1 |
Su, M., Cao, L., Lin, T., Chen, F., Li, J., and Chen, C., "Warpage Simulation and Experimental Verification for 320mm x 320mm Panel Level Fan-out Packaging based on Die-first Project," Microelectronics Reliability, Vol. 83, pp. 29-38, 2018.
DOI
|
2 |
Kim, J. K., Lee, J. H., Kim, J. S., Lee, J. H. and Kwak, J. S., "A Study on the Process Optimization of Microcellular Foamed Ceiling Air-Conditioner 4-Way Panel," Journal of the Korean Society of Manufacturing Process Engineers. Vol. 17, No. 6, pp. 98-104, 2018.
DOI
|
3 |
Chen, D. C., Huang, C. K., and Lin, J. W., "Warpage Analysis of a Plastic Spur Gear Injection Molding," Smart Science, Vol. 5, No. 4, pp. 206-213, 2017.
DOI
|
4 |
Kitayama, S., Yamazaki, Y., Takano, M., and Aiba, S., "Numerical and Experimental Investigation of Process Parameters Optimization in Plastic Injection Molding using Multi-criteria Decision Making," Simulation Modelling Practice and Theory, Vol. 85, pp. 95-105, 2018.
DOI
|
5 |
Kitayama, S., Miyakawa, H., Takano, M., and Aiba, S., "Multi-objective Optimization of Injection Molding Process Parameters for Short Cycle Time and Warpage Reduction using Conformal Cooling Channel," The International Journal of Advanced Manufacturing Technology, Vol. 88, No. 5-8, pp. 1735-1744, 2017.
DOI
|
6 |
Kate, K. H., Ravi, K. E., and Atre, S. V., "Influence of Feedstock Properties on the Injection Molding of Aluminum Nitride," The International Journal of Advanced Manufacturing Technology, Vol. 90, No. 9-12, pp. 2813-2826, 2017.
DOI
|