• Korean Chemical Engineering Research
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• v.49 no.3
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• pp.277-284
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• 2011

In this study, UV-curing type organic - inorganic hybrid hard coating solutions were prepared from alumina sols and acrylate monomers. The mixture of alumina sols, prepared from aluminum isopropoxide, and a silane coupling agent, methacryloxypropyl trimethoxysilane(MPTMS), was used as an inorganic component. Also, the mixture of acrylate monomers, pentaerythritol triacrylate(PETA), 1,6-hexanediol diacrylate(HDDA) and dipentaerythritol hexaacrylate (DPEHA), was used as an organic component. The organic-inorganic hybrid coating solutions were obtained by mixing the inorganic component and organic component, deposited on polycarbonate substrates by spin coating and densified by UV-curing. The effect of the amount of MPTMS in the inorganic component and the irradiation time during UV-curing was studied on the properties of coating films. As a result, when 0.20 mole of MPTMS was used, the pencil hardness of coated films showed an excellent pencil hardness of 3H and also exhibited a good abrasion resistance of 2% in haze.

• Polymer(Korea)
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• v.27 no.3
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• pp.189-194
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• 2003

Interfacial evaluation, damage sensing and cure monitoring of single carbon fiber/thermo setting composite with different curing processes were investigated using electro-micromechanical test. After curing, the residual stress was monitored by measurement of electrical resistance and then compared to various curing processes. In thermal curing case, matrix tensile strength, modulus and interfacial shear strength were higher than those of ultraviolet curing case. The shrinkage measured during thermal curing occurred significantly by matrix shrinkage and residual stress due to the difference in thermal expansion coefficient. The apparent modulus measured in the thermal curing indicated that mechanical and interfacial properties were highly improved. The reaching time to the same stress of thermal curing was faster than that of UV curing case.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1847-1850
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• 2008

The process conditions during ultraviolet nanoimprint lithography (UV-NIL) process such as temperature, stamping pressure, UV irradiation, etc. are effective factors for successful imprinting of complex and fine patterns. In this study, the effects of aluminum mold on the thermal characteristics of UV-NIL process were investigated through imprinting experiments and numerical simulations. The temperature of polymer resin on mold was measured to study thermal characteristics during UV curing. From the experimental and numerical results, the importance of curing reaction control for UV-NIL process was discussed for deformation characteristics.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1939-1943
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• 2008

Deformation of a mold is measured and analyzed in alignment and curing processes of UV-Imprint Lithography. We are focused on mold deformation caused by a UV resin, which is laminated between a mold and a target glass-panel. The UV resin is viscous in case of liquid state, and the resin will be solidified when being exposed by the ultra-violet light. The viscosity of the resin causes shear force on the mold during the alignment process. Moreover, the shrinkage during phase change from liquid to solid may cause residual stress on the mold. The experiments for measuring temperature and strain are made during alignment and curing process. Strain-gages and thermocouples are used for measuring the strain and variation of temperature on several points of the mold, respectively. The deformation of mold is also simulated and analyzed. The simulation results are compared with the experiments. Finally, sources of alignment errors in large area UV-nanoimprint lithography are discussed.

• Applied Chemistry for Engineering
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• v.24 no.2
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• pp.148-154
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• 2013

UV curable acryl resin, pressure-sensitive adhesives (PSAs), are used in many different parts in the world. In particular, PSAs has been used in the wafer manufacturing process of semiconductor industry. As wafers become much thinner, UV curable PSAs require more proper adhesion performance. In this study, acrylic PSAs containing hydroxyl groups were synthesized using monomers of 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, styrene monomer and 2-hydroxyethyl acrylate. Isocyanate modified UV curable PSAs were then prepared by the adduct reaction that facilitates the UV curing property via controlling the amount of methacryloyloxyehtyl isocyanate. The proper adhesion performance and UV curing behavior of UV curable PSAs with various hydroxyl values were studied, and experimental conditions were then optimized to raise the efficiency of wafer manufacturing process. It was found that in case of using the equivalent ratio of 1 : 1 isocyanate hardener used in the UV curable PSAs, the peel strength before the UV curing process decreased as the amount of hydroxyl groups increased in the PSAs. The peeling adhesive strength was also decreased with increasing UV dose due to high curing characteristics.

• Journal of Adhesion and Interface
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• v.13 no.1
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• pp.38-44
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• 2012

Surface properties and curing behavior of UV-initiated photopolymerization with and without wax have been investigated by pendulum hardness, pencil hardness, gloss, photo-differential scanning calorimetry (photo-DSC) and SEM. In addition, the influence of wax type (paraffin wax, PE wax) on the various properties of UV cured films was studied. The results showed that the wax type was the significant factor affecting gloss and surface hardness of UV cured films. Specially, the photo-DSC results showed that ${\Delta}H$ for the UV cured films containing paraffin wax was higher than the corresponding values for the formulation without wax and with PE wax. The observed results clearly demonstrate that the photopolymerization of UV curing with paraffin wax in an air atmosphere is less inhibited by the oxygen compared to UV curing without wax and with PE wax.

• Macromolecular Research
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• v.14 no.6
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• pp.617-623
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• 2006

In order to achieve an oriental lacquer (OL) film with a thick consistency, UV-curable silicone acrylate (SA) was added to OL by a dual curing process. The addition of 5 wt% UV-curable SA to the OL fomulation enabled the preparation via a single drying step of a $77{\mu}m-thick$ film exhibiting excellent surface properties. FTIR-ATR was used to investigate the effect of UV-curable SA on the behavior of film formation during curing, and the relaxation behavior of the produced films was investigated by dielectric spectroscopy. Dielectric properties were measured in the frequency range $10^{-2}-10^5\;Hz$ at various temperatures between -100 and $200^{\circ}C$. The results demonstrated that OL modified by UV-curable SA has a higher glass transition temperature and stronger secondary relaxation at a lower temperature than the conventional OL system. The OL film modified with UV-curable SA was presumed to be harder at the surface and tougher than conventional OL film.

• Journal of the Korean Graphic Arts Communication Society
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• v.15 no.2
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• pp.107-115
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• 1997

The ultraviolet(UV)-curable materials are widely used in inks and coatings. In this paper is designed to develop materials having flexibility and functionality with UV-curable acrylate monomer and alkyd resin. At first, phase diagram is prepared for miscibility of UV -curable acrylate monomer with alkyd resin. Also the gel fraction and dynamic viscosity are measured to curing speed of mixing system. In results, it has been demonstrated that miscibility and curing speed are greatly influenced by alkyd resin content.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.214.2-214.2
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• 2013

Device performance for the 45 and 32 nm node CMOS technology requires the integration of ultralow-k materials. To lower the dielectric constant for PECVD and spin-on materials, partial replacement of the solid network with air (k=1.01) appears to be more intuitive and direct option. This can be achieved introducting of second "labile" phase during depositoin that is removed during a subsequent UV curing and annealing step. Besides, with shrinking line dimensions the resistivity of barrier films cannot meet the International Technology Roadmap for Semiconductors (ITRS) requirements. To solve this issue self-forming diffusion barriers have drawn attention for great potential technique in meeting all ITRS requirments. In this present work, we report a Cu-V alloy as a materials for the self-forming barrier process. And we investigated diffusion barrier properties of self-formed layer on low-k dielectrics with or without UV curing treatment. Cu alloy films were directly deposited onto low-k dielectrics by co-sputtering, followed by annealing at various temperatures. X-ray diffraction revealed Cu (111), Cu (200) and Cu (220) peaks for both of Cu alloys. The self-formed layers were investigated by transmission electron microscopy. In order to compare barrier properties between V-based interlayer on low-k dielectric with UV curing and interlayer on low-k dielectric without UV curing, thermal stability was measured with various heat treatment temperature. X-ray photoelectron spectroscopy analysis showed that chemical compositions of self-formed layer. The compositions of the V based self-formed barriers after annealing were strongly dominated by the O concentration in the dielectric layers.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.6
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• pp.916-921
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• 2012

Sealant paste with silica immersed in cross-linked epoxy-acrylate polymer resin was prepared by thermal and UV curing process. The curing mechanism of polymer resin resulted from 2 functional groups of epoxy and acrylic structure. The properties of microstructure, thermal conductivity and mechanical strength were investigated for its various applications. The adhesion strength is increased by increasing the thermal curing time until 15 minutes, and curing efficiency is saturated over 20 minutes. The increase rate per day of pot life and viscosity is 4.8%, indicating it has excellent storage stability. It is found that the formulation of silica pastes can be applied to heavy industries, building materials, display and various industries.