• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.111-111
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• 2000

최근 질화물 반도체를 이용한 단파장 laser diode (LD)와 ultraviolet light emitting diode (LED)에 관한 관심의 증가로 인하여 AlGaN의 성장에 관한 연구가 많이 진행되고 있다. Metalorganic chemical vapor deposition (MOCVD)법을 이용한 AlGaN 성장에 있어서는 Al의 전구체로 널리 사용되고 있는 trimethylaluminum (TMAl)과 암모니아와의 기상에서의 adduct 형성을 억제하기 위하여 주로 저압에서 성장을 하거나 원료 가스의 유속을 증가시키는 방법으로 연구가 되고 있다. 또한, AlN의 경우 GaN보다 녹는점이 매우 높기 때문에 일반적으로 Al을 포함하는 질화물 반도체의 성장에 있어서는 GaN보다 녹는점이 매우 높기 때문에 일반적으로 Al을 포함하는 질화물 반도체의 성장에 있어서는 GaN 성장 시보다 높은 온도에서 성장이 이루어지고 있다. MOCND법을 이용하여 AlGaN를 성장시키는 대부분의 연구들은 100$0^{\circ}C$ 이상의 고온에서의 성장 온도가 AlGaN특성에 미치는 영향에 대한 것으로 국한되고 있다. 그러나, InGaN/GaN multiple quantum wells (MQWs) 구조의 LD나 LED를 성장시키는 경우 In의 desorption을 억제하기 위하여 MQWs층 위에 저온에서 AlGaN를 성장하는 데 있어서 AlGaN의 성장 온도를 500-102$0^{\circ}C$로 변화시키면서 AlGaN의 성장거동을 고찰하였다. GaN는 사파이어 기판을 수소분위기하에서 고온에서 가열한 후 저온에서 GaN를 이용한 핵생성층을 성장하고 102$0^{\circ}C$의 고온에서 1.2$\mu\textrm{m}$정도의 두께로 성장하였다. AlGaN는 고온에서 성장된 GaN 위에 200Torr의 성장기 압력 하에서 trimethylgallium (TMGa)과 TMAl의 유속을 각각 70 $\mu$mol/min 으로 고정한 후 성장온도만을 변화시키며 증착하였다. 성장 온도가 낮아짐에 따라 AlGaN의 표면거칠기가 증가하고, 결함과 관련된 포토루미네슨스가 현저히 증가하는 것이 관찰되었다. 그러나, 성장온도가 50$0^{\circ}C$정도로 낮아진 경우에 있어서는 표면 거칠기가 다시 감소하는 것이 관찰되었다. 이러한 현상은 저온에서 표면흡착원자의 거동에 제한이 따르기 때문으로 생각되어진다. 또한, 성장 온도가 낮아짐에 따라 AlGaN의 성장을 저해하기 때문으로 판단된다. 성장 온도 변화에 따라 성장된 V의 구조적 특성 및 표면 거칠기 변화를 관찰하여 AlGaN의 성장 거동을 논의하겠다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.401-401
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• 2012

유기발광소자는 유연 소자로의 적용, 자체 발광 등의 장점으로 차세대 디스플레이로서 각광받고 있다. 하지만 유기발광소자는 유기물을 발광층으로 하고 있기 때문에 수분에 취약하다는 단점이 있다. 그래서 봉지 기술(encapsulation)을 필요로 한다. 널리 알려진 방법으로는 유리로 소자를 감싸고 내부에 흡습제를 충진하여 수분 투습을 줄일 수 있다. 하지만 위 기술을 사용할 경우 유기발광소자의 장점인 유연 소자의 적용이 어렵다. 따라서 박막 봉지 기술을 이용하면 보다 얇은 두께의 소자 제작이 가능하고 유연 소자의 적용 역시 가능해진다. 박막 코팅을 이용한 봉지 기술 중 화학적 증착법(Chemical Vapor Deposition, CVD)이나 물리적 증착법(Physical Vapor Deposition, PVD)을 이용하는 방법이 널리 알려져 있지만 원자층 증착법(Atomic Layer Deposition, ALD)을 이용하면 보다 낮은 두께의 치밀한 박막을 제작 할 수 있다. 본 연구는 원자층 증착법을 응용한 분자층 증착법(Molecular Layer Deposition, MLD)을 이용하여 Trimethylaluminum과 Ethylene glycol을 순차적으로 주입함으로써 Alucone 유기 박막을 제작하고 유기발광소자의 봉지 기술로의 적용을 위해 투과 방지막 특성에 관하여 분석했다. 박막 봉지 기술로서 적용하기 위해 제작된 투과 방지막은 원자층 증착법으로 Al2O3무기 박막을 제작하고 분자층 증착법으로 Alucone 박막을 순차적으로 증착하였다. 이를 Ca를 이용하여 전도도를 측정하고, 투습도를 계산하여 투과 방지막 특성을 분석하였다. Alucone 박막은 우수한 투과 방지막 특성을 가지지는 못하지만 적층 구조로 제작함으로써 두 쌍의 Alucone/Al2O3일때, $6.07{\times}10^{-2}g/m^2day$의 투습도를 보여주고 있다. Alucone 박막의 존재는 수분이나 산소의 투과 경로 길이를 늘려줌으로써 Alucone/Al2O3 박막의 투과방지 특성이 향상되는 것으로 사료된다.

• Journal of Powder Materials
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• v.25 no.1
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• pp.43-47
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• 2018

Carbon nanofibers (CNF) are widely used as active agents for electrodes in Li-ion secondary battery cells, supercapacitors, and fuel cells. Nanoscale coatings on CNF electrodes can increase the output and lifespan of battery devices. Atomic layer deposition (ALD) can control the coating thickness at the nanoscale regardless of the shape, suitable for coating CNFs. However, because the CNF surface comprises stable C-C bonds, initiating homogeneous nuclear formation is difficult because of the lack of initial nucleation sites. This study introduces uniform nucleation site formation on CNF surfaces to promote a uniform $SnO_2$ layer. We pretreat the CNF surface by introducing $H_2O$ or $Al_2O_3$ (trimethylaluminum + $H_2O$) before the $SnO_2$ ALD process to form active sites on the CNF surface. Transmission electron microscopy and energy-dispersive spectroscopy both identify the $SnO_2$ layer morphology on the CNF. The $Al_2O_3$-pretreated sample shows a uniform $SnO_2$ layer, while island-type $SnO_x$ layers grow sparsely on the $H_2O$-pretreated or untreated CNF.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.10
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• pp.652-657
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• 2015

We have investigated the properties of Al-doped ZnO (AZO) thin films as functions of atomic layer deposition (ALD) oxidants. AZO transparent conducting oxides (TCOs) layer was deposited by ALD with adding trimethylaluminum (TMA) and diethylzinc (DEZn). AZO films were deposited at low temperature with $H_2O$ and $O_3$ as oxidants. Electrical, optical and structural properties of AZO thin films were investigated by 4-point probe, Hall effect measurement, UV-VIS, and AFM. Microstructure and atomic bonding states were investigated by HRXRD and XPS. The resistivity of AZO films grown using $H_2O$ was lower than the films grown using $H_2O$ and $O_3$, by approximately two orders of magnitude. The differences in oxygen vacancy peak intensity of AZO films were correlated to the optical and electrical properties.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.6
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• pp.470-475
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• 2009

We deposited $Al_2O_3$ thin films on GaN by remote plasma atomic layer deposition (RPALD) technique, trimethylaluminum(TMA) and oxygen were used as precursors, at fixed process condition, the number of cycle were changed. Growth rate per cycle was $1.2\;{\AA}$/cycle. and Growth rate was in proportion to a number of cycle, the GaN MIS capacitors that $Al_2O_3$ thin film were deposited above 12 nm, have excellent electrical properties, a low electrical leakage current density(${\sim}10^{-10}\;A/cm^2$ at 1.5 MV), but below 12 nm, we can see the degradation of the leakage current density. After post deposition annealing, Dielectric constant was estimated by 1 MHz high-frequency C-V method, it was varied with the anealing temperature from 6.9 at no post anealed to 7.6 at $800^{\circ}C$, and we can see a improvement of the leakage current density and breakdown voltage by post deposition anealing below $700^{\circ}C$, but, after anealed at $800^{\circ}C$, we can see the degradation of the leakage current density and breakdown voltage.

• Korean Journal of Materials Research
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• v.27 no.6
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• pp.295-300
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• 2017

Aluminum-oxide($Al_2O_3$) thin films were deposited by electron cyclotron resonance plasma-enhanced atomic layer deposition at room temperature using trimethylaluminum(TMA) as the Al source and $O_2$ plasma as the oxidant. In order to compare our results with those obtained using the conventional thermal ALD method, $Al_2O_3$ films were also deposited with TMA and $H_2O$ as reactants at $280^{\circ}C$. The chemical composition and microstructure of the as-deposited $Al_2O_3$ films were characterized by X-ray diffraction(XRD), X-ray photo-electric spectroscopy(XPS), atomic force microscopy(AFM) and transmission electron microscopy(TEM). Optical properties of the $Al_2O_3$ films were characterized using UV-vis and ellipsometry measurements. Electrical properties were characterized by capacitance-frequency and current-voltage measurements. Using the ECR method, a growth rate of 0.18 nm/cycle was achieved, which is much higher than the growth rate of 0.14 nm/cycle obtained using thermal ALD. Excellent dielectric and insulating properties were demonstrated for both $Al_2O_3$ films.

• Polymer(Korea)
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• v.36 no.1
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• pp.53-58
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• 2012

The differences between single and mixed aluminium catalyst systems in the bulk polymerization of L-lactide were studied. $Al(O-i-Pr)_3$, TMA, TOA and TIBA were employed for the mixed-catalyst systems, and TIBA was chosen as a reference catalyst. For the $Al(O-i-Pr)_3$/TIBA catalyst system, the conversion of polymerization increased as the composition of $Al(O-i-Pr)_3$ in the mixed catalyst increased. The molecular weight of the resulting PLA reached to about 13000 g/mol, and the polydispersity index of the polymer from the $Al(O-i-Pr)_3$/TIBA catalyst was slightly increased than that of single catalyst. The higher molecular weight tail or shoulder was revealed in the GPC curve. The conversion of the TOA/TIBA catalyst system decreased as the composition of TOA in the mixed catalyst increased. The molecular weight of PLA prepared with TOA/TIBA catalysts increased up to 14000 g/mol. The Al compounds-mixed catalysts could produce a higher molecular weight tail or shoulder in the GPC curve, which may result in enhancement of mechanical properties of PLA.

• Applied Chemistry for Engineering
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• v.29 no.4
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• pp.461-467
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• 2018

In this study, $(n-BuCp)_2ZrCl_2$, was supported on $SiO_2/MgCl_2$ binary support. Before supporting the catalyst, the $SiO_2/MgCl_2$ binary support was surface treated with three different alkyl aluminum compound, namely trimethylaluminum, triethylaluminum, and ethylaluminum sesquichloride. The synthesized surface-treated $SiO_2/MgCl_2$ supported metallocene catalysts were used for the copolymerization of ethylene and 1-hexene. Their catalytic properties and performances were analyzed through BET, XPS analysis, ICP-AES analysis, and FE-SEM. While the resulting copolymers were analyzed through DSC analysis, GPC analysis, 13C-NMR analysis, and FE-SEM. The analysis of synthesized surface-treated $SiO_2/MgCl_2$ supported metallocene catalysts showed that the Zr content of these catalysts is relatively lower compared to that of the catalyst supported on $SiO_2$. This could be attributed to the reduction in the surface area of $SiO_2$ due to the presence of recrystallized $MgCl_2$ and alkyl aluminum. Furthermore, they exhibited a better copolymerization activity compared to that of $SiO_2$ supported catalyst, particularly the EASC-surface treated binary support, which has the highest activity of 1.9 kg PE/($mmol-Zr^*hr$) because EASC acts as a strong Lewis acid. It could also be observed that the larger the ligand of alkyl aluminum used, the rougher the particle surface of the resulting polymer.