• Proceedings of the KWS Conference
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• 2005.06a
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• pp.314-316
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• 2005

이 논문에서는 아크 용접시 발생하는 IR신호와 UV호의 상호 관계를 알아보려고 레이저 용접진단에 사용되는 IR-UV 센서 모니터링 시스템을 적용하였다. 그 결과 IR신호 크기는 용접폭에 관련이 있고, 펄스 형태의 UV신호는 IR신호 증가율이 임계값을 넘으면 나타나는 것을 알 수 있다.

• Proceedings of the Optical Society of Korea Conference
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• 2000.08a
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• pp.108-109
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• 2000

현재 많은 종류의 레이저가 학술적으로나 산업계에서 다양하게 사용되고 있다. 그리고 그 중에서도 자외선 레이저의 필요성이 한층 강조되고 있는 시점이다. 사용되고 있는 자외선 레이저는 Eximer 레이저, Nd:YAG의 제3고조파, 다른 레이저로 펌핑한 색소 레이저등이 그 주류를 이루고 있다. 하지만 이들 레이저들은 값이 아주 고가이거나 그 출력이 매우 낮아 새로운 방식의 레이저를 요구하고 있다. 그래서 본 실험실에서는 여러 용도로 사용 가능한 펄스형 고출력 색소 레이저를 개발하고 있다. (중략)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.303-304
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• 2008

• Laser Solutions
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• v.18 no.1
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• pp.18-22
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• 2015

In this paper, controlling shape of optical fiber tip for endoscope was investigated for eliminating blind spot. The blind spot of endoscope is generated by divergence angle of optical fiber, so it is easy to generate blind spot when tightly focusing. In order to eliminate this region, fiber tip is necessary to be controlled as convex or concave. Illumination simulation of convex and concave type of fiber tip in the endoscope was in progress, so the distance of non- blind region was investigated in each case. As well as the simulation, the tip was fabricated as concave shape by UV laser machining. Then the beam radiation was measured to observe the blind region. The result showed that controlling the fiber tip as convex or concave shape makes the narrow blind region of illumination in endoscope.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.128-132
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• 2006

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355nm and 80MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow rate, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repetition rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20{\mu}m$ and $10{\mu}m$ at more than 500mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed of laser material process.

• Laser Solutions
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• v.16 no.2
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• pp.16-18
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• 2013

In this paper, we fabricated breathable films on the use of microwave oven by using UV nanosecond laser micromachining, and the number of micro-grooves on the film is controlled for different oxygen transfer rate(OTR). As different number of micro-groove, the breath films of 100,000cc, 120,000cc, and 150,000cc can be fabricated. The breath film package of 120,000cc is used for the experiment of steaming a sweet potato. At the result, the sweet potato is well-cooked with enough moisture in the package not bursted.

• The Optical Journal
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• s.169
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• pp.52-56
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• 2017

• Proceedings of the Optical Society of Korea Conference
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• 1996.09a
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• pp.11-11
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• 1996

• Journal of the Korean Society for Precision Engineering
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• v.24 no.2 s.191
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• pp.134-139
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• 2007

Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.

• Laser Solutions
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• v.11 no.1
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• pp.7-11
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• 2008

Decapsulation technology is useful to inspect EMC of package device and the etching technology enable to check inside of device by removing plastic molding. Chemical etching method is used widely to fabricate a lot of semiconductor. But the method has some disadvantage due to wet process. Proposed method in this paper shows the application possibility such as fast processing time, processing accuracy and dry process. These result was obtained by directly removing of packed EMC using UV laser.