• Journal of Surface Science and Engineering
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• v.34 no.2
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• pp.151-160
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• 2001

The composition and the microstructure of the lead-tin alloy electrodeposited in a gluconate bath were invesitigated according to electrolysis conditions. The tin content of the lead-tin alloy electrodeposits increased with increasing current density and EDTA addition, while it decreased with increasing temperature and sodium gluconate concentration. The preferred orientation of the alloy deposits changed from the (220) plane through (200) to (200) + (111) planes with increasing cathode overpotential. The surface morphology of the films was closely related to both the preferred orientation and the alloy composition.

• Journal of Powder Materials
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• v.10 no.3
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• pp.157-160
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• 2003

Phase contents and elemental composition of ultradispersed powders obtained by the electrical explosion of tin-leadalloy powders are investigated. It is demonstrated that during the explosion and subsequent cooling, surface layers of powder particles are enriched in lead compared to the initial alloy. The thermal stability of powders oxidizing in air is also investigated.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.107-107
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• 2003

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.549-554
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• 2003

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.93-99
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• 2004

At present, LG Electronics pushes ahead to eliminate the Pb(Lead) -a hazardous material- from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C-+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• Bulletin of the Korean Chemical Society
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• v.25 no.6
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• pp.913-916
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• 2004

• Journal of Surface Science and Engineering
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• v.24 no.2
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• pp.88-95
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• 1991

The tin-lead alloy was electrodeposited in the low range of peak current density in order to investigate the change of composition and microstructure of them. The Pb content of alloy deposits, which was decreased with increasing average current density, was relatively lower than that of D.C. plated alloy deposit. The preferred orientation of alloy deposit was changed with increasing peak current density and the surface morphology of alloy deposits was closely related to the preferred orientation of them.

• 보존과학연구
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• s.32
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• pp.155-170
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• 2011

This study intended to identify the ratio of alloy, metallographic examination and hardness on the bronze mirrors excavated in Korea and made the distribution chart of the main components according to each artifact and then tried to compare the ratio of artifacts with that of 鑑燧之齊of Zhouli Kaogongji(周禮, 考工記). Through this research, the components distribution of bronze covered a wide rage but it can be divided into 2~3 groups. When it is categorized into 3 groups, one is the bronze mirror with 70-80% of copper, 15-20% of tin and less than 5% of lead. Another is the bronze mirror with 20%-30% of tin which gives the white luster on metal and the high hardness. The other is the bronze mirror with 60-70% of copper and 15-20% of tin but it has more than 10-15% of lead which causes less luster and the low hardness. It contains less tin than 33%(50%) of tin from 鑑燧之齊 according to the old record Zhouli Kaogongji(周禮, 考工記) of Zhou Dynasty. In Korea the bronze mirror with tin of 鑑燧之齊was never found yet except the case of artifacts analyzed by non-destructive analysis.

• Journal of Conservation Science
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• v.37 no.4
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• pp.340-356
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• 2021

We have tried the experimental research of lost-wax casting to reconstruct Gilt-Bronze Pensive Bodhisattva; preliminary and reconstruction experiment based on ancient texts. Main object to reconstruct is Korean National Treasure No.83, Gilt-Bronze Pensive Bodhisattva (Maitreya), then we measure alloy ratio and casting method based on the scientific analysis. Other impurities were removed from the base metal components(copper : tin : lead) and their ratio was set to 95.5 : 6.5 : 3 where the ratios for tin and lead were increased by 2.5% each. The piece-mold casting method was used, and piece-mold casting experiments were carried out twice in this study but supplementary research on piece-mold casting was necessary. The microstructure was confirmed to be typical cast microstructure and the component analysis result was similar to that of the prior study. Analysis of the chemical composition is confirmed to copper, tin, lead, and zinc, and the chemical composition of the matrix was 87.8%Cu-7.5%Sn-2.7%Pb-2.1%Zn, and similar to previous experimental research. Also resulted in the detection of small impurity in Zn. Analysis of the mould revealed that the mould was fabricated by adding quartz and organic matter for structural stability, fire resistance, and air permeability. We expect that our research will contribute to provide base data for advanced researches in future.