• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.5
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• pp.270-275
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• 2017

Current progress in the development of semiconductor technology in applications involving high electron mobility transistors (HEMT) and power devices is hindered by the lack of adequate ways todissipate heat generated during device operation. Concurrently, electronic devices that use gallium nitride (GaN) substrates do not perform well, because of the poor heat dissipation of the substrate. Suggested alternatives for overcoming these limitations include integration of high thermal conductivity material like diamond near the active device areas. This study will address a critical development in the art of GaN on diamond (GOD) structure by designing for ideal heat dissipation, in order to create apathway with the least thermal resistance and to improve the overall ease of integrating diamond heat spreaders into future electronic devices. This research has been carried out by means of heat transfer simulation, which has been successfully demonstrated by a finite-element method.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.743-746
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• 2003

We have successfully used hydrophobic direct-wafer bonding, along with H-induced layer splitting of Ge, to transfer 700nm think, single-crystal Ge films to Si substrates. Optical and electrical properties have been also observed on these samples. Triple-junction solar cell structures gown on these Ge/Si heterostructure templates show comparable photoluminescence intensity and minority carrier lifetime to a control structure grown on bulk Ge. When heavily doped p$^{+}$Ge/p$^{+}$Si wafer bonded heterostructures were bonded, ohmic interfacial properties with less than 0.3Ω$\textrm{cm}^2$ specific resistance were observed indicating low loss thermal emission and tunneling processes over and through the potential barrier. Current-voltage (I-V) characteristics in p$^{+}$Ge/pSi structures show rectifying properties for room temperature bonded structures. After annealing at 40$0^{\circ}C$, the potential barrier was reduced and the barrier height no longer blocks current flow under bias. From these observations, interfacial atomic bonding structures of hydrophobically wafer bonded Ge/Si heterostructures are suggested.ested.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.760-765
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• 2001

A new rapid prototyping process, as a transfer type of Variable Lamination Manufacturing by using expandable polystyrene foam (VLM-ST), has been developed to reduce building time, apparatus cost including the introduction and the maintenance and additional post-processing. The objective of this study is to propose a VLM-ST process and to develop an apparatus for implementation of the process. Design criteria of the apparatus were defined and the techniques were proposed to satisfy the design criterion. In order to examine the efficiency and applicability of the developed process, various three-dimensional shapes, such as a world-cup logo, a knob shape and a character, Son-o-kong, were fabricated on the apparatus in which unit shape layer (USL) was generated to build up each layer.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.8
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• pp.1122-1130
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• 2001

Film cooling performance from two rows of holes with opposite orientation angles is evaluated in terms of heat flux ratio. The film cooling hole has a fixed inclination angle of 35°and orientation angle of 45°for the downstream row and -45°for the upstream row. Four film cooling hole arrangements including inline and staggered configurations are investigated. The blowing ratio studied was 1.0. Boundary layer temperature distributions are measured to investigate injectant behaviors and mixing characteristics. Detailed distributions of the adiabatic film cooling effectiveness and the heat transfer coefficient are measured using TLC(Thermochromic Liquid Crystal). For the inline configuration, there forms a downwash flow at the downstream hole exit to make the injectant well attach to the wall, which gives high adiabatic film cooling effectiveness and heat transfer coefficient. The evaluation of heat flux ratio shows that the inline configuration gives better film cooling performance with the help of the downwash flow at the downstream hole exits.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.5
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• pp.645-652
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• 2001

Heat transfer data are presented which describe characteristics of the transitional thermal boundary layers on the NACA0012 airfoil with upstream wakes. The wakes are generated periodically by circular cylindrical rods which rotate around the airfoil like a squirrel cage. The unsteady wakes simulate those produced by the upstream rotating blade rows in axial turbomachines. The pressure or suction side of the airfoil is also simulated according to the rotating direction of circular rods. As the Reynolds number and the number of rotating rods increase, the boundary layer transition occurs earlier and the Nusselt number increases. The difference of heat transfer coefficient is less on the pressure side than on the suction side. At a constant Reynolds number, the Nusselt number is larger and smaller, respectively, before and after transition as the Strouhal number increases.

• Transactions of the Korean Society of Mechanical Engineers
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• v.9 no.5
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• pp.613-620
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• 1985

An analysis on the thermal instability of horizontal Blasius flow in the form of longitudinal vortices has been carried out by introducing the 3-dimensional spatial dependence of the disturbance quantities. The stability problem has been simplified significantly by considering the limiting case of infinite Prandtl number and by skilfully replacing the boundary conditions at infinity with the interface conditions at the edge of the thermal boundary layer (or by simply confining the thermal disturbances in the thermal boundary layer). The advantage of this approach is that the critical values marking the onset of thermal instability can be readily obtained as solutions of the eigenvalues problems formulated by a 6*6(or a 5*5) determinant. Present analysis provides reasonable explanations on the existing experimental and theoretical data. Especially, the heat transfer correlation based on the present analysis agrees well with the existing experimental data.

• Journal of the Korean Chemical Society
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• v.19 no.1
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• pp.43-49
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• 1975

Small amounts of iodine compound in mineral oils are usually effective in reducing friction of metallic surfaces. Such improvement in frictional behaviour of wear characteristics was explained by the formation of a diiodide layer lattice structure at the metallic contact surfaces. The lubrication mechanism, however, by which organoiodine compounds functions is not based on the formation of such lattice structure iodide. It was tested and shown, by a static surface chemical reactivity test, wear and EP tests, and a hot wire method, that compound such as N-iodopyridinium dichlorodate, a double charge transfer complex, reacted with metals as an interhalogen compound and that the resultant thin film product reduced appreciable the friction of metallic surfaces, more than compounds such as methyl iodide, diiodomethane, and iodoform. These results suggest that the action of iodine, included in organoiodine compounds, is not that of a classical layer structure iodide, and an entirely new mechanism may be derived from a further studies on charge transfer complex compounds of organoiodine compounds.

• Journal of the Korean Society of Propulsion Engineers
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• v.9 no.1
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• pp.9-16
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• 2005

Jet vane is an useful component which is installed at the end of a nozzle for the purpose of the posture control and the secure controlling stability during the initial launching of a rocket. During several seconds from its initial launching moment, the JV driving part is heated due to the direct contact of the vane with the combusted gas and the vane is ablated mechanically or chemically. In this study, as the fundamental study for the thermal analysis of jet vane, the heat transfer into a jet vane which is located in the uniform supersonic flow field is calculated. For this, boundary layer integral method and finite difference method are used simultaneously. Based on the thermal boundary conditions derived from the analysis, the transient heat conduction in the vane is also calculated.

• The Transactions of the Korean Institute of Power Electronics
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• v.21 no.2
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• pp.111-116
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• 2016

This paper proposes a high-frequency (MHz) LLC resonant converter for a capacitor coupling wireless power transfer (CCWPT). The CCWPT uses electric field in the coupling capacitor between the transmitter and receiver electrodes with a dielectric layer. Given that capacitance is very small and the impedance is large, transferring power with a simple series resonance is difficult. Therefore, the high frequency (MHz) and high Q factor LLC converter is proposed to reduce the impedance of the coupling capacitance and to obtain a high output voltage. This paper deals with the operation analysis of the proposed LLC converter and a theoretical capacitance estimation. The operation and features of the proposed CCWPT LLC converter is verified with a 4.2 W prototype for charging mobile devices.

• Journal of Communications and Networks
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• v.12 no.3
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• pp.275-284
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• 2010

The current multihome-aware protocols (like stream control transmission protocol (SCTP) or parallel TCP for concurrent multipath data transfer (CMT) are not designed for high-capacity and large-latency networks; they often have performance problems transferring large data files over shared long-distance wide area networks. It has been shown that SCTP-CMT is more sensitive to receive buffer (rbuf) constraints, and this rbuf-blocking problem causes considerable throughput loss when multiple paths are used simultaneously. In this research paper, we demonstrate the weakness of SCTP-CMT rbuf constraints, and we then identify that rbuf-blocking problem in SCTP multihoming is mostly due to its loss-based nature for detecting network congestion. We present a simulation-based performance comparison of FAST TCP versus SCTP in high-speed networks for solving a number of throughput issues. This work proposes an end-to-end transport layer protocol (i.e., FAST TCP multihoming as a reliable, delaybased, multihome-aware, and selective ACK-based transport protocol), which can transfer data between a multihomed source and destination hosts through multiple paths simultaneously. Through extensive ns-2 simulations, we show that FAST TCP multihoming achieves the desired goals under a variety of network conditions. The experimental results and survey presented in this research also provide an insight on design decisions for the future high-speed multihomed transport layer protocols.