• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.4
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• pp.123-129
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• 2018

A rotational drawing die which can form a long tube with spiral grooves on the surface is presented. The main feature of the proposed die is a rotation insert that is embedded into the die container for the die to freely rotate with respect to the drawing centerline as the materials are drawn. We employed a three-dimensional finite element model to investigate the effects of the rotational die on the material filling of spiral grooves. The material used in the finite element analysis was stainless 304. We also performed a pilot drawing test to verify the usefulness of the proposed rotational drawing die. Results reveal that the material filling of spiral grooves by the proposed rotational drawing die was in good agreement for both the finite element analysis and the drawing test. We found that the underfill in a conventional drawing die was reduced in the proposed rotational drawing die.

• Transactions of Materials Processing
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• v.18 no.2
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• pp.150-155
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• 2009

A shaft for laser printers has to be produced with high dimensional accuracy of a few micrometers. Most companies produce the shaft, therefore, by machining. These days, forging process is tried to be employed in manufacturing the shaft for productivity. In this study, the dimensional inaccuracy of straightness is studied and the underfill is not focused because the shaft shape is simple and the load capacity of press is sufficient. The straightness and concentricity of the shaft is important for the operation of a laser printer. Many design parameters such as preform shapes, tooling dimensions, forging load, and billet geometries may affect on the dimensional accuracy. In the forging process of shafts, a billet which is cut from wires is used. The billet, therefore, may be a little bit curved but not always straight. The elastic recovery is considered to cause the dimensional inaccuracy. Therefore, the effect of the forging load on the elastic recovery and straightness is investigated through the finite element analyses using DEFORM-3D and ABAQUS.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.1
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• pp.15-21
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• 2013

In this paper, a high-speed imaging and an image processing technique have been applied to detect the position of a meniscus as a function of time in the micro capillary flows. Two fluids with low and high viscosities, ethylene glycol and glycerin, were dropped into the entrance well of a circular capillary tube. The filling times of the meniscus in both cases of ethylene glycol and glycerin were compared with the theoretical models - Washburn model and its modified model based on Newman's dynamic contact angle equation. To evaluate the model coefficients of Newman's dynamic contact angle, time-varying contact angles under the capillary flows were measured using an image processing technique. By considering the dynamic contact angle, the estimated filling time from the modified Washburn model agrees well with the experimental data. Especially, for the lower-viscosity fluid, the consideration of dynamic contact angle is more significant than for the higher-viscosity fluid.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.4 s.193
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• pp.93-101
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• 2007

Aluminum alloy which is one of the light materials has been tried to apply to light weight vehicle body. In order to do that, welding technology is very important. In case of the aluminum laser welding, the strength of welded part is reduced due to porosity, underfill, and magnesium loss. To overcome these problems, laser welding of aluminum with filler wire was suggested. In this study, experiment about laser welding of AA5182 aluminum alloy with AA5356 filler wire was performed according to process parameters such as laser power, welding speed and wire feed rate. The tensile strength was measured to find the weldability of laser welding with filler wire. The models to estimate tensile strength were suggested using three regression models and one neural network model. For regression models, one was the multiple linear regression model, another was the second order polynomial regression model, and the other was the multiple nonlinear regression model. Neural network model with 2 hidden layers which had 5 and 3 nodes respectively was investigated to find the most suitable model for the system. Estimation performance was evaluated for each model using the average error rate. Among the three regression models, the second order polynomial regression model had the best estimation performance. For all models, neural network model has the best estimation performance.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.7
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• pp.4057-4064
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• 2014

In this paper, attempts were made to design a preform for a final punch inexpensively using the proposed approximate optimization method or metamodel-based simulation optimization. The design objective of this work is to achieve a uniform distribution of effective strains, the angle dimension of the preformed punch is chosen as a design variable, and maximum underfill ratio is used as a constraint. For this optimization, a computer simulation of a practical punch forging process is run using DEFORM software, in which a preformed punch(workpiece), a master punch(upper die), and a bottom die are dealt with. A validation method is introduced to determine if the simulation results match the actual forging process. In addition, this work presents the detailed design optimization procedure consisting of (i) generation of an initial metamodel, (ii) metamodel optimization, (iii) validation of metamodel-predicted optimum, and (iv) metamodel improvement.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.