• 한국전기전자재료학회논문지
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• 제14권12호
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• pp.1001-1007
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• 2001

In this study, high dielectric materials, (Pb,La)Ti $O_3$ thin films were fabricated by PLD (Pulsed Laser Deposition) method and investigated in terms of structural and electrical characteristics in order to develope the dielectric materials for the use of new capacitor layers of Giga bit-level DRAM. The deposition conditions were examined in order to fabricate uniform thin films through systematic changes of oxygen pressures and substrate temperature. The uniform thickness and smooth morphology of (P $b_{0.72}$L $a_{0.28}$)Ti $O_3$ thin films were obtained at the conditions of substrate-target distance 5.5[cm], laser energy density 2.1[J/$\textrm{cm}^2$], oxygen pressure 200[mTorr] and substrate temperature 500[$^{\circ}C$]. After the (P $b_{0.72}$L $a_{0.28}$)Ti $O_3$ thin films were fabricated under the above conditions, they were post-annealed by RTA process in order to increase the dielectric constant. The film thickness of 1200 [$\AA$] had dielectric constant 821. Assuming that operating voltage is 2V, leakage current density of (P $b_{0.72}$L $a_{0.28}$)Ti $O_3$ thin films would result into 10$^{-7}$ [A/$\textrm{cm}^2$] and satisfied the specification of 256M DRAM planar capacitor, 4$\times$10$^{-7}$ [A/$\textrm{cm}^2$]m}^2$]

• 열처리공학회지
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• 제4권4호
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• pp.1-14
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• 1991

In PECVD(Plasma-Enhanced Chemical Vapor Deposition) process, titanium nitride is thin and its adhesion is poor for the protective coatings. Therefore it has been studied that intermediate layer forms between substrate and TiN thin film. Using R.F. plasma nitriding, nitride layer was first formed, then TiN thin film coated by PECVD. The chemical composition of the coatings has been characterized using AES, EDS and their crystallographic structure by means of XRD. Mechanical properties such as microhardness and film adhesion have also been determined by vickers hardness test, scratch test and indentation test. As a result, there was no difference in chemical composition and structure between the TiN deposition only and the composite of TiN deposition on nitrided steel. It was found that nitrided substrate increased the hardness of TiN coatings and was beneficial in preventing the plastic deformation in the substrate. Therefore the effective load bearing capacity of the TiN coatings on nitrided steel was increased and their adhesion was improved as well. According to the results of this study, the processes that lead to the formation of composite layers characterized by good working properties, i.e., high microhardness, adhesion and resistance to deformation.

• 한국표면공학회지
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• 제54권3호
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• pp.133-138
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• 2021

Ternary Ti-X-N coatings, where X = Al, Si, Cr, O, etc., have been widely used for machining tools and cutting tools such as inserts, end-mills, and etc. Ti-Al-N-O coatings were deposited onto silicon wafer and WC-Co substrates by a cathodic arc evaporation (CAE) technique at various negative substrate bias voltages. In this study, the influence of substrate bias voltages during deposition on the microstructure and mechanical properties of Ti-Al-N-O coatings were systematically investigated to optimize the CAE deposition condition. Based on results from various analyses, the Ti-Al-N-O coatings prepared at substrate bias voltage of -80 V in the process exhibited excellent mechanical properties with a higher compressive residual stress. The Ti-Al-N-O (-80 V) coating exhibited the highest hardness around 30 GPa and elastic modulus around 303 GPa. The improvement of mechanical properties with optimized bias voltage of -80 V can be explained with the diminution of macroparticles, film densification and residual stress induced by ion bombardment effect. However, the increasing bias voltage above -80 V caused reduction in film deposition rate in the Ti-Al-N-O coatings due to re-sputtering and ion bombardment phenomenon.

• 한국재료학회지
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• 제2권2호
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• pp.110-118
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• 1992

형성방법이 다른 세종류의 TiN기판상에 CVD텅스텐막을 도포할 때의 W의 핵생성 양상을 비교조사하여 다음과 같은 결과를 얻었다. 반응성 스팟터법에 의하여 형성한 TiN과 $NH_3$분위기에서 RTP처리한 $SiH_4$환원에 의하여 CVD-W막을 증착할 때, 증착속도(deposition rate)는 sputtered TiN>RTP TiN>annealed TiN의 순서로 감소하며, W 핵생성에 대한 잠복기는 sputtered $TiN{\leq}RTP$ TiNTiO_{X}N_{Y}$로 바뀌기 때운에 그 위에서 W의 핵성성이 어려워지고, 증착속도도 낮아진 것이다. RTP-TiN의 미세한 결정립구조는 W의 핵성성과 성장에 유리한 효과를 미치지만, 그것의 높은 압축응력이 W의 핵생성과 성장에 미치는 불리한 효과가 더 크기 때문에, RTP-TiN 기판상에 W를 증착할 경우가 sputtered TiN 기판상에 W를 증착할 경우보다 증착속도가 더 낮고, 잠복기도 더 긴 것으로 사료된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 추계학술대회 논문집
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• pp.75-78
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• 1996

The deposition condition Gf TiN films as electrode was studied by sheet resistance, TiN depositon Thickness X-ray diffraction. TiN was made by reactively DC magnetron sputtering with varying $N_2$/Ar mixture gas and substrate temperature. After finding The deposition condition of TiN films, The samples with the structure of Cu/Ta$_2$O$_{5}$, TiN/Ta$_2$O$_{5}$Si, Cu/TiN/Ta$_2$O$_{5}$ Si were prepared and were measured I-V, C-V. As a results, it was found that when TiN was deposited in an $N_2$a results, it was found that when TiN was deposited in an $N_2$atmosphere its Sheet resistance is lower n than n V$_2$Ar mixtureixture

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2003년도 춘계총회 및 연구발표회 초록집
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• pp.110.2-110
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• 2003

• 한국재료학회지
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• 제4권8호
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• pp.861-869
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• 1994

Chemical vapor deposition using titanium tetra isopropoxide(TTIP) was employed to investigate effects of process parameters on the uniformity of $TiO_{2}$this films deposited on Indium Tin Oxide (ITO)coated glass. Deposition experiments were carried out at temperatures ranging from $300^{\circ}C$ to $400^{\circ}C$ under the pressure of 0.5~2 torrin a cold wall reactor which can handle 200mm substrate. It was found that the growth rate of $TiO_{2}$was closely related to the reaction temperature and the ractant gas compositions. Apparent activation energy for the deposition rate was 62.7lkJ/mol in the absence of $O_{2}$ and 100.4kj/mol in the presence of $O_{2}$, respectively. Homogeneous reactions in the gas phase were promoted when the total pressure of the reactor was increased. Variance in the film thickness was less than a few percent, but at high deposition rates film thickness was less uniform. Effects of reaction temperature on $TiO_{2}$ thin film characteristic was investigated with SEM, XRD and AES.

• 한국세라믹학회지
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• 제36권9호
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• pp.901-908
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• 1999

Effects of LPMOCVD process parameters on the properties of TiO2 thin film were investigated. Depositions were made in the range of temperature 300-67$0^{\circ}C$ with various TTIP(Titanium Tetraisopropoxide) concentrations by contrlling bubbler temperature(40-8$0^{\circ}C$) and/or flow rate(30-90 sccm). Post annealing treatments were carried out at 500-80$0^{\circ}C$ range in the air. Films deposited at 40$0^{\circ}C$ have denser morphology than those of films deposited at 50$0^{\circ}C$ and $600^{\circ}C$ due to slower deposition rate. Bubbler temperature can affect on the deposition rate in mass transfer controlled regime such as 50$0^{\circ}C$ or higher but not below 50$0^{\circ}C$ where surface reaction rate becomes important. On the contrary for films deposited above 50$0^{\circ}C$ flow rate can raise deposition rate but eventually saturate it at the 50 sccm and above due to retarded adhesion of decomposed species. But for films deposited at 40$0^{\circ}C$ deposition rate increases stadily with flow rate. As the film becomes more porous A(200) texture can not be developed and AnataselongrightarrowRutile transition kinetics increases.

• 한국레이저가공학회지
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• 제18권3호
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• pp.1-5
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• 2015

A 3D printer based on laser powder deposition (LPD), also known as DED (direct energy deposition), has been developed for fabricating metal parts. The printer uses a ytterbium fiber laser (1070nm, 1kW) and is equipped with an Ar purge chamber, a three-dimensional translation stage and a powder feeding system composed of a powder chamber and delivery nozzles. To demonstrate the performance of the printer, a tapered cylinder of 320mm in height has been fabricated successfully using Ti-6Al-4V powders. The process parameters including the laser output power, the scan speed, and the powder feeding rate have been optimized. A 3D printed test specimen shows mechanical properties (yield strength, ultimate tensile strength, and elongation) exceeding the criteria to employed in a variety of Ti alloy applications.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.239.1-239.1
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• 2011

Dye sensitized solar cells (DSC) are promising devices for inexpensive, nontoxic, transparent, and large-scale solar energy conversion. Generally thick $TiO_2$ nanoporous films act as efficient photoanodes with their large surface area for absorbing light. However, electron transport through nanoparticle networks causes the slowdown and the loss of electron transport because of a number of interparticle boundaries inside the conduction path. We have studied DSCs with precisely dimension-controlled $TiO_2$ nanotubes array as photoanode. $TiO_2$ nanotubes array is prepared by template-directed fabrication method with atomic layer deposition. Well-ordered nanotubes array provides not only large surface area for light absorbing but also direct pathway for electrons with minimalized grain boundaries. Large enlongated anatase grains in the nanotubes could enhance the conductivity of electrons, but also suppress the recombination with holes through defect sites during diffusion into the electrode. To study the effect of grain boundaries, we fabricated two kinds of nanotubes which have different grain sizes by controlling deposition conditions. And we studied electron conduction through two kinds of nanotubes with different grain structures. The solar cell performance was studied as a function of thickness and grain structures. And overall solar-to-electric energy conversion efficiencies of up to 7% were obtained.