• Tunnel and Underground Space
• /
• v.32 no.4
• /
• pp.243-253
• /
• 2022

In this study, the cutting efficiency of TBE (Tunnel Boring Extender) was evaluated by using rotary cutting tester. In the rotary cutting test, a specimen which has a drilled hollow hole at the center was made of rock-like material. The specimen was cut by UDC (undercutting disc cutter) with spiral cutting path to simulate the cutting process of TBE. The cutting forces and specific energy were evaluated under different cutting conditions. The results indicated that the cutter forces of UDC linearly increased with the vertical and radial penetration depths. Among the three directional cutter forces, the normal force is larger than other force components. While the specific energy decreased with the two penetration depths, in particular, it was presumed that the specific energy was minimized at a certain value of the ratio of radial to vertical penetration depth.

• Proceedings of the IEEK Conference
• /
• 2000.06b
• /
• pp.107-110
• /
• 2000

In this experiment, we fabricated pyramid-type silicon tunneling devices in which a tunneling current flow between a micro-tip and Si$_3$N$_4$ thin film membrane. A MEMS process was used for the fabrication of the tunneling devices. The micro-tips were formed on Si wafers by undercutting a differently oriented square of SiO$_2$ with KOH. The stiffness of the Si$_3$N$_4$ films were observed and the model for the stiffness calculation, which is useful in predicting the stiffness even when the stiffness ranges beyond the scope of the normal experimental condition, was suggested.

• Journal of Sensor Science and Technology
• /
• v.3 no.1
• /
• pp.19-25
• /
• 1994

When etching rectangular convex corners of silicon using anisotropic etchants such as KOH, deformation of the edges always occurs due to undercutting. Therefore, it is necessary to correct the mass pattern for compensation. Experiments for the compensation method to prevent this phenomenon were carried out. In the result, the compensation pattern of a regular square is suitable for acceleration sensors considering space. With this consequence, silicon piezoresistive acceleration sensor with compensated square pillar type of mass has been fabricated using SDB wafer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1997.04a
• /
• pp.23-26
• /
• 1997

This work presents the TMAH/IPA anisotropic etching characteristics with addition of Pyrazine. (100) Si etching rate of 0.747 ${\mu}{\textrm}{m}$/min at 8$0^{\circ}C$ was obtained using TMAH 25 wt.% / IPA 17 vol.% / pyrazine 0.1 g. The etching rate of (100) Si is increased about 52% compare to pure TMAH 25 wt.%. But etching rate of (100) Si is decreased with increasing Pyrazine additive. Activation energy of TMAH/IPA/pyrazine is much lower than TMAH and TMAH/IPA solutions. Addition of Pyrazine does not effect on surface flatness and decreases undercutting ratio about 20 %. Therefore, TMAH/IPA/pyrazine is an attractive anisotropic etchant because of alkaline-ion free.

• Journal of the Korean Society for Precision Engineering
• /
• v.15 no.4
• /
• pp.7-14
• /
• 1998

Noncircular gears have been used for obtaining the modified anglualr velocity ratio between parallel axes. The elliptical gear, which is a kind of noncircular gears, makes use of ellipse as a pitch curve, and is applied for the measurement of the discharge of liquid. The applications of an elliptical gear are more advantageous than any other mechanism as like a crank-slider linkage or a cam mechanism in view of the accuracy and the reliability to transmit the prescribed motion. In this paper, acceding to the theoretical involute tooth profile, two pairs of the elliptical gears were manufactured by using CNC wire electronic discharge machine. The proper ranges of the operating pressure angle and of module not to generate under cutting are studied on the change of the eccentricity, because it is the eccentricity of the pitch curve that determines most of the characteristics of the elliptical gear and then the vibration analysis is executed for the verification of harmonious rotating.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.1224-1226
• /
• 2003

In this work, we developed a high resolution printing technique based on transferring a pattern from a PDMS stamp to a Pd and Au substrate by microcontact printing Also, we fabricated various 2D metallic and polymeric nano patterns with the feature resolution of sub-micrometer scale by using the method of microcontact printing (${\mu}$CP) based on soft lithography. Silicon masters for the micro molding were made by e-beam lithography. Composite poly(dimethylsiloxane) (PDMS) molds were composed of a thin, hard layer supported by soft PDMS layer. From this work, it is certificated that composite PDMS mold and undercutting technique play an important role in the generation of a clear SAM nanopattern on Pd and Au substrate.

• Journal of Chest Surgery
• /
• v.33 no.4
• /
• pp.316-319
• /
• 2000

Double-outlet left ventricle with ventricular septal defect and pulmonary stenosis was conventionally repaired with extracardiac conduit or pulmonary artery translocation. Here, we report an anatomically repaired double-outlet left ventricle without extracardiac conduit or pulmonary artery translocation in an 11 month old patient who had undergone palliative systemic-pulmonary shunt at a nonatal period. The location of ventricular septal defect, both great arteries and coronary arteries made it possible to reconstruct the right ventricular outflow tract using on-lay patch after incision and undercutting the tissue between the ventriculotomy and the pulmonary arteriotomy.

• Journal of Korean Vacuum Science & Technology
• /
• v.3 no.1
• /
• pp.24-29
• /
• 1999

The characteristic behaviors of CH3Br were examined first for the dry etching of polysilicon in a Cl2/CH3Br/O2 plasma. CH3Br is revealed one of the excellent additive gases to control anisotropy of etching profile and to give no undercutting for various typed of polysilicons. CH3Br acts as a passivation precursor on the side wall in etch cavity by forming polymer-like films such as CHxBry(x+y=1,2). The decrease of etch selectivity due to the reaction if the C-containing species from CH3Br with the surface O atoms of SiO2 was overcome by the addition of O2 into plasma, resulting that the selectivity increased by 2~3 times. According to the results of optical emission signals, CH3Br should be dissociated into several fragments to give more hydrogen atoms than bromine atoms in our helical resonator system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1996.11a
• /
• pp.334-337
• /
• 1996

Si anisotropic etching is a key technology for micromachining. The main advantages of tetramethyl ammonium hydroxide (TMAH)-based solution are their full compatibility with IC process. In this work the anisotropic etching of single crystal Si in a TMAH (($CH_3$)$_4$NOH) based solution was studied. The influence of the addition of IPA to TMAH solution on their etching characteristics was also presented. The crystal planes bounding the etch front and their etch rates were determined as a function of temperature, crystal orientation, and etchant concentration. The etch rates of (100) oriented Si crystal planes decreased linearly with increasing the IPA concentration, The etched (100) planes were covered by Pyramidal-shaped hillocks below 15 wt.%, but very smooth surfaces were obtained above 20 wt.%. The addition of IPA to TMAH solution leads to smoother surfaces of sidewalls etched planes.

• Journal of Welding and Joining
• /
• v.35 no.1
• /
• pp.43-48
• /
• 2017

Pulse TIG (Tungsten Inert Gas) welding is often considered the most difficult of all the welding processes commonly used in industry. Because the welder must maintain a short arc length, great care and skill are required to prevent contact between the electrode and the workpiece. Pulse TIG welding is most commonly used to weld thin sections of stainless steel, non-ferrous metals such as aluminum, magnesium and copper alloys. It is significantly slower than most other welding techniques and comparatively more complex and difficult to master as it requires greater welder dexterity than MIG or stick welding. The problems associated with manual TIG welding includes undercutting, tungsten inclusions, porosity, Heat affected zone cracks and also the adverse effect on health of welding gun operator due to amount of tungsten fumes produced during the welding process. This brings the necessity of automation. Hence, In this paper an attempt has been made to build a customerized setup of Pulse TIG welding based on through review of Pulse TIG welding parameters. The cost associated for making automated TIG is found to be low as compared to SPM (Special Purpose machines) available in the market.