• Korean Journal of Materials Research
• /
• v.2 no.6
• /
• pp.436-442
• /
• 1992

When $N_2$was used as shielding gas during the formation of Ti surface-alloyed layer by irradiation of $CO_2$laser beam on steel, TiN and F$e_2$Ti were formed regardness of carbon-content in steel. When Ti content was increased in low carbon-content steel, formation of martensitic structure was suppressed due to increase of critical cooling rate for martensitic transformation. In case of high-carbon steel, even though Ti content was about 1.5% in alloyed layer, hardness was increased by formation of martensitic structure instead of ferrite. In addition to that structure, hardness was incrreased further by precipitation of TiC in Ti alloyed-layer of high carbon-steel.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.33 no.5
• /
• pp.373-379
• /
• 2020

In this study, TiN-coated cBN (cubic-structure boron nitride) powders were successfully synthesized by a sol-gel method using titanium (IV) isopropoxide (TTIP) and by controlling the heat treatment conditions. After the sol-gel process, amorphous nano-sized TiO_x was uniformly coated on the surface of cBN powder particles. The obtained TiO_x-coated cBN powders were heated at 1,000~1,300℃ for 1 or 6 h in a flow of 95%N₂-5%H₂ mixed gas. With increasing temperature, the chemical composition of the TiO_x coating layer changed in the order of TiO₂→Ti₆O₁₁→Ti₄O₇→TiN due to reduction of the Ti ions. The TiN coating layer was observable in the samples heated at 1,200℃ and appeared as the main phase in the sample heated at 1,300℃. The resulting thickness of the TiN coating layer of the sample heated at 1,300℃ was approximately 45~50 nm.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2003.05a
• /
• pp.99-104
• /
• 2003

TiN coated films show a good mechanical properties, high thermal properties and wear, erosion and corrosion resistance and are widely used as a coating materials in tools, ornaments, parts and semiconductors. In spite of these good properties, the fracture of TiN coated films occur during use. The fracture of TiN thin films is related to their microstructure. Especially, the life of TiN coated layer is related to the texture of the TiN films. One researcher suggested that the corrosion and erosion resistance of the TiN thin films is related to a uniform and dense structure of films. In this study, we studied the relationships between textures and friction coefficient, erosion and corrosion in TiN coated films. The flatness of (115) texture surface of TiN thin films is flatter than that of (111) texture surface. The friction coefficient of (115) texture surface of TiN thin films is similar with that of (111) texture surface. The wear resistance of (115) texture surface of TiN thin films is better than that of (111) texture surface. The erosion and corrosion resistance of (115) texture surface of TiN thin films is better than that of (111) torture surface. As well as texture, the wear, erosion and corrosion of TiN thin films has to consider defects such as pinholes, cracks, surface roughness and open columnar structure. The life of TiN coated products is influenced by the properties of wear, erosion, and corrosion resistance of TiN thin films and is related to texture of TiN coated films, density of pinholes and cracks, density of structure, and surface flatness.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.17 no.11
• /
• pp.1149-1155
• /
• 2004

In this paper, novel methods for improvement of thermal stability of Ni-germano Silicide were proposed for nano CMOS applications. It was shown that there happened agglomeration and abnormal oxidation in case of Ni-germano Silicide using Ni only structure. Therefore, 4 kinds of tri-layer structure, such as, Ti/Ni/TiN, Ni/Ti/TiN, Co/Ni/TiN and Ni/Co/TiN were proposed utilizing Co and Ti interlayer to improve thermal stability of Ni-germano Silicide. Ti/Ni/TiN structure showed the best improvement of thermal stability and suppression of abnormal oxidation although all kinds of structures showed improvement of sheet resistance. That is, Ti/Ni/TiN structure showed only 11 ohm/sq. in spite of 600 $^{\circ}C$, 30 min post silicidation annealing while Ni-only structure show 42 ohm/sq. Therefore, Ti/Ni/TiN structure is highly promising for nano-scale CMOS technology.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
• /
• 2002.05a
• /
• pp.310-316
• /
• 2002

In this study, the effects of oxide layer formed on the wear tracks of TiN coated silicon wafer on friction and wear characteristics were investigated. Silicon wafer was used for the substrate of coated disk specimens, which were prepared by depositing TiN coating with $1{\mu}m$ in coating thickness. AISI 52100 steel ball was used for the counterpart. The tests were performed both in air for forming oxide layer on the wear track and in nitrogen to avoid oxidation. This paper reports characterization of the oxide layer effects on friction and wear characteristics using X-ray diffraction (XRD). Auger electron spectroscopy (AES), scanning electron microscopy (SEM) and sliding tests.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
• /
• 2001.06a
• /
• pp.401-405
• /
• 2001

The effects of oxide layer formed on TiN coated ball and counter-body have been investigated from the frictional point of view during sliding tests. AISI52100 steel ball was used for the substrate of coated specimens. Two types of coated specimens were prepared by depositing TiN coating with 1 and 4$\mu\textrm{m}$ in coating thickness. AISI1045 steel was used for the disk type counter-body. To investigate the effect of oxide layer on the contact parts of two materials, the tests were performed both in ambient for forming oxide layer on the contact parts and in nitrogen environment to avoid oxidation.

• Korean Journal of Materials Research
• /
• v.12 no.8
• /
• pp.676-681
• /
• 2002

Microstructure, mechanical properties, and oxidation resistance of TiAIN thin films deposited on quenched and tempered STD61 tool steel by arc ion plating were studied using XRD, XPS and micro-balance. The TiAIN film was grown with the (200) orientation. The grain size of TiAIN thin film decreased with increasing Al contents, while chemical binding energy increased with Al contents. When hard coating films were oxidized at $850^{\circ}C$ in air, oxidation resistance of both TiN and TiCN films became relatively lower since the surface of films formed non-protective film such as $TiO_2$. However, oxidation resistance of TiAIN film was excellent because its surface formed protective layer such as $_A12$$O_3$ and $_Al2$$Ti_{7}$$O_{15}$, which suppressed oxygen intrusion.

• Journal of the Korean Vacuum Society
• /
• v.6 no.4
• /
• pp.314-320
• /
• 1997

A chemical reaction and electronic structure change at the interface between copper and titanium nitride were investigated by XPS. A thin Cu layer was deposited on a TiN substrate oxidized by exposure to air at room temperature. We observed the Ti(2p), O(1s), N(1s), Cu(2p) core-level, and Cu LMM Auger line spectra. With increasing of the thickness of Cu layer, these spectra do not show any changes in the line shape as well as in peak position. In addition, the valence band spectra in XPS do not show any changes, which indicates that Cu does not react with Ti, N, and O. This inreactivity of Cu might cause a poor adhesion between Cu and TiN.

• Journal of the Korean Society for Heat Treatment
• /
• v.12 no.3
• /
• pp.199-205
• /
• 1999

The quaternary Ti-Al-V-N films have been grown on glass substrates by reactive dc and rf magnetron sputter deposition from a Ti-6Al-4V target in mixed Ar-$N_2$ discharges. The Ti-Al-V-N films were investigated by means of X-ray diffraction(XRD), electron probe microanalysis(EPMA) and scratch tester. Both XRD and EPMA results indicated that the Ti-Al-V-N films were of single B1 NaCl phase having columnar structure with the (111) preferred orientation. Scratch tester results showed that the adhesion strength of Ti-Al-V-N films which treated with substrate heating and vacuum annealing was superior to that of as-deposited film. The good adhesion strength was also achieved in the double-layer structure of Ti-Al-V-N/Ti-Al-V/Glass.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.05c
• /
• pp.33-36
• /
• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina $(Al_2O_3)$ abrasive containing slurry with 5 % $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with 5 % $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.