다. 이렇게 획득된 불균일성 정보를 이용하여 실시간으로 측정오차를 보정하는 방법을 제안한다. 해당 방법은 펄스간 시간 측정방법의 카운트와 사전 측정된 불균일 정보로부터 속도 후보군을 계산하고, 이중에서 실제속도와 가장 가까운 값을 선택한다. 시뮬레이션을 통해서 제안된 방법이 타코펄스 불균일성을 극복하고 정확한 속도를 측정하며 빠른 휠속도 제어도 가능함을 보인다.