• 한국분말재료학회지
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• 제6권4호
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• pp.270-276
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• 1999

Ti-Ni-Cu alloy powders were fabricated by ball milling, and the properties of these powders were characterized. Mixed 50Ti-(50-x)Ni-xCu powders of 5 to 10at.%Cu composition were milled for 100 hours using SUS 1/4" balls in argon atmosphere. Ball to powder ratio was 20:1 and rotating speed was 100 rpm. Tensile strength, microstructure and phase transformation of ball milled Ti-(50-x)Ni-xCu powders were studied. After 100 hours milling, Ti, Ni and Cu elements were alloyed completely and an amorphous phase was formed. Amorphous phase was crystallized to martensite(B 19') and austenite(B2) after heat treatment for 1 hour at $850^{\circ}C$. As the Cu contents were increased, tensile strength of extruded 6061Al/TiNiCu was decreased, and B19'martensite phases In the TiNi particles were the causes of high tensile stress of extruded 6061Al/TiNiCu.NiCu.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1999년도 춘계학술대회 및 발표대회 강연 및 발표논문 초록집
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• pp.28-28
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• 1999

• 한국재료학회지
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• 제16권10호
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• pp.614-618
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• 2006

The thermal stability of Cu/Ti(or Ta)/NiSi contacts was investigated. Ti(Ta)-capping layers deposited to form NiSi was utilized as the Cu diffusion barrier. Ti(Ta)/NiSi contacts was thermally stable upto $600^{\circ}C$. However when Cu/Ti(Ta)/NiSi contacts were furnace-annealed at $300{\sim}400^{\circ}C$ for 40 min., the Cu diffusion was found to be effectively suppressed, but NiSi was dissociated and then Ni diffused into the Cu layer to form Cu-Ni solutions. On the other hand, the Ni diffusion did not occur for the Al/Ti/NiSi system. The thermal instability of Cu/Ti(Ta)/NiSi contacts was attributed to the high heat of solution of Ni in Cu.

• 마이크로전자및패키징학회지
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• 제30권2호
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• pp.60-64
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• 2023

본 연구에서는 그래핀 기반 소자의 성능에 영향을 미치는 그래핀과 금속 사이의 전기적 접촉저항 특성을 비교 분석하였다. 화학기상증착법을 이용하여 고품질의 그래핀을 합성하였으며, 전극 물질로 Al, Cu, Ni 및 Ti를 동일한 두께로 그래핀 표면 위에 증착하였다. TLM (transfer length method) 방법을 통해 SiO₂/Si 기판에 전사된 그래핀과 금속의 접촉저항을 측정한 결과, Al, Cu, Ni, Ti의 평균 접촉저항은 각각 345 Ω, 553 Ω, 110 Ω, 174 Ω으로 측정되었다. 그래핀과 물리적 흡착 특성을 갖는 Al와 Cu에 비해 화학적 결합을 형성하는 Ni과 Ti의 경우, 상대적으로 더 낮은 접촉저항을 갖는 것을 확인하였다. 본 연구의 그래핀과 금속의 전기적 특성에 대한 연구 결과는 전극과의 낮은 접촉저항 형성을 통해 고성능 그래핀 기반 전자, 광전자소자 및 센서 등의 구현에 기여할 수 있을 것으로 기대한다.

• 한국분말재료학회지
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• 제11권3호
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• pp.193-201
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• 2004

1960년 Au-Si계 합금에서 처음으로 비정질상이 급속 응고법에 의해 보고된 이래/sup 1)/ 지난 40년 간 많은 합금계에서 비정질상이 보고되어졌다. 대표적으로 Fe-, Ni-, Co기 합금 등 많은 합금계에서 비정질상이 보고되었으나, 비정질상의 형성을 위해서는 약 105 K/s이상의 높은 냉각속도를 필요로 하였다. 1980년대 수백 K/s의 낮은 냉각속도 하에서도 비정질상이 형성될 수 있는 다원계 합금(multi-component alloy)이 Mg-Ln-(Ni, Cu, Zn), Ln-Al-TM 합금에서 보고되어 졌으나 많은 관심을 받지 못하다가 1993년 Zr-Ti-Ni-Cu-Be 합금에서 수 ㎝ 크기의 비정질합금 제조가 보고되면서 전 세계적으로 많은 관심을 받게 되었다. Zr-Ti-Ni-Cu-Be계 벌크 비정질 합금이 보고된 후 Zr-(Nb,Pd)-Al-TM, Pd-Cu-Ni-P, Fe-Co-Zr-Mo-W-B, Ti-Zr-Ni-Cu-Sn등 여러 합금계에서 벌크 비정질 합금이 보고되었다. (중략)

• 한국재료학회지
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• 제11권3호
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• pp.171-177
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• 2001

급냉응고방식으로 제조한 비정질 Z $r_{62-x}$N $i_{10}$C $u_{20}$A $l_{8}$ $Ti_{x}$ (x=3, 6, 9at%) 합금을 사용하여 열적, 기계적 성질을 조사하였다. 시효온도에 따른 결정화 거동은 Ti 3at%에서는 비정질$\longrightarrow$비정질+Z $r_2$A $l_3$+Zr+(Ni,Ti)$\longrightarrow$Z $r_2$Cu+Al+(Ni,Ti)의 결정화 거동을 나타내었으며, Ti 6at%에서는 비정질$\longrightarrow$비정질+Al$\longrightarrow$A $l_2$Ti+NiZr+CuTi, Ti 9at%에서는 비정질$\longrightarrow$비정질+Zr+Al$\longrightarrow$Zr+A $l_2$Zr+Al $Ti_3$+CuTi의 결정화 거동을 보였다. 시효온도가 증가할수록 비정질 모상에 석출상의 체적율( $V_{f}$ )이 증가하고 그에 따라 비커스 경도 ( $H_{v}$ )간이 증가하였다. 파괴인장강도($\sigma_{f}$ )는 $V_{f}$ 의 증가에 따라 증가하다가 Z $r_{59}$A $l_{10}$N $i_{20}$C $u_{8}$ $Ti_3$은 $V_{f}$ =38%에서 1219MPa의 최대값을 보이고, Z $r_{56}$A $l_{10}$N $i_{20}$C $u_{8}$ $Ti_{6}$은 $V_{f}$ =2%에서 1203MPa의 최대값을 보이고, Z $r_{53}$A $l_{10}$N $i_{20}$C $u_{8}$ $Ti_{9}$ $V_{f}$ =5%에서 1350MPa의 최대값을 나타낸 후 그 이상의 $V_{f}$ 에서는 급격히 감소하였다. $\sigma_{f}$ 가 급격히 감소하는 $V_{f}$ 와 연성 파면에서 취성파면으로 천이되는 $V_{f}$ 가 일치하였다.f/가 일치하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.99-102
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• 2003

Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nm $Ti/8{\mu}m$ Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2001년도 춘계학술발표강연 및 논문개요집
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• pp.135-135
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• 2001

• 한국자기학회지
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• 제5권5호
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• pp.570-574
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• 1995

Magnetoresistance of NiFeCo/Cu/NiFeCo/FeMn uncoupled exchange biased sandwiches has been studied. The magnetoresistance change ratio, ${\Delta}R/R_{s}$ showed 4.1 % at a saturation field as low as 11 Oe in $Si/Ti(50\;{\AA})/NiFeCo(70\;{\AA})/Cu(23\;{\AA})/NiFeCo(70\;{\AA})/FeMn(150\;{\AA})/Cu(50\;{\AA})$ spin valve structure. In this system, the magnetoresistance was affected by interlayer material and thickness. When Ti and Cu were used as the interlayer material in this structure, maximum magnetoresistance change ratio were 0.32 % and 4.1 %, respectively. 6.1 % MR ratio was obtained in $Si/Ti(50\;{\AA})/NiFeCo(70\;{\AA})/Cu(15\;{\AA})/NiFeCo(70\;{\AA})/FeMn(150\;{\AA})/Cu(50\;{\AA})$ spin valve structure. The magnetoresistance change ratio decreased monotonically as the interlayer thickness increased. It was found that the exchange bias field exerted by FeMn layer to the adjacent NiFeCo layer was ~25 Oe, far smaller than that reported in NiFe/Cu/NiFe/FeMn spin valve structure(Dieny et. al., ~400 Oe). The relationship between the film texture and exchange anisotropy ha been examined for spin valve structures with Ti, Cu, or non-buffer layer.

• 열처리공학회지
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• 제12권2호
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• pp.145-156
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• 1999

The distribution of the second phase, the change of transformation temperature and mechanical properties with thermomechanical treatment conditions were investigated by metallography, calorimetry, EDS, tensile test and fractography in a Cu-Al-Ni-Ti-Mn alloy. The cast structure revealed Ti-rich precipitates($X_L$ phase) between dendrite arms, which have been identified as $(Cu,Ni)_2TiAl$ intermetallic compounds. By homogenizing above $900^{\circ}C$, the $X_L$ phase was melted in the matrix, while the Xs phase was precipitated in matrix and the volume fraction of it was increased. When hot-rolled specimen was betatized below $750^{\circ}C$, recrystallization could not be observed. However, the specimen betatized above $800^{\circ}C$ was recrystallized and the grain size was about $50{\mu}m$, while Xs phase was precipitated in matrix. With raising betatizing temperature, $M_s$ and $A_s$ temperatures were fallen and transformation hysteresis became larger. The strain of the specimen betatized at $800^{\circ}C$ was 8.2% as maximum value. The maximum shape recovery rate could be obtained in the specimen betatized at $800^{\circ}C$ but it was decreased due to the presence of Xs phase with increasing betatizing temperature.