• Title/Summary/Keyword: UV process

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Development of UV-molding process to fabricate functional micro-optical components (기능성 마이크로 광 부품의 성형을 위한 UV 성형 공정 기술 개발)

  • Kim, Seok-Min;Kang, Shin-Ill
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.1332-1336
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    • 2003
  • An experimental method is presented to maximize the replication quality of UV-molded micro-optical components. It is important to maximize the replication quality, because one can obtain the replicated micro-optical components with desired properties by accurate control of the shape. In the present study, a simple technique to avoid micro-air bubbles was first suggested. The effects of the UV-curing dose and the compression pressure on the replication quality of UV-molded structure were examined experimentally. Finally, as a practical application of the process design method, microlens arrays with diameters between 8 ${\mu}m$ and 96 ${\mu}m$ were fabricated by the present method, and the replication quality and the optical properties of the replicated microlens were measured and analyzed.

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A Study on the matter of Disinfection in UV/TiO2 Water Treatment process (UV/TiO2 수처리 공정에서의 살균에 관한 연구)

  • Lee, Gyu-Hwan;Lee, Sang-Jin;Lee, Yong-Jae;Rhee, Dong-Seok
    • Journal of Industrial Technology
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    • v.27 no.A
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    • pp.15-18
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    • 2007
  • This study investigated disinfection effect by general water purifier and water purifier with UV light disinfection. The results are as follows : (i) The general bacteria existed plentifully in a storage tank before treatment (ii) Water treated in water purifier did not meet the water treatment regulation standard since the presence of bacteria, whereas with UV light application the regulation standard is totally satisfied. (iii) Photocatalytic disinfection process with UV light in the presence of $TiO_2$ more effectively killed general bacteria than UV light only.

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A highly integrable p-GaN MSM photodetector with GaN n-channel MISFET for UV image sensor system

  • Lee, Heon-Bok;Hahm, Sung-Ho
    • Journal of Sensor Science and Technology
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    • v.17 no.5
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    • pp.346-349
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    • 2008
  • A metal-semiconductor-metal (MSM) ultraviolet (UV) photodetector (PD) is proposed as an effective UV sensing device for integration with a GaN n-channel MISFET on auto-doped p-type GaN grown on a silicon substrate. Due to the high hole barrier of the metal-p-GaN contact, the dark current density of the fabricated MSM PD was less than $3\;nA/cm^2$ at a bias of up to 5 V. Meanwhile, the UV/visible rejection ratio was 400 and the cutoff wavelength of the spectral responsivity was 365 nm. However, the UV/visible ratio was limited by the sub-bandgap response, which was attributed to defectrelated deep traps in the p-GaN layer of the MSM PD. In conclusion, an MSM PD has a high process compatibility with the n-channel GaN Schottky barrier MISFET fabrication process and epitaxy on a silicon substrate.

Surface Passivation Method for GaN UV Photodetectors Using Oxygen Annealing Treatment

  • Lee, Chang-Ju;Park, Hongsik
    • Journal of Sensor Science and Technology
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    • v.25 no.4
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    • pp.252-256
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    • 2016
  • Epitaxially grown GaN layers have a high surface state density, which typically results in a surface leakage current and a photoresponse in undesirable wavelengths in GaN optoelectronic devices. Surface passivation is, therefore, an important process necessary to prevent performance degradation of GaN UV photodetectors. In this study, we propose oxygen-enhanced thermal treatment as a simple surface passivation process without capping layers. The GaN UV photodetector fabricated using a thermal annealing process exhibits improved electrical and photoresponsive characteristics such as a reduced dark current and an enhanced photoresponsive current and UV-to-visible rejection ratio. The results of this study show that the proposed surface passivation method would be useful to enhance the reliability of GaN-based optoelectronic devices.

Study on the Formation of Residual Layer Thickness by Changing Magnitude and Period of UV Imprinting Pressure (UV임프린트 공정에서 임프린팅 가압력 및 가압시간에 따른 레진 잔막 두께형성에 대한 실험연구)

  • Shin, Dong-Hyuk;Jang, Si-Youl
    • Tribology and Lubricants
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    • v.26 no.5
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    • pp.297-302
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    • 2010
  • This study is focused on the resin layer formation of UV imprinting process by changing imprinting pressure and period. The mold shape is made for the process of window open over the pattern transfer area and the imprinting period is assigned as the time just before the UV light curing. The residual layer is measured by changing the imprinting period and pressure magnitude, and the measured data of residual layer provides useful information for the design of the process conditions of imprinting processes.

Design and fabrication of wafer scale microlens array for image sensor using UV-imprinting (UV 임프린팅을 이용한 이미지 센서용 웨이퍼 스케일 마이크로렌즈 어레이 설계 및 제작)

  • Kim, Ho-Kwan;Kim, Seok-Min;Lim, Ji-Seok;Kang, Shin-Ill
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2007.10a
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    • pp.100-103
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    • 2007
  • A microlens array has been required to improve light conversion efficiency in image sensors. A microlens array can be usually fabricated by photoresist reflow, hot-embossing, micro injection molding, and UV-imprinting. Among these processes, a UV-imprinting, which is operated at room temperature with relatively low applied pressure, can be a desirable process to integrate microlens array on image sensors, because this process provides the components with low thermal expansion, enhanced stability, and low birefringence, furthermore, it is more suitable for mass production of high quality microlens array. In this study, to analyze the optical properties of the wafer scale microlens array integrated image sensor, another wafer scale simulated image sensor chip array was designed and fabricated. An aspherical square microlens was designed and integrated on a simulated image sensor chip array using a UV-imprinting process. Finally, the optical performances were measured and analyzed.

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Photocatalytic Oxidation of Free Cyanide Using UV LED (자외선 LED를 이용한 자유 시안의 광촉매 산화)

  • Kim, Seong Hee;Seol, Jeong Woo;Lee, Woo Chun;Lee, Sang-Woo;Kim, Soon-Oh
    • Journal of Korean Society of Environmental Engineers
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    • v.37 no.1
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    • pp.34-44
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    • 2015
  • This study was initiated to remove free cyanide from wastewater using the process of photocatalytic oxidation. UV lamp has been extensively used as a light source in conventional photocatalytic oxidation, but numerous drawbacks of UV lamp have been raised so far. Thus, this study focused on evaluating the applicability of UV LED as an alternative light source to overcome the drawbacks of UV lamp. Furthermore, the effects of diverse operational parameters on the performance of process were investigated. The results demonstrated the applicability of UV LED as a substitute of UV lamp. Also, the results show that the performance of process was improved by the increase in the number of UV LEDs used. To acquire economic feasibility as well as high efficacy, however, it is required to determine the optimum number of UV LED prior to practical implementation of the process. Among the three types of photocatalysts (anatase, rutile, and Degussa P25) tested, the Degussa P25 showed the greatest performance, and it was proven that the process was not improved as much as the Degussa P25 through simple mixing of anatase and rutile without any pretreatment. In addition, the removal efficiency of free cyanide appeared to be increased with the decrease in the particle size of $TiO_2$ photocatalyst. Besides, the process was enhanced with injection of oxygen which is considered as a major electron acceptor in the photocatalytic oxidation.

UV/H2O2 Oxidation for Treatment of Organic Compound-spilled Water (UV/H2O2 산화를 활용한 유기오염물질 유출수 처리용 공정 연구)

  • Kim, Nahee;Lee, Sangbin;Park, Gunn;Park, Jae-Woo
    • Journal of the Korean GEO-environmental Society
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    • v.23 no.10
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    • pp.5-12
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    • 2022
  • In this study, we investigated the UV/H2O2 process to treat organic compound-spilled water. In consideration of usage and properties, benzene, toluene, phenol, and methyl ethyl ketone were selected as representative organic compounds. The selected material was first removed by natural volatilization and aeration that simulated the pretreatment of the prcoess. After that, UV/H2O2 oxidation experiments were conducted under various H2O2 concentration conditions. Benzene and toluene were mostly volatilized before reaching the oxidation process due to high volatility. Considering the volatility, oxidation experiments were performed at an initial concentration of 5 mg/L for benzene and toluene. The UV/H2O2 oxidation process achieved 100% of benzene and toluene removal after 20 minutes under all hydrogen peroxide concentration conditions. The phenol was rarely removed from the volatile experiments and oxidation tests were performed at an initial concentration of 50 mg/L. The process showed 100 % phenol removal after 30 minutes under 0.12 v/v% of hydrogen peroxide concentration condition. Methyl ethyl ketone was removed 58 % after 2 hours of volatile experiments. The process showed 99.7% Methyl ethyl ketone removal after 40 minutes under 0.08 v/v% of hydrogen peroxide concentration condition. It was confirmed that the UV/H2O2 process showed high decomposition efficiency for the four selected organic compounds, and identified the amount of hydrogen peroxide in classified organic contaminants.

The Removal of Humic Acid and Heavy Metals Using UV/TiO2/H2O2 (UV/TiO2/H2O2 공정을 이용한 휴믹산과 중금속 제거)

  • Kim, Jongoh;Jung, Jongtae;Choi, Wonyoul
    • Journal of the Korean GEO-environmental Society
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    • v.7 no.4
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    • pp.5-13
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    • 2006
  • This study was conducted to evaluate the application of $UV/TiO_2/H_2O_2$ process for treating humic acid and heavy metals in surface water. Removal efficiency of $UV/TiO_2/H_2O_2$ process was much more efficient than that of $UV/TiO_2$ process for humic acid and heavy metals removal. The removal rate of humic acid and heavy metals increased with the increase of $TiO_2$ dosage and UV intensity, however decreased with more than 0.3 g/L of $TiO_2$ dosage. The addition of $H_2O_2$ as an oxidant was a positive effect for the removal rate of humic acid and heavy metals especially in the concentration of 50 mg/L $H_2O_2$.

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