• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.344-344
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• 2014

Transparent amorphous oxide semiconductors such as a In-Ga-Zn-O (a-IGZO) have advantages for large area electronic devices; e.g., uniform deposition at a large area, optical transparency, a smooth surface, and large electron mobility >10 cm2/Vs, which is more than an order of magnitude larger than that of hydrogen amorphous silicon (a-Si;H).1) Thin film transistors (TFTs) that employ amorphous oxide semiconductors such as ZnO, In-Ga-Zn-O, or Hf-In-Zn-O (HIZO) are currently subject of intensive study owing to their high potential for application in flat panel displays. The device fabrication process involves a series of thin film deposition and photolithographic patterning steps. In order to minimize contamination, the substrates usually undergo a cleaning procedure using deionized water, before and after the growth of thin films by sputtering methods. The devices structure were fabricated top-contact gate TFTs using the a-IGZO films on the plastic substrates. The channel width and length were 80 and 20 um, respectively. The source and drain electrode regions were defined by photolithography and wet etching process. The electrodes consisting of Ti(15 nm)/Al(120 nm)/Ti(15nm) trilayers were deposited by direct current sputtering. The 30 nm thickness active IGZO layer deposited by rf magnetron sputtering at room temperature. The deposition condition is as follows: a rf power 200 W, a pressure of 5 mtorr, 10% of oxygen [O2/(O2+Ar)=0.1], and room temperature. A 9-nm-thick Al2O3 layer was formed as a first, third gate insulator by ALD deposition. A 290-nm-thick SS6908 organic dielectrics formed as second gate insulator by spin-coating. The schematic structure of the IGZO TFT is top gate contact geometry device structure for typical TFTs fabricated in this study. Drain current (IDS) versus drain-source voltage (VDS) output characteristics curve of a IGZO TFTs fabricated using the 3-layer gate insulator on a plastic substrate and log(IDS)-gate voltage (VG) characteristics for typical IGZO TFTs. The TFTs device has a channel width (W) of $80{\mu}m$ and a channel length (L) of $20{\mu}m$. The IDS-VDS curves showed well-defined transistor characteristics with saturation effects at VG>-10 V and VDS>-20 V for the inkjet printing IGZO device. The carrier charge mobility was determined to be 15.18 cm^2 V-1s-1 with FET threshold voltage of -3 V and on/off current ratio 10^9.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.71-71
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• 2000

본 연구에서는 차세대 마이크로파 유전체 소자로서의 응용을 목적으로 펄스 레이저 방식에 의하여 증착된 MgTiO3 박막의 전기적 특성을 종합적으로 연구 분석하였다. 이를 바탕으로 MgTiO3 박막의 유전손실 등과 같은 열화를 야기시키는 박막 내부 또는 박막과 기판간의 결함의 특성을 파악하여 열화 메카니즘을 분석하였다. MgTiO3는 마이크로파 영역에서의 우수한 유전특성과 같은 낮은 유전손실을 가지며, 온도 안정성 또한 우수하다. 현재까지 벌크 세라믹 MgTiO3 의 응용 광범위하게 연구되어 왔으나 박막의 제조공정 및 전기적 특성 분석은 미흡한 형편이다. 따라서 벌크 세라믹과는 특성이 상이한 박막의 전기적 특성분석 및 연구가 필요하다. 분석을 위한 소자의 기본 구조로서 Metal-Insulator-Semiconductor(MIS) 구조를 채택하였다. MgTiO3 박막을 증착하기 위한 기판으로는 n형 Si(100)기판과 p형 Si(100)기판을 사용하였고, Si 기판 위에 급속 열처리기 (RTP)를 이용하여 SiO2를 ~100 두께로 성장시킨 것과 성장시키지 않은 것으로 구분하여 제작하였다. MgTiO3 박막은 펄스 레이저 증착 방식(PLD)에 의하여 약 2500 두께로 증착되었으며, 200mTorr 압력의 산소 분위기 하에서 기판의 온도를 40$0^{\circ}C$~55$0^{\circ}C$까지 5$0^{\circ}C$간격으로 변화시키며 제작하였다. 상하부의 전극 금속으로는 Al을 이용하였으며, 열증발 증착기로 증착하였다. 증착된 MgTiO3 박막의 결정구조를 확인하기 위하여 XRD 분석을 수행하였으며, 박막의 전기적 특성을 분석하기 위해 Boonton7200 C-V 측정기와 HP4140P를 이용한 경우에는 C-V 곡선에 이력현상이 나타났으나, MgTiO3/SiO2를 이용한 경우에는 이력현상이 나타나지 않았고, 유전율은 감소하는 것으로 나타났다. I-V 측정 결과, 절연층으로 MgTiO3/SiO2를 이용한 경우에는 MgTiO3만을 절연층으로 사용한 경우에 비해 동일한 전계에서 낮은 누설전류 값을 가짐을 알 수 있었다. 또한 박막의 증착온도가 증가함에 따라서 C-V 곡선의 위치가 양의 방향으로 이동함을 확인하였다. 위의 현상은 기판의 종류에 관계없이 발생하는 것으로 보아 벌크 또는 계면에 존재하는 결함에 의한 것으로 추정된다. 현재 C-V 곡선의 이동 원인과 I-V 곡선의 누설전류 메카니즘을 분석 중에 있으며 그 결과를 학회에서 발표할 예정이다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1990년도 하계학술대회 논문집
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• pp.462-464
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• 1990

We report the development of a surface discharge preionized KrF discharge Laser with a new type of high-brightness Corona preionizer using a segmented columnar $BaTiO_3$ dielectric. This Laser characteristic was higher value than that obtained with the conventional corona preionizer using a glass, $Al_2O_3ceramic$, Kapton film, or a Teflon insulator.

• 한국결정성장학회지
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• 제11권1호
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• pp.38-42
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• 2001

Electric and dielectric(Ba,Sr)$TiO_3$[BST] thin films for emtal-Insulator-Semiconductor(MIS) capacitors have been studied. BST thin films wre deposted on p-Si(100) substrates bythe RF magnetron sputtering with tempratue range of 500~$600^{\circ}C$. The dielectric properties of MIS capacitors consisting of Al/BST/$SiO_2$/Si sandwich structure were evaluated ot redcue the leakage current density. The charge state densities of the MIS capacitors were determined by high frequency (1 MHz) C-V measurement. In order to reduce the leakage current in MIS capacitor, high quality $SiO_2$ layer was deposited on bare p-Si substrate. Depending on the oxygen pressure and substrate temperature both positive and negative polarities of effective oxide charge in the MIS capacitors were evaluated. It is considered that the density of electronic states, generated at the BST/$SiO_2$/p-Si interface due to the asymmetric structure within BST/$SiO_2$/Si structure, and the oxygen vacancy content has influence on the behavior of oxide charge.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.168-168
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• 2008

Dimension of a transistor has rapidly shrunk to increase the speed of device and to reduce the power consumption. However, it is accompanied with several problems like direct tunneling through the gate dioxide layer and low conductivity characteristic of poly-Si gate in nano-region. To cover these faults, study of new materials is urgently needed. Recently, high dielectric materials like $Al_2O_3$, $ZrO_2$, and $HfO_2$ are being studied for equivalent oxide thickness (EOT). However, poly-Si gate is not compatible with high-k materials for gate-insulator. Poly Si gate with high-k material has some problems such as gate depletion and dopant penetration problems. Therefore, new gate structure or materials that are compatible with high-k materials are also needed. TiN for metal/high-k gate stack is conductive enough to allow a good electrical connection and compatible with high-k materials. According to this trend, the study on dry etching of TiN for metal/high-k gate stack is needed. In this study, the investigations of the TiN etching characteristics were carried out using the inductively coupled $BCl_3$-based plasma system and adding $Cl_2$ gas. Dry etching of the TiN was studied by varying the etching parameters including $BCl_3$/Ar gas mixing ratio, RF power, DC-bias voltage to substrate, and $Cl_2$ gas addition. The plasmas were characterized by optical emission spectroscopy analysis. Scanning electron microscopy was used to investigate the etching profile.

• Applied Science and Convergence Technology
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• 제23권6호
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• pp.317-327
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• 2014

In order to develop nano-devices with much lower power consumption for beyond-CMOS applications, the fundamental understanding and precise control of the electronic properties of ultrathin transition metal oxide (TMO) films are strongly required. The metal-insulator transition (MIT) is not only an important issue in solid state physics, but also a useful phenomenon for device applications like switching or memory devices. For potential use in such application, the electronic structures of MIT, observed for TMO nano-structures, have been investigated using a synchrotron radiation angle-resolved photoelectron spectroscopy system combined with a laser molecular beam epitaxy chamber and a scanning photoelectron microscopy system with 70 nm spatial resolution. In this review article, electronic structures revealed by soft X-ray nano-spectroscopy are presented for i) polarity-dependent MIT and thickness-dependent MIT of TMO ultrathin films of $LaAlO_3/SrTiO_3$ and $SrVO_3/SrTiO_3$, respectively, and ii) electric field-induced MIT of TMO nano-structures showing resistance switching behaviors due to interfacial redox reactions and/or filamentary path formation. These electronic structures have been successfully correlated with the electrical properties of nano-structured films and nano-devices.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.104-104
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• 2009

Critical dimensions has rapidly shrunk to increase the degree of integration and to reduce the power consumption. However, it is accompanied with several problems like direct tunneling through the gate insulator layer and the low conductivity characteristic of poly-silicon. To cover these faults, the study of new materials is urgently needed. Recently, high dielectric materials like $Al_2O_3$, $ZrO_2$ and $HfO_2$ are being studied for equivalent oxide thickness (EOT). However, poly-silicon gate is not compatible with high-k materials for gate-insulator. To integrate high-k gate dielectric materials in nano-scale devices, metal gate electrodes are expected to be used in the future. Currently, metal gate electrode materials like TiN, TaN, and WN are being widely studied for next-generation nano-scale devices. The TaN gate electrode for metal/high-k gate stack is compatible with high-k materials. According to this trend, the study about dry etching technology of the TaN film is needed. In this study, we investigated the etch mechanism of the TaN thin film in an inductively coupled plasma (ICP) system with $O_2/BCl_3/Ar$ gas chemistry. The etch rates and selectivities of TaN thin films were investigated in terms of the gas mixing ratio, the RF power, the DC-bias voltage, and the process pressure. The characteristics of the plasma were estimated using optical emission spectroscopy (OES). The surface reactions after etching were investigated using X-ray photoelectron spectroscopy (XPS) and auger electron spectroscopy (AES).

• 한국진공학회지
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• 제11권3호
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• pp.183-188
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• 2002

지금까지 주로 사용해 오던 TMA(trimethylaluminum, AI$(CH_3)_3)$와 $H_2O$를 사용하여 ALD(Atomic Layer Deposition)법으로 증착시킨 AI$(CH_3)_3)$막내의 $OH^{-}$기는 AI$(CH_3)_3)$의 우수한 물성을 악화시키는 불순물 역할을 하므로, 이를 개선하기 위하여 본 연구에서는 TMA와 오존(ozone, $O_3$)을 이용하여 AI$(CH_3)_3)$막을 증착한 후, 산화제 소스로 $H_2O$와 $O_3$을 각각 사용했을 때 그것들이 AI$(CH_3)_3)$막의 유전적 특성에 끼치는 효과에 관하여 비교 조사하였다. XPS 분석결과 $O_3$를 사용한 AI$(CH_3)_3)$막은 $H_2O$를 사용할 때와는 다르게 $OH^{-}$기가 감소됨을 관찰할 수 있었다. 화학적 안정성(chemical inertness)의 척도가 되는 wet 에칭율 또한 $O_3$를 사용한 AI$(CH_3)_3)$막의 경우가 더욱 우수하게 나타났다. TiN을 상부전극으로 한 MIS (metal-insulator-silicon) capacitor 구조로 제작된 AI$(CH_3)_3)$막의 경우 $H_2O$를 사용한 경우 보다 $O_3$를 사용한 경우에 누설전류밀도가 더 낮았고, 절연특성이 더 우수하였으며, $H_2O$보다 $O_3$를 사용했을 때 C-V 전기적이력(hystersis) 곡선의 편차(deviation)가 감소하는 것으로 보아 전기적 특성이 더 향상되었음을 알 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.92-92
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• 2014

Recently, many state-of-art spectroscopy techniques are used to unravel the mysteries of condensed matters. And numerous heterostructures have provided a new avenue to search for new emergent phenomena. Especially, near the interface, various forms of symmetry-breaking can appear, which induces many novel phenomena. Although these intriguing phenomena can be emerged at the interface, by using conventional measurement techniques, the experimental investigations have been limited due to the buried nature of interface. One of the ways to overcome this limitation is in situ investigation of the layer-by-layer evolution of the electronic structure with increasing of the thickness. Namely, with very thin layer, we can measure the electronic structure strongly affected by the interface effect, but with thick layer, the bulk property becomes strong. Angle-resolved photoemission spectroscopy (ARPES) is powerful tool to directly obtain electronic structure, and it is very surface sensitive. Thus, the layer-by-layer evolution of the electronic structure in oxide heterostructure can be investigated by using in situ ARPES. LaNiO3 (LNO) heterostructures have recently attracted much attention due to theoretical predictions for many intriguing quantum phenomena. The theories suggest that, by tuning external parameters such as misfit strain and dimensionality in LNO heterostructure, the latent orders, which is absent in bulk, including charge disproportionation, spin-density-wave order and Mott insulator, could be emerged in LNO heterostructure. Here, we performed in situ ARPES studies on LNO films with varying the misfit strain and thickness. (1) By using LaAlO3 (-1.3%), NdGaO3 (+0.3%), and SrTiO3 (+1.7%) substrates, we could obtain LNO films under compressive strain, nearly strain-free, and tensile strain, respectively. As strain state changes from compressive to tensile, the Ni eg bands are rearranged and cross the Fermi level, which induces a change of Fermi surface (FS) topology. Additionally, two different FS superstructures are observed depending on strain states, which are attributed to signatures of latent charge and spin orderings in LNO films. (2) We also deposited LNO ultrathin films under tensile strain with thickness between 1 and 10 unit-cells. We found that the Fermi surface nesting effect becomes strong in two-dimensions and significantly enhances spin-density-wave order. The further details are discussed more in presentation. This work was collaborated with Hyang Keun Yoo, Seung Ill Hyun, Eli Rotenberg, Ji Hoon Shim, Young Jun Chang and Hyeong-Do Kim.