• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.7
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• pp.1-6
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• 2020

Micro-structure components applied to various disciplines are steadily demanded with lighter weight and better quality. This is because that ultra thin-wall injection molding has been paid attention with a lot of benefits such as cost reduction, shorter process period, and so forth. However, this technology is complicate and difficult to obtain high quality of products compared with conventional injection molding due to warpage caused by uneven shrinkage and molecular orientation. Since warpage of products directly affects product quality and overall performance of devices, it is essential to predict deformation behavior to achieve high precision of molded products. Therefore, this study aims to find out adequate thin-wall mold design for FPC connector housing by employing Moldflow simulation before application. In addition, experimental research is performed by using a fabricated mold structure based on simulated results to prove accuracy and reliability of the suggested simulation for warpage analysis.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.6
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• pp.481-487
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• 2008

Rapid mold heating has been recent issue to enable the injection molding of thin-walled parts or micro/nano structures. Induction heating is an efficient way to heat material by means of an electric current that is caused to flow through the material or its container by electromagnetic induction. It has various applications such as heat treatment, brazing, welding, melting, and mold heating. The present study covers an experimental investigation of induction heating in order to rapidly raise the mold temperature. It is observed that the mold surface temperature is raised up to $200^{\circ}C$ in 2 seconds. This induction heating is applied to injection molding of a flexspline for a plastic harmonic drive, which has difficulty in cavity filling because its minimum thickness is only 0.35 mm. The induction heating is then successfully implemented on this ultra-thin wall molding by raising the mold surface temperature around the glass-transition temperature of the molding material.