• Title/Summary/Keyword: Triple Contact Line

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Finite Element Analysis of Electrical Double Layers near Triple Contact Lines

  • Kang Kwan Hyoung;Kang In Seok;Lee Choung Mook
    • Proceedings of the KSME Conference
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    • 2002.08a
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    • pp.491-494
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    • 2002
  • To assess the electrostatic interaction of surfaces at the triple contact line, the electrostatic field is analyzed by using the finite element method. The Helmholtz free energy is used as a functional which should be minimized under an equilibrium condition. The numerical results are compared with the nonlinear analytical solution for a two-dimensional charged interface and linear solution for a wedge shaped geometry, which shows fairly good agreement. The method is applied to the analysis of electrostatic influence on the contact angle on a charged substrate. The excess free energy found to increase drastically as the contact angle approaches to zero. This excess free energy Plays an opposite role to the Primary electrocapillary effect, as the contact angle gets smaller. This enables an alternative explanation for the contact-angle saturation phenomenon occurring in electrical control of surface tension and contact angle.

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Measurement of Dynamic Contact Angle of Droplet on Moving Hydrophobic and Hydrophilic Surfaces (이동하는 소수성 및 친수성 표면에서 액적의 동접촉각 측정)

  • Song, Jungyu;Kim, Hyungdae
    • Journal of the Korean Society of Visualization
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    • v.16 no.2
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    • pp.16-22
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    • 2018
  • This study investigates dynamic wetting behaviors of a water droplet placed on surfaces with different wettability and nano-structures. Hydrophobic and hydrophilic properties on as-received silicon wafers were prepared by fabricating thin films of hydrophobic polymer and hydrophilic nanoparticles via layer-by-layer coating. Dynamic advancing contact angle of droplets on the prepared surfaces was measured at various moving velocities of triple contact line with a high-speed video camera. As advancing velocity of triple contact line increased, dynamic advancing contact angle on the as-received silicon and hydrophobic surfaces sharply increased up to $80^{\circ}$ in the range of order of mm/sec whereas the SiO2 nanoparticle-coated hydrophilic surface maintained low contact angles of about $30^{\circ}$ and then it gradually increased in the velocity range of order of hundred mm/sec. The improved dynamic wetting ability observed on the nanostructured hydrophilic surface can benefit the performance of various phase-change heat transfer phenomena under forced convective flow.

Numerical study on pressure drop with moving contact lines of dry slug flow in a hydrophobic minichannel (소수성 미니채널 내 움직이는 접촉선을 가진 액체슬러그의 압력 강하에 대한 수치해석)

  • Jeon, Jun Ho;Park, Su Chung;Yu, Dong In;Kim, Tae Hun;Lee, Yeon Won
    • Journal of the Korean Society of Visualization
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    • v.18 no.3
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    • pp.116-121
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    • 2020
  • In this study, a single-phase analysis of droplet slug with different contact angles was performed based on the visualization of experimental results. Droplet slug - flowing between gases in a hydrophobic mini channel - moves with a triple contact line without a gas liquid film on the wall. The results show that the rotational flow inside the droplet occurred; this was compared and verified with the results of two-phase analysis. The pressure field shows pressure rise at the front and rear ends. The effective length - the section that satisfies the laminar flow condition - became shorter as the droplet velocity increased. The Choi's correlation for the effective length agrees with this analysis results with a slight difference. This difference is judged as the difference in the contact angle of the slug model.

Critical Heat Flux Enhancement Mechanism on a Surface with Nano-Structures (나노 구조가 형성된 열전달 표면에서의 임계 열유속 증진 메커니즘)

  • Kim, Dong Eok
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.38 no.7
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    • pp.619-624
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    • 2014
  • The critical heat flux (CHF) on a heat transfer surface with nanostructures is known to be significantly better than that on flat surfaces. Several physical mechanisms have been proposed to explain this phenomenon. However, almost all studies conducted so far have been qualitative, and a generalized theory has not yet been established. In this study, we developed a quantitative mechanism for CHF enhancement on a surface with nanostructures, based on vapor recoil and surface adhesion forces. We focused on the increase in the length of the triple contact line owing to the formation of nanostructures and the adhesion force between them and the liquid.

Internal Flow and Evaporation Characteristic inside a Water Droplet on a Vertical Vibrating Hydrophobic Surface (수직 진동하는 소수성 표면 위 액적의 내부유동 및 증발특성 연구)

  • Kim, Hun;Lim, Hee-Chang
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.39 no.7
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    • pp.579-589
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    • 2015
  • This study aims to understand the internal flow and the evaporation characteristics of a deionized water droplet subjected to vertical forced vibrations. To predict and evaluate its resonance frequency, the theories of Lamb, Strani, and Sabetta have been applied. To visualize the precise mode, shape, and internal flow inside a droplet, the experiment utilizes a combination of a high-speed camera, macro lens, and continuous laser. As a result, a water droplet on a hydrophobic surface has its typical shape at each mode, and complicated vortices are observed inside the droplet. In particular, large symmetrical flow streams are generated along the vertical axis at each mode, with a large circulating movement from the bottom to the top and then to the triple contact line along the droplet surface. In addition, a bifurcation-shaped flow pattern is formed at modes 2 and 4, whereas a large ellipsoid-shape flow pattern forms at modes 6 and 8. Mode 4 has the fastest internal flow speed and evaporation rate, followed by modes 8 then 6, with 2 having the slowest of these properties. Each mode has the fastest evaporation rate amongst its neighboring frequencies. Finally, the droplet evaporation under vertical vibration would lead to more rapid evaporation, particularly for mode 4.