• Proceedings of the Korean Society of Laser Processing Conference
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• 2002.05a
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• pp.61-64
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• 2002

• Proceedings of the Korean Society of Laser Processing Conference
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• 2001.05a
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• pp.78-80
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• 2001

• Proceedings of the Korean Society of Laser Processing Conference
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• 2001.05a
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• pp.92-95
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• 2001

• Journal of the KSME
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• v.37 no.12
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• pp.47-52
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• 1997

엑사이머 레이저는 Ar, Kr, Xe등의 희귀가스와 F, Cl과 같은 할로겐족 가스를 혼합하여 방전여기에 의해 발진되는 157-350mm 파장대에 자외선 레이저이다. UV레이저를 이용하면 종래의 기계 가공 공정으로 실현할 수 없는 극소형 및 초정밀의 기계구조, 센서 또는 액츄에이터를 비접촉식으로 할 수 있고 가공시 열손상이 거의 없다. 최근 제품의 소형화 및 박막화 추세에 따른 미세가공 기술의 급속한 발전을 살펴보면, Uv레이저를 이용한 실리콘 표면의 도핑(dopping)에 관한 연구, 미소전자 패키징에 레이저를 이용하는 방법뿐만 아니라, 레이저 유도에 의한 금속과 혼합물의 물질전달 현상을 활용한 마이크로 패터닝에 관한 연구도 진행되고 있다. 본 글에서는 여러가지 응용분야 중 레이저 어블레이션, 레이저유도화학에칭, 레이저 PVD등에 대하여 기술한다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.54-54
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• 2003

• Laser Solutions
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• v.16 no.2
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• pp.7-11
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• 2013

Recently advanced laser processing is widely introduced to improve the efficiency of micro part production and to reduce the rate of inferior goods. In this paper the trend of delamination of single layer with both thin copper and polyimide according to the variation of copper thickness was investigated using the coupled thermal-structural analysis of ANSYS. From these analyses results, some conclusions were obtained. Firstly, the maximum temperature was increasing with respect to decrease of copper thickness. Secondly the maximum strain which was in general estimation the main effect of the delamination was observed in case of the copper thickness of $5{\mu}m$. Finally the trend of the delamination was decreasing with increasing the thickness of copper layer.

• Laser Solutions
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• v.15 no.4
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• pp.16-19
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• 2012

Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15um and a depth of $13{\mu}m$. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.517-518
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• 2006

• Laser Solutions
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• v.14 no.1
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• pp.14-18
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• 2011

Semiconductor industry demands decrease in line/space dimensions of IC substrates. Particularly for IC substrates for CPU, line/space dimensions below $10{\mu}m/10{\mu}m$ are expected to be used in production since 2014. Conventional production technologies (SAP, etc.) based on photolithography are widely agreed to be reaching capability limits. To address this limitation, the embedded circuit fabrication technology using laser ablation has been recently developed. In this paper, we used a nanosecond UV laser and a picosecond UV laser to fabricate embedded circuit patterns into a buildup film with $SiO_2$ powders for IC substrate. We conducted SEM and EDS analysis to investigate surface quality of the embedded circuit patterns. Experimental results showed that due to higher recoil pressure, picosecond UV laser ablation of the buildup film generated a better surface roughness.

• Laser Solutions
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• v.6 no.1
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• pp.9-16
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• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.