• 한국정밀공학회지
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• 제26권11호
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• pp.35-40
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• 2009

This paper presents the geometrical analysis of an inclined ultra-precision grinding technology using simulations about grinding point locus for micro lens manufacturing. Simulation results show the relationship between radius ratios ($R_1/R_2$) and wheel center locus. Furthermore, the critical grinding wheel radius ($R_1$) can be calculated from work-piece radius ($R_2$) and inclined angle ($\theta=-45^{\circ}$). These achievements could be applied to calculate CNC data in ultra-precision grinding and give insight for wheel wear and compensation grinding.

• 한국정밀공학회지
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• 제29권3호
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• pp.261-265
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• 2012

In this study, glassy carbon was ground for lens core of glass mold press. Ultraprecision grinding process was applied for machining of core surfaces. During the process, brittle crack occurred because of hard-brittleness of glassy carbon. Author investigated optimized grinding conditions from the viewpoint of ductile mode grinding. Geometrical undeformed chip thickness was adopted for critical chip thickness that enables crack free surface. Machined cores are utilized for biaspheric glass lens fabrication and surfaces of lens were compared for verification of ground surface.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.283-286
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• 2002

This paper presents the straightness compensation system which is a device for improving the machining accuracy of ultra-precision machines by synchronizing the position of diamond tool tip with machine error motion. Sine it is actuated by piezoelectric actuator with highly nonlinear hysteresis characteristics, the feedback control schemes such as Proportional Integral(PI), are required and realized by measuring the displacements of diamond tool tip. for the better tracking performance, the controller was implemented using TMS320C32 32bit floating-point DSP which is fast so that the real-time control is possible. In addition, stand alone type DSP board was chosen fur the easy assembly into the ultra-precision machines. The experimental results show good command tracking performance and the motion error of the machine is satisfactorily compensated during the machining process.

• 한국정밀공학회지
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• 제29권4호
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• pp.367-372
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• 2012

The biggest factors that lower the machining accuracy are thermal deformation and chatter vibration. In this article, we introduce the study case of technology that can automatically compensate the errors of these factors of a machine during processing on the machine tool's CNC(Computerized Numerical Controller) in real time. This study is related to the detection and compensation of thermal deformation and chatter vibration that can compensate for faster and produce processed goods with more precision by autonomous compensation. In addition, this study is related to the active control of vibration during machining, monitoring of cutting force and auto recognition of machining axes origin. Thus, we attempt to introduce the related contents of the development we have made in this article.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.970-976
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• 1997

The ultra-precision machining is widely used for final machining process of precision parts, so in this study, mirror surface finishing systems using the micro abrasive film, one of ultra-precision machining method, have to examine mirror surface characteristics of the cylindrical workpiece(SM45) such as surface roughness, workpiece removal and evaluated under the condition varing film feed rate, applied pressure, grinding speed after fixing other condition. It was found that varrious machining condition have significant influences on workpiece removal, surface roughness.

• 한국정밀공학회지
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• 제19권12호
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• pp.120-126
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• 2002

The needs of ultra-precisely machined parts are increasing more and more. But the experimental data required to ultra precision machining of nonferrous metal is insufficient. The behavior of cutting in micro cutting area is different from that of traditional cutting because of the size effect. Copper is widely used as optical parts such as LASER reflector's mirror and multimedia instrument. In experimental, after oxygen-free copper is machined by ultra precision machine with natural mono crystal diamond tool (NCD) and synthetic poly crystal diamond tool (PCD), we compared chip formation and tool's wear according to used tool. Also, we researched optimized cutting condition with the results measured according to cutting condition such as spindle speed, feed rate and depth of cut. As a result, the optimal working condition that makes good surface roughness is obtained. The surface roughness is good when spindle speed is above 80 m/min, and feed rate is small and depth of cut is above 0.5 ${\mu}{\textrm}{m}$. In cutting of klystron anode and cavity 3.2 nmRa of surface roughness is obtained.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.185-186
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• 2007

• 한국정밀공학회지
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• 제24권2호
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• pp.25-32
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• 2007

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.249-250
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• 2007

• 한국공작기계학회논문집
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• 제17권2호
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• pp.1-6
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• 2008

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that polishing is very important. However, most of these investigation was experiment less than 300mm diameter. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study reports the machining variables that has major influence on the characteristic of wafer polishing. It was adapted to polishing pressure, machining speed, and the slurry mix ratio, the optimum condition is selected by ultra precision wafer polishing using load cell and infrared temperature sensor. The optimum machining condition is selected a result data that use a pressure and table speed data. By using optimum condition, it achieves a ultra precision mirror like surface.