Composition and microstructure of Pb-Sn alloy electrodeposits in pulse plating with low peak current density

낮은 최고전류밀도 조건에서 파형전류전해에 의한 Pb-Sn합금 전착층의 조성 및 조작특성

The tin-lead alloy was electrodeposited in the low range of peak current density in order to investigate the change of composition and microstructure of them. The Pb content of alloy deposits, which was decreased with increasing average current density, was relatively lower than that of D.C. plated alloy deposit. The preferred orientation of alloy deposit was changed with increasing peak current density and the surface morphology of alloy deposits was closely related to the preferred orientation of them.