• 한국표면공학회지
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• 제34권2호
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• pp.151-160
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• 2001

The composition and the microstructure of the lead-tin alloy electrodeposited in a gluconate bath were invesitigated according to electrolysis conditions. The tin content of the lead-tin alloy electrodeposits increased with increasing current density and EDTA addition, while it decreased with increasing temperature and sodium gluconate concentration. The preferred orientation of the alloy deposits changed from the (220) plane through (200) to (200) + (111) planes with increasing cathode overpotential. The surface morphology of the films was closely related to both the preferred orientation and the alloy composition.

• 한국분말재료학회지
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• 제10권3호
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• pp.157-160
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• 2003

Phase contents and elemental composition of ultradispersed powders obtained by the electrical explosion of tin-leadalloy powders are investigated. It is demonstrated that during the explosion and subsequent cooling, surface layers of powder particles are enriched in lead compared to the initial alloy. The thermal stability of powders oxidizing in air is also investigated.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2003년도 추계학술발표회초록집
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• pp.107-107
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• 2003

• 한국전기전자재료학회논문지
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• 제16권6호
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• pp.549-554
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• 2003

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.93-99
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• 2004

At present, LG Electronics pushes ahead to eliminate the Pb(Lead) -a hazardous material- from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C-+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• Bulletin of the Korean Chemical Society
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• 제25권6호
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• pp.913-916
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• 2004

• 한국표면공학회지
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• 제24권2호
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• pp.88-95
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• 1991

The tin-lead alloy was electrodeposited in the low range of peak current density in order to investigate the change of composition and microstructure of them. The Pb content of alloy deposits, which was decreased with increasing average current density, was relatively lower than that of D.C. plated alloy deposit. The preferred orientation of alloy deposit was changed with increasing peak current density and the surface morphology of alloy deposits was closely related to the preferred orientation of them.

• 보존과학연구
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• 통권32호
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• pp.155-170
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• 2011

본 고에서는 우리나라에서 발굴된 청동거울에 대해 합금비율과 금속조직 및 경도를 살펴보고, 각 유물별 주성분 분포를 그려본 후, 주례고공기 "周禮" "考工記" 중 감수지제(鑑燧之齊)의 조성비와 비교하고자 하였다. 연구 결과 청동거울은 비록 넓은 범위이지만 크게 두-세 그룹으로 나뉘는 것을 볼 수 있었다. 구리 70-80%에 15-20%의 주석을 함유하고 납은 5% 미만 들어있는 청동거울과, 주석의 함량이 20%-30%로 매우 많아 경도가 높고 금속의 흰색 광택이 좋은 청동거울, 구리 60-70%에 15-20%의 주석을 함유하고 있지만 납이 10-15% 이상 들어있는, 경도가 낮고 광택이 좋지 않은 청동거울로 나뉘어 진다. 중국 주시대의 고문헌 "주례(周禮)" "고공기(考工記)"중 감수지제(鑑燧之齊)의 주석 33%(50%) 보다는 적은 양의 주석을 함유하고 있었다. 아직까지 우리나라에서는 비파괴분석으로 분석된 유물을 제외한다면 감수지제(鑑燧之齊)의 주석이 함유된 청동거울은 발견되지 않았다.

• 보존과학회지
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• 제37권4호
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• pp.340-356
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• 2021

We have tried the experimental research of lost-wax casting to reconstruct Gilt-Bronze Pensive Bodhisattva; preliminary and reconstruction experiment based on ancient texts. Main object to reconstruct is Korean National Treasure No.83, Gilt-Bronze Pensive Bodhisattva (Maitreya), then we measure alloy ratio and casting method based on the scientific analysis. Other impurities were removed from the base metal components(copper : tin : lead) and their ratio was set to 95.5 : 6.5 : 3 where the ratios for tin and lead were increased by 2.5% each. The piece-mold casting method was used, and piece-mold casting experiments were carried out twice in this study but supplementary research on piece-mold casting was necessary. The microstructure was confirmed to be typical cast microstructure and the component analysis result was similar to that of the prior study. Analysis of the chemical composition is confirmed to copper, tin, lead, and zinc, and the chemical composition of the matrix was 87.8%Cu-7.5%Sn-2.7%Pb-2.1%Zn, and similar to previous experimental research. Also resulted in the detection of small impurity in Zn. Analysis of the mould revealed that the mould was fabricated by adding quartz and organic matter for structural stability, fire resistance, and air permeability. We expect that our research will contribute to provide base data for advanced researches in future.