• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.658-659
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• 2006

Magnetron sputtered TiN, (Ti, Al)N and TiN/(Ti, Al)N multilayer coatings grown on cemented carbide substrates have been characterized by using electron probe microanalysis (EPMA), X-ray diffraction (XRD), scanning electron spectroscopy (SEM), nanoindentation, scratcher and cutting tests. Results show that TiN coating is bell mouth columnar structures, (Ti, Al)N coating is straight columnar structures and the modulation structure has been formed in the TiN/(Ti, Al)N multilayer coating. TiN/(Ti, Al)N multilayer coating exhibited higher hardness, better adhesion with substrate and excellent cutting performance compared with TiN and (Ti, Al)N coating.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.396-396
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• 2012

산업 분야에서 TiN, CrN, CrAl-N, TiAl-N과 같은 Hard 코팅들은 기계적 특성이 우수하여 절삭 공구, 기계 부품분야에서 많이 사용되고 있다. 최근 연구 동향을 살펴보면 기존에 하나 또는 두가지 합금상태의 Hard 코팅을 넘어서 제3원소, 제4원소를 첨가하여 미세 구조적 변화를 통해 기존의 우수한 특성에 고온안정성, 내식성, 내산화성 등 다양한 기능성을 부여하는 다기능성 연구가 활발히 진행 중이다. 본 연구에서는 마그네트론 스퍼터를 이용하여 고경도 코팅인 Ti-Al계열에 Si, Cu, Cr, B을 첨가함에 따른 내식특성을 확인해보았다. 성분이 균일한 코팅을 만들기 위해 Ti-Al, Ti-Al-Si, Ti-Al-Cu, Ti-Al-Cr, Ti-Al-B 단일합금타겟을 제조하여 실험을 진행하였다. 기본 물성을 확인하기 위해 경도 측정과 SEM XRD 등을 분석하였다. 내식성 평가는 동전위 테스트와 염수분무 테스트를 진행하였고 전해질은 염수와 동일한 5%-NaCl로 진행하였다. 그 결과 Ti-Al-Cr이 내식성에 강한 것으로 나타났고 염수분무 실험에서도 1200시간 이상 지속되는 성과를 보였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.162-162
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• 2015

증착 조건이 AlTiN 박막의 특성에 미치는 영향에 대하여 평가하였다. 한편, 공정변수의 하나로 빗각 증착을 적용하여 AlTiN 박막을 제조하고 그 특성을 평가하였다. Al-25at.%Ti 합금타겟을 음극 아크 소스에 장착하여 AlTiN 박막을 코팅하였다. 기판은 stainless steel(SUS304)과 초경(tungsten carbide; WC)을 사용하였다. 음극 아크 소스에 인가되는 전류가 낮을수록 AlTiN 박막 표면에 존재하는 거대입자의 밀도가 낮아졌으며, 공정 압력과 기판 전압이 높을수록 AlTiN 박막의 표면에 존재하는 거대입자의 밀도가 낮아지는 경향을 보였다. 코팅 공정 중 질소 유량을 변화했지만 AlTiN 박막의 특성에 변화는 없었다. AlTiN 박막 증착 시 빗각을 적용한 결과, $60^{\circ}$의 빗각을 적용한 다층 박막에서 약 33 GPa의 경도를 보였다. AlTiN 박막의 내산화성을 평가한 결과, $600^{\circ}C$이상에서 안정된 내산화성을 확인할 수 있었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.67-67
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• 2015

음극 아크 플라즈마 공정을 이용하여 증착된 AlTiN 코팅막의 공정 변화에 따른 물리적 특성 변화를 평가하였다. 또한 빗각 증착을 적용하여 제조한 AlTiN 코팅막의 특성을 평가하였다. Al-25at.%Ti 합금타겟을 음극 아크 소스에 장착하여 AlTiN 박막을 코팅하였다. 기판은 stainless steel(SUS304)과 초경(tungsten carbide; WC)을 사용하였다. 음극 아크 소스에 인가되는 전류가 낮을수록 AlTiN 코팅막 표면에 존재하는 거대입자의 밀도가 낮아졌으며, 공정 압력과 기판 전압이 높을수록 AlTiN 코팅막의 표면에 존재하는 거대입자의 밀도가 낮아지는 경향을 보였다. 코팅 공정 중 질소 유량을 변화했지만 AlTiN 코팅막의 특성은 변하지 았았다. AlTiN 코팅막 증착 시 빗각을 적용한 결과, $60^{\circ}$의 빗각을 적용한 다층 코팅막에서 약 33 GPa의 경도를 보였다. AlTiN 코팅막의 내산화성을 평가한 결과, $600^{\circ}C$이상에서 안정된 내산화성을 확인할 수 있었다.

• Journal of the Korean institute of surface engineering
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• v.34 no.2
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• pp.135-141
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• 2001

Arc-melted Ti-6Al-4V, Ti-4Fe and Ti-(1,2) Si alloys were oxidized at 700, 800, 900 and $1000^{\circ}C$ in air. The oxidation resistance of Ti-4Fe was comparable to that of Ti-6Al-4V, while the oxidation resistance of Ti-(1,2) Si was superior to that of Ti-6Al-4V. Ti-2Si displayed the best oxidation resistance among the four alloys, but failed after oxidation at $1000^{\circ}C$ for 17h. The oxide scale formed on Ti-6Al-4V, Ti-4Fe and Ti-(1,2)Si consisted of ($TiO_2$ and a small amount of $Al_2$$O_3$), ($TiO_2$ and a small amount of dissolved iron), and ($TiO_2$ plus a small concentration of amorphous $SiO_2$), respectively. The oxide grains of the surface scale of the four alloys were generally fine and round.

• Journal of the Korean Ceramic Society
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• v.38 no.5
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• pp.412-417
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• 2001

본 연구는 습식법으로 수산화 알루미늄과 티타니아를 출발물질로 하여 $Al_2$O$_3$-TiO$_2$복합분체를 제조하였으며, 2 mol의 Al(OH)$_3$분말에 대하여 TiO$_2$분말량을 1, 3, 5, 7, 9, 11 wt%로 첨가하여 $Al_2$O$_3$-TiO$_2$복합분체의 특성을 조사하였다. 제조된 $Al_2$O$_3$-TiO$_2$계 복합분체는 $700^{\circ}C$~140$0^{\circ}C$까지 하소하여 XRD 분석을 한 결과 100$0^{\circ}C$까지는 TiO$_2$(rutile)상과 η-Al$_2$O$_3$상이 공존하다가 110$0^{\circ}C$부터 130$0^{\circ}C$까지는 η-Al$_2$O$_3$에서 $\alpha$-Al$_2$O$_3$로의 상전이가 일어나서 $\alpha$-Al$_2$O$_3$상과 TiO$_2$(rutile)상이 나타났으며 하소온도 140$0^{\circ}C$, TiO$_2$첨가량이 5 wt%일 때부터 $Al_2$TiO$_{5}$가 생성되기 시작하였다. TiO$_2$첨가량에 따른 비표면적값은 첨가량이 7 wt%까지는 감소하였으나 그 이상 첨가시 증가하였다. 입도분석 결과 평균입경은 15.74~23.21$mu extrm{m}$로서 TiO$_2$첨가량이 3 wt%일 때 가장 작은 값을 가졌으며 TiO$_2$첨가량은 5 wt% 이상부터 점차 감소하였다.

• Journal of Korea Foundry Society
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• v.22 no.2
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• pp.75-81
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• 2002

The main objectives were to investigate the suitability of CaO crucible for melting TiAl alloys and to develop investment mold for investment casting of TiAl alloys. TiAl alloy specimen were prepared by plasma arc furnace under argon atmosphere. After melting of TiAl alloy using CaO crucible, the results showed that there is little contamination of oxygen in the TiAl bulk. Conventional vacuum induction furnaces can be readily adaptable to produce cast parts of TiAl without high skilled techniques. The determination of optical metallography and microhardness profiles in investment cast TiAl alloy rods has allowed the gradation of the relative thermal stability of the oxides examined. The molds used for the present study were $ZrO_2$, $Al_2O_3$, CaO stabilized $ZrO_2$ and $ZrSiO_4$. Even although high temperature of mold preheating, $Al_2O_3$ mold is a promising mold material for investment casting of TiAl alloys in terms of thermal stability, cost and handling strength. It is important to take thermal stability and preheating temperature of mold into consideration for investment casting of TiAl alloys.

• Korean Journal of Materials Research
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• v.31 no.2
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• pp.97-100
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• 2021

We report the effect of Standard Clean-1 (SC-1) cleaning to remove residual Ti layers after silicidation to prevent Al diffusion into Si wafer for Ti Schottky barrier diodes (Ti-SBD). Regardless of SC-1 cleaning, the presence of oxygen atoms is confirmed by Auger electron spectroscopy (AES) depth profile analysis between Al and Ti-silicide layers. Al atoms at the interface of Ti-silicide and Si wafer are detected, when the SC-1 cleaning is not conducted after rapid thermal annealing. On the other hand, Al atoms are not found at the interface of Ti-SBD after executing SC-1 cleaning. Al diffusion into the interface between Ti-silicide and Si wafer may be caused by thermal stress at the Ti-silicide layer. The difference of the thermal expansion coefficients of Ti and Ti-silicide gives rise to thermal stress at the interface during the Al layer deposition and sintering processes. Although a longer sintering time is conducted for Ti-SBD, the Al atoms do not diffuse into the surface of the Si wafer. Therefore, the removal of the Ti layer by the SC-1 cleaning can prevent Al diffusion for Ti-SBD.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.37-42
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• 2000

The comparative study of texture of Al/Ti thin films deposited on low-dielectric polymer and $SiO_2$substrates has been investigated. Fifty-nm-thick Ti films and 500-nm-thick Al-1%Si-0.5%Cu (wt%) films were deposited sequentially onto low-k polymers and $SiO_2$by using a DC magnetron sputtering system. The texture of Al thin film was determined using X-ray diffraction (XRD) theta-2theta ($\theta$-2$\theta$) and rocking curve and the microstructure of Al/Ti films on low-k polymer and $SiO_2$substrates was characterized by cross-sectional transmission electron microscopy (TEM). Both the $\theta$-2$\theta$ method and rocking curve measurement suggest that Al/Ti thin films deposited on $SiO_2$have stronger texture than those deposited on low-k polymer. The texture of Al thin films strongly depended on that of Ti films. Cross-sectional TEM revealed that grains of Ti films on $SiO_2$substrates had grown perpendicular to the substrate, while the grains of Ti alms on SiLK substrates were formed randomly. The lower degree of (111) texture of Al thin films on low-k polymer was due to Ti underlayer.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.7 no.2
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• pp.224-234
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• 1997

In order to make high purity materials including low contents of interstitial impurities, 70 ㎾ electron beam melter was manufactured. The sponge Ti and Ti-6Al-4V alloy were required and melted by electron beam melter. Based on the experimental results of sponge Ti refining by electron beam melting, the purity of Ti was increased for 180 seconds but thereafter did not significantly vary. In addition, it was found that with number of melting, the purity of Ti did and vary but the yield of Ti was decreased. As a results of Ti refining, high purity Ti of 3N (99.9 wt%) could be obtained including interstitial impurities with total contents of which were maximum 900 ppm. From the experimental results of Ti-6Al-4V alloy electron beam melting, the amounts of Al loss could be estimated through thermodynamic data calculated from the regular solution model and the model of solute removal kinetics and the alloy composition calculated from the models was in accord with the experimental composition of the alloy, It took 10 minutes to make Ti-29Al-4V alloy calculated from the model into Ti-6Al-4V alloy and the composition of Ti-6Al-4V alloy was very homogeneous.