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http://dx.doi.org/10.14775/ksmpe.2020.19.07.001

Dimensional Optimization of Electric Component in Ultra Thin-wall Injection Molding by Using Moldflow Simulation  

Lee, Jung-Hee (School of Mechanical Engineering, Pukyong National UNIV.)
Bae, Hyun-Sun (The Korea Chamber of Commerce & Industry)
Kwak, Jae-Seob (School of Mechanical Engineering, Pukyong National UNIV.)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.19, no.7, 2020 , pp. 1-6 More about this Journal
Abstract
Micro-structure components applied to various disciplines are steadily demanded with lighter weight and better quality. This is because that ultra thin-wall injection molding has been paid attention with a lot of benefits such as cost reduction, shorter process period, and so forth. However, this technology is complicate and difficult to obtain high quality of products compared with conventional injection molding due to warpage caused by uneven shrinkage and molecular orientation. Since warpage of products directly affects product quality and overall performance of devices, it is essential to predict deformation behavior to achieve high precision of molded products. Therefore, this study aims to find out adequate thin-wall mold design for FPC connector housing by employing Moldflow simulation before application. In addition, experimental research is performed by using a fabricated mold structure based on simulated results to prove accuracy and reliability of the suggested simulation for warpage analysis.
Keywords
Micro-electric Component; Ultra Thin-wall Plastic Injection Molding; Dimensional Optimization; Moldflow Simulation;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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