• 한국정밀공학회지
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• 제17권2호
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• pp.130-136
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• 2000

Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.551-552
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• 2007

Coating films were prepared from silane-terminated Colloidal silaca(CS) and UV-curable acrylate resin. The silane-terminated CSs were synthesized from CS and methyltrimethoxysilane(MTMS) and then treated with 3-methacryloxypropyltrimethoxysilane(MAPTMS)/3-glycidoxypropyltrimethoxysilane( GPTMS)/vinyltrimethoxysilane(VTMS) by sol-gel process, respectively. The silane-terminated CS and acrylate resin were hybridized using UV-curing system. Thin films of hybrid material were prepared using spin coater on the glass. Their hardness, contact angle and transmittance improved with the addition of silane-terminated CS.

• 접착 및 계면
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• 제18권4호
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• pp.159-165
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• 2017

본 연구에서는 반응성 희석제로 사용되는 BA의 함량에 따른 자외선 경화형 폴리우레탄 아크릴레이트 수지를 제조하여 수지의 열적 기계적 성질, 접착강도, 굴곡성을 확인하였다. BA의 함량이 40% 이상으로 증가할수록 Polyol의 Tg와 아크릴 수지의 Tg가 분리되어 나타난 것을 DSC로 통해 확인하였다. 또한 BA의 함량이 증가할수록 아크릴 수지의 낮은 기계적인 물성이 주도적으로 발현되어 인장강도와 신장률, 접착강도가 감소하는 것으로 나타났다. 굴곡성을 평가한 결과 BA의 함량이 40%인 경우 경도가 낮으면서 다른 수지에 비해 Tm이 낮아 굴곡성이 우수한 것으로 나타났다.

• Tribology and Lubricants
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• 제36권5호
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• pp.267-273
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• 2020

This study experimentally investigates hydrophobic surfaces fabricated via additive manufacturing. Additive manufacturing, commonly known as 3D printing, is the process of joining materials to fabricate parts from 3D model data, usually in a layer-upon-layer manner. Digital light processing is used to fabricate hydrophobic surfaces in this study. This method uses photo-curable resins and ultraviolet (UV) sources. Moreover, this technique generally has faster shaping speeds and is advantageous for the fabrication of small components because it enables the fabrication of one layer at a time. Two photo-curable resins with different compositions are used to fabricate micro-patterns of hydrophobic surfaces. The resins are composed of a photo-initiator, monomer, and oligomer. Experiments are conducted to determine suitable process conditions for the fabrication of hydrophobic surfaces depending on the type of resin. The most important factors affecting the process conditions are the UV exposure time and slice thickness. The fabrication capability according to the process conditions is evaluated using the side and top views of the micro-patterns observed using a microscope. The micro-patterns are collapsed and intertwined when the exposure time is short because sufficient light (heat) is not applied to cure the photo-curable resin with a given slice thickness. On the other hand, the micro-patterns are attached to each other when the exposure time is prolonged because the over-curing time can cure the periphery of a given shape. When the slice is thicker, the additional curing area is enlarged in each slice owing to the straightness of UV light, and the slice surface becomes rough.

• Macromolecular Research
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• 제15권6호
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• pp.560-564
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• 2007

The photostabilization and cure kinetics of UV-curable, optical resins containing various formulations of photostabilizers were investigated to determine the system with the highest cure conversion and durability. Photo-DSC analysis revealed that increasing the concentration of a UV absorber (UVA) decreased both the crosslink density and the cure rate due to competition for the incident photons between the photoinitiator and the UVA, whereas including a hindered amine light stabilizer (HALS) hardly affected either the cure conversion or the cure rate due to its very low absorption of 365 nm. This result was confirmed by FTIR-ATR spectroscopy and UV-visible spectroscopy analyses. QUV ageing experiments showed that the cure conversion and durability were the highest for the UVA/HALS formulation at a ratio of 1 : 2, which is due to their synergistic action.

• 융합정보논문지
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• 제7권1호
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• pp.43-48
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• 2017

디자인 트렌드는 시대에 따라 변해왔으며, 최근 21세기의 디자인 트렌드는 환경 친화적인 디자인이 대세이다. 특히 디지털 컨버전스 시대로 불리는 최근에는 옵티컬 일루젼 디자인이라는 새로운 디자인 트렌드가 부상하고 있다. 본 논문에서는 환경 친화적인 UV 경화성 수지를 이용하여 가구용 옵티컬 일루젼 패턴을 디자인하였다. 디자인된 옵티컬 일루젼 미세 패턴을 포토리소그라피 반도체 미세패턴 공정으로 제조된 마이크로 몰드를 이용하여 제조하였다. 옵티컬 일루젼 미세 패턴은 PET 필름 위에 UV 경화성 수지와 롤투롤 공정으로 제조되었다. 제조된 옵티컬 일루젼 미세패턴 PET 필름은 홀로그램 효과를 나타내었으며, 필름 배면에 실시한 디지털 프린팅으로 금속 질감을 나타내었다. 제조된 옵티컬 일루젼 디자인 패턴을 이용하여 emotional furniture로 부르는 새로운 디자인 개념의 가구를 제작하였다. 가구 제작에는 다양한 옵티컬 일루젼 디자인 패턴이 적용되었다. 이러한 UV 몰드에 의한 옵티컬 일루젼 디자인 패턴은 인테리어 디자인 소재의 새로운 트랜드가 될 것으로 전망된다.

• International Journal of Precision Engineering and Manufacturing
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• 제4권4호
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• pp.51-56
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• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

• 한국인쇄학회지
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• 제29권2호
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• pp.1-13
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• 2011

The recent spotlight on electronic touch-screen display, a rapid breakthrough in the information society is evolving. Touch panel input device such as a keyboard or mouse without the use of, the on-screen character or a specific location or object on the person's hand touches a particular feature to identify the location of a panel is to be handled. The touch screen on the touch panel is used in the Ag paste is used mostly for low-curable paste. The thermal-curing paste according to the drying process of thermal energy consumption and improve the working environment of organic solvents have problems. In this study, Ag paste used in the non-thermal curing friendly and cost-effective UV curable paste was prepared. Current commercially available thermal-curable binder, was used instead of the flow characteristics of UV-curable oligomers and monomers with functional groups to give a single conductive Ag paste with the addition of a pattern could be formed. Ag paste as a result, thermal-curing adhesive, hardness, resistance and excellent reproduction of fine patterns and was available with screen printing environmentally friendly could see its potential as a patterning technology.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.727-728
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• 2008

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.669-670
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• 2009