• 대한기계학회논문집A
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• 제37권10호
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• pp.1269-1278
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• 2013

엔드밀링 공정은 형상창성기구의 특성 상, 절삭면적의 주기적인 변화를 피할 수 없다. 그러므로, 본 연구에서는, 가공 중 절삭날과 공작물 사이의 간섭영역에 해당하는 절삭면적의 모델을 확립하여, 가공면 형상 특성과 절삭면적의 관계를 규명하고자 한다. 대상 가공면은 측벽을 선정하였으며, 형상 특성은 축 방향 진직도를 선택하였다. 절삭면적 및 축방향 진직도에 영향을 미치는 특이점 추정 모델의 타당성은 반경 방향 및 축 방향 절삭깊이를 변화시키며 엔드밀링 가공을 수행하여 검증하였다. 연구 결과, 배분력이 음의 값을 갖지 않는 안정적인 엔드밀링 가공의 경우, 상향절삭은 절삭면적이 증가했다. 일정해지는 영역에서, 하향절삭은 절삭면적이 일정했다 감소하는 영역에서 가공면을 창성하며, 영역이 변화될 때 가공면에 특이점이 발생하는 것이 확인되었다.

• Journal of Acupuncture Research
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• 제20권6호
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• pp.168-181
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• 2003

Objective: The neuroanatomical studies on the acupoints(Waiguan(SJ5), Neiguan(Pe6), Sanyinjiao(SP6) and Xuanzhong(GB39)) projecting to the brain area related to dimentia using the pseudorabies virus (PRV-Ba strain) in the mouse was described. Methods: The common locations of the brain projecting to the Waiguan, Neiguan, Sanyinjiao and Xuanzhong following injection of PRV-Ba were histochemically observed. The results were as follows Results : 1. PRV-Ba labeled areas in medulla oblongata, pons and midbrain were similar to 4 acupoints, theses areas were related to autonomic center. 2. PRV-Ba labeled areas in diencephalon and cebrebrum were differently labeled according to the acupoints. 3. CNS labeled areas in Waiguan were dense labeled in CA1-3 area of hippocampus, amygdaloid nucleus, insular cortex, parietal cortex, entorhinal cortex, perirhinal cortex, dorsal endopiriform cortex, piriform cortex, amygdalopiriform transition and bed n. of stria terminalis. 4. CNS labeled areas in Neiguan were dense labeled in insular cortex, amygdaloid nucleus, parietal cortex, entorhinal cortex, perirhinal cortex, dorsal endopiriform cortex, piriform cortex, amygdalopiriform transition and bed n. of stria terminalis. 5. CNS labeled areas in Sanyinjiao were dense labeled in CA1-3 of hippocampus, suprachiasmatic n., dorsal endopiriform cortex, piriform cortex and bed n. of stria terminalis. 6. CNS labeled areas in Xuanzhong were dense labeled in suprachiasmatic n., dorsal endopiriform cortex and piriform cortex. Conclusions : Following these results, labeled acupoints in brain areas related to dimentia are Waiguan and Neiguan. Common labeled areas are amygdaloid n., entorhinal cortex, amygdaopiriform transition, bed n. stria terminalis and perirhinal cortex.

• 한국세라믹학회지
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• 제25권3호
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• pp.193-200
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• 1988

침전법에 의해서 pH가 7, 9, 10, 11인 조건에서 생성된 알루미늄 수산화물을 출발물질로 하여 열처리에 따른 알루미나 분말의 특성을 연구하였다. $600^{\circ}C$에서 2시간 동안 열처리하였을 때 비정질 알루미늄 수산화물의 결정수가 탈수된 후에 생성된 최초의 상은 비정질 알루미나의 비표면적은 감소하였다. 비정질 알루미늄 수산화물을 제외한 나머지 알루미늄 수산화물로부터 결정수의 탈수는 비표면적을 증가시켰으며 AlOOH 형태의 수산화물의 존재비가 클수록 전이 알루미나 존재영역까지는 비표면적이 더 크게 나타났다. $\alpha-Al_2O_3$로의 전이속도는 동일온도에서 pH=7 > pH=10 > pH=9 > pH=11의 순서로 일어났으며, 생성된 $\alpha-Al_2O_3$ 분말의 morphology는 알루미늄 수산화물의 외형을 남긴 형골입자(skeleton particle였다. 또한, 열처리 온도의 증가와 $\alpha-Al_2O_3$로의 전이가 일어남에 따라 비표면적의 감소와 더불어 입자성장이 일어나다.

• 건축역사연구
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• 제13권4호
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• pp.7-18
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• 2004

From the results of an examination of the transition process of the site plan divided into 5 stages based on literature and materials relating to the Sangju Confucian School as well as the construction history, we can see the general transition flow as follows. The arrangement form of Sangju Confucian School shows the structures with both the sacrificial rites function and the learning function in the early period. This shows a large general flow where the form with the learning function structure at the front and sacrificial rites function structure at the back changed to a form where the learning function structure was positioned behind the boarding facilities, after which there was a transformation which left only the learning function (the form where the learning function structure was positioned in front of the boarding facilities). The type where the learning function structure is positioned in front of the boarding facilities is hard to find in the Yeongnam area, also, there are not many examples of the 2 story Myeonglyundang (hall of confucianism teachings) throughout the country Sangju Confucian School which possess the value of rarity is appraised as being a precious material showing another area characteristic in Sangju of the Yeongnam area. Also, during the late Chosun period the scale of the Dongseojae (boarding facility) was reduced and the appearance of Yangsajae can be said to be a typical example of confucian school constructions of late Chosun era.

• 한국측량학회지
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• 제35권1호
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• pp.23-30
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• 2017

NDVI (Normalized Difference Vegetation Index) plays an important role in surface land cover classification and LST (Land Surface Temperature Extraction). Its characteristics do not full carry the information of the surface cover typically in urban areas even though it is widely used in analyses in urban areas as well as in vegetation. However, abnormal NDVI values are frequently found in urban areas. We, therefore, examined NDVI values on whether NDVI is appropriate for LST and whether there are considerations in NDVI analysis typically in urban areas because NDVI is strongly related to the surface emissivity calculation. For the study, we observed the influence of the surface settings (i.e., geometric shape and color) on NDVI values in urban area and transition features between three land cover types, vegetation, urban materials, and water. Interestingly, there were many abnormal NDVI values systematically derived by the surface settings and they might influence on NDVI and eventually LST. Also, there were distinguishable transitions based on the mixture of three surface materials. A transition scenario was described that there are three transition types of mixture (urban material-vegetation, urban material-water, and vegetation-water) based on the relationship of NDVI and LST even though they are widely distributed.

• 전기학회논문지
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• 제67권3호
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• pp.467-473
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• 2018

R-Bar(Overhead Rigid Conductor system) is being developed for the high-speed in Europe because it has an advantage of cross section area reduction of tunnel compared with OCS (Overhead Catenary Line). Because there are lots of underground sections and mountains in korea, it is necessary to develop the R-Bar for a high-speed line. In this study, a method on speed-up of transition section between OCS and R-Bar is proposed. The commercial program, DAFUL, is used to predict a dynamic characteristics between Overhead Line and pantograph. The program is evaluated according to EN 50318 which is the European Norm for evaluation of the program. Using the evaluated modeling and method, a method for the max. speed of 250 km/h of transition section is proposed.

• 마이크로전자및패키징학회지
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• 제8권2호
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• 한국응용곤충학회지
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• 제4권
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• pp.1-6
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• 1965

In Korea the most important plant industry is the rice-growing but she has not yet attained self-sufficiency with regard to rice which is the basic food of Korean. In the past, various measures of increasing rice production have been tried with some success but the increasing rate of did not show the sufficient result. Judging from experiences, disease control may be the most important factor which has influence on increasing of rice production in Korea. During the past 60 years three periods divided by the transition of rice diseases were noted, and especially the recent transition attracted much attention . That is, sheath blight and stripe which were minor diseases in the past have promptly spread all over the country and caused heavy losses to rice plant, and also local outbreak of bacterial leaf blight and dwarf were noticed. Various environmental factors are related to such transition of rice disease. Above all, cultivated varieties susceptible to these diseases, increase of application of nitrogenous fertilizer, earlier transplanting and density of transplanting are considered to be lucre closely related to the development of these diseases and successive development of blast. On the other hand. application of forage fungicides such as organic mercury compounds specific to blast contributed to reduce prevalent area if blast in spite of wide spread of susceptible varieties and increase of application of nitrogenous fertilizer. These facts were confirmed by Korean investigators At the present which various diseases to control coexist in the same region, no one variety resistant to all of these diseases is provided and cultural practices for the control of these diseases often do not produce sufficient yield of rice. it is emphasized that a role of pesticides is very great.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• 한국입자에어로졸학회지
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• 제6권1호
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• pp.29-35
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• 2010

Transition metals such as V, Fe, and Ni were used to synthesize doped zinc oxide nanoparticles from mixed liquid precursors by using the flame spray pyrolysis (FSP). The effects of dopants on the powder properties such as morphology, specific surface area, crystal structure, and light adsorption were analyzed by TEM, BET, XRD, and UV-Vis diffuse reflection spectrum (DRS), respectively. The results showed that hexagonal wurtzite structured ZnO:M (M = V, Fe, Ni) nanoparticles were successfully synthesized by the FSP. The transition metal-doping resulted in the decrease in its particle size and crystallite size. The UV-vis absorption spectra of ZnO:M nanoparticles were also red-shifted. ZnO:V showed the highest MB degradation of 99.4% under the UV irradiation after 3 hrs.